中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

1118 records (took 0.037 seconds)

    Method for manufacturing capacitor-built in type ltcc substrate
    1.
    发明专利
    Method for manufacturing capacitor-built in type ltcc substrate 审中-公开
    在类型LTCC衬底中制造电容器的方法

    公开(公告)号：JP2010016410A

    公开(公告)日：2010-01-21

    申请号：JP2009240721

    申请日：2009-10-19

    Applicant: Samsung Electro Mech Co Ltd ,  三星電機株式会社

    Inventor： JEONG SEUNG GYO ,  CHOI YONG-SUK ,  HONG KI PYO

    IPC: H05K3/46

    CPC classification number: H01G4/30 ,  H01G4/232 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/30107 ,  H05K1/0231 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/186 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/09672 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a low temperature calcinated substrate where a capacitor of a high capacity composed of high permittivity ceramic is built in. SOLUTION: The method for manufacturing a capacitor built-in type LTCC substrate including a step of manufacturing a capacitor by calcinating a laminate where at least one high permittivity ceramic sheet is contained, a step of providing a plurality of low temperature calcination green sheets where a conductive pattern and/or a conductive via hole are formed, and a step of calcinating the LTCC laminate where the capacitor is built in a step of forming a LTCC laminate by laminating a plurality of the low temperature calcination green sheets so as to allow the capacitor connected to the adjacent conductive pattern or the conductive via hole in the green sheet to be built in that may be usefully applied to a multiform capacitor such as laminated chip capacitor structure or capacitor layer structure is provided. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种制造低容量煅烧基板的方法，其中内置高介电常数陶瓷的高容量电容器。解决方案：内置电容器的制造方法 LTCC基板包括通过煅烧包含至少一个高介电常数陶瓷片的层压体制造电容器的步骤，提供形成导电图案和/或导电通孔的多个低温煅烧生片的步骤， 以及在通过层叠多个低温煅烧生片以便使连接到相邻的导电图案或导电通孔的电容器的电容器形成LTCC层叠体的步骤中来煅烧所述LTCC层压体的步骤 内置的生片可以有效地应用于多层电容器，例如层叠片状电容器结构或电容器层结构i 提供。 版权所有（C）2010，JPO＆INPIT

    Multiple output transformer
    3.
    发明专利
    Multiple output transformer 审中-公开
    多路输出变压器

    公开(公告)号：JP2009246328A

    公开(公告)日：2009-10-22

    申请号：JP2008147098

    申请日：2008-06-04

    Applicant: Samsung Electro Mech Co Ltd ,  三星電機株式会社

    Inventor： PARK JUN-HYUNG ,  KIM JONG RAK

    IPC: H01F30/00

    CPC classification number: H01F27/325 ,  H01F30/04

    Abstract: PROBLEM TO BE SOLVED: To provide a multiple output transformer efficiently generating multiple outputs in accordance with electric characteristics using one transformer. SOLUTION: The multiple output transformer comprises: a primary bobbin 10 provided with one primary winding part 13 having one input terminal 17a and one ground terminal 17b; a secondary bobbin 11 provided with n (n: positive integer) secondary winding parts 14 having either of two output terminals 18a and 18b, and either of two output terminals 18c and 18d, respectively; a primary coil 15 wound around the one primary winding part 13; a secondary coil 16 wound around each of the n secondary winding parts 14; and a pair of cores 12 to be inserted respectively into an insertion hole provided inside the primary bobbin 10 and the secondary bobbin 11 so that the primary bobbin 10 and the secondary bobbin 11 are separated from each other. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供一个多输出变压器，使用一个变压器根据电气特性有效地产生多个输出。 多输出变压器包括：主线轴10，其具有一个初级绕组部分13，其具有一个输入端子17a和一个接地端子17b; 具有分别具有两个输出端子18a和18b以及两个输出端子18c和18d中的任一个的n（n：正整数）次级绕组部分14的次级绕线筒11; 缠绕在一个初级绕组部13上的初级线圈15; 缠绕在n个次级绕组部14上的次级线圈16; 以及分别插入设置在主线轴10和次级线轴11内的插入孔中的一对芯体12，使得主线轴10和次线轴11彼此分离。 版权所有（C）2010，JPO＆INPIT

    Electromagnetic band gap structure and printed-circuit board
    4.
    发明专利
    Electromagnetic band gap structure and printed-circuit board 有权
    电磁波带结构和印刷电路板

    公开(公告)号：JP2009231793A

    公开(公告)日：2009-10-08

    申请号：JP2008260017

    申请日：2008-10-06

    Applicant: Samsung Electro Mech Co Ltd ,  三星電機株式会社

    Inventor： KIM HAN ,  HAN MI-JA ,  JUNG HYO-JIC

    IPC: H01L23/12 ,  H05K3/46

    CPC classification number: H01P1/2005 ,  H01L2224/16 ,  H01P1/203 ,  H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

    Abstract: PROBLEM TO BE SOLVED: To provide an electromagnetic band gap structure and a printed circuit board. SOLUTION: A printed circuit board 100 includes three or more conductive plates; a first stitching via 645 for electrically connecting one conductive plate among the conductive plates with another conductive plate; and a second stitching via 649 for electrically connecting the one conductive plate among the conductive plates with yet another conductive plate. In the first stitching via, a part thereof electrically connects the one conductive plate with another conductive plate via one upper flat plane of one conductive plate, and in the second stitching via part thereof electrically connects the one conductive plate is electrically connected to yet another conductive plate via one lower flat plane of one conductive plate. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供电磁带隙结构和印刷电路板。 解决方案：印刷电路板100包括三个或更多个导电板; 第一缝合通孔645，用于将导电板中的一个导电板与另一个导电板电连接; 以及第二缝合通孔649，用于将导电板中的一个导电板与另一导电板电连接。 在第一缝合通孔中，其一部分通过一个导电板的一个上平面将一个导电板与另一个导电板电连接，并且在第二缝合经过其一部分电连接时，一个导电板电连接到另一个导电板 通过一个导电板的一个下平面平板。 版权所有（C）2010，JPO＆INPIT

    Laminated ceramic capacitor
    5.
    发明专利
    Laminated ceramic capacitor 审中-公开
    层压陶瓷电容器

    公开(公告)号：JP2009224569A

    公开(公告)日：2009-10-01

    申请号：JP2008067606

    申请日：2008-03-17

    Applicant: Samsung Electro Mech Co Ltd ,  三星電機株式会社

    Inventor： KIM DAE HWAN ,  SONG TAE HO ,  KIM HYOUNG-JOON ,  LEE SHUKO ,  LEE TETSUSHO

    IPC: H01G4/12 ,  H01G4/30

    Abstract: PROBLEM TO BE SOLVED: To provide a laminated ceramic capacitor capable of preventing a defect problem due to the oxidation of an internal electrode by performing a firing even under a reducing atmosphere in which the partial pressure of oxygen is controlled.
    SOLUTION: The laminated ceramic capacitor 40 includes: a sintered ceramic main part 41 having cover layers disposed on both faces as outermost layers and a plurality of ceramic layers laminated therebetween; first and second internal electrodes 42a, 42b formed on each of the plurality of ceramic layers and laminated alternatingly sandwiching one layer of the ceramic layers; first and second external electrode 45a, 45b formed on each outer face of the sintered ceramic main part 41 so as to be connected to the first and second internal electrode 42a, 42b; and electrode layers for preventing oxidation 44a, 44b which are formed between the cover layer and the ceramic layer neighboring thereto and do not contribute to an electrostatic capacitance.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 解决的问题：提供一种层叠陶瓷电容器，其能够即使在控制氧分压的还原气氛下也能够通过进行烧成来防止内部电极的氧化引起的缺陷问题。 层叠陶瓷电容器40包括：烧结陶瓷主体部41，其具有设置在两面上的最外层的覆盖层和层叠在其间的多个陶瓷层; 形成在所述多个陶瓷层中的每一个上的第一和第二内部电极42a，42b，并层叠交替地夹着一层所述陶瓷层; 第一和第二外部电极45a，45b形成在烧结陶瓷主体部分41的每个外表面上，以连接到第一和第二内部电极42a，42b; 以及用于防止形成在覆盖层和与其相邻的陶瓷层之间的氧化的电极层44a，44b，并且不会对静电电容有贡献。 版权所有（C）2010，JPO＆INPIT

    Led lighting device and heat dissipating member of led lighting device
    6.
    发明专利
    Led lighting device and heat dissipating member of led lighting device 有权
    LED照明装置的LED照明装置和散热构件

    公开(公告)号：JP2009218193A

    公开(公告)日：2009-09-24

    申请号：JP2008127249

    申请日：2008-05-14

    Applicant: Samsung Electro Mech Co Ltd ,  三星電機株式会社

    Inventor： GHIM JOONG EL ,  LEE KYUNG HO

    IPC: F21V29/02 ,  F21Y101/02

    CPC classification number: F21V29/51 ,  F21K9/00 ,  F21V29/004 ,  F21V29/006 ,  F21V29/2212 ,  F21V29/74 ,  F21V29/75 ,  F21V29/83 ,  F21V29/89 ,  F21Y2115/10

    Abstract: PROBLEM TO BE SOLVED: To provide a heat dissipating member of an LED lighting device and an LED lighting device using the same. SOLUTION: The LED lighting device 100 includes a printed circuit board 120 with LED chips 110 mounted, and a heat dissipating member 130 fitted at a rear face of the printed circuit board 120. The heat dissipating member 130 includes a heat dissipating pipe 131 perpendicularly fitted from the center of the printed circuit board 120, heat dissipating fins 133 fitted to the printed circuit board 120 at a constant interval so as to surround the heat dissipating pipe, heat dissipating discs 135 fitted at a lower part of the heat dissipating fins 133 and arranged along the heat dissipating pipe 131 at a constant interval, and a heat dissipating member case 137 covering the heat dissipating member. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种LED照明装置的散热构件和使用其的LED照明装置。 解决方案：LED照明装置100包括安装有LED芯片110的印刷电路板120和装配在印刷电路板120的背面的散热构件130.散热构件130包括散热管 131从印刷电路板120的中心垂直地安装，散热片133以恒定的间隔安装在印刷电路板120上，以围绕散热管，散热片135安装在散热的下部 翅片133，并且沿着散热管131以一定的间隔布置，并且覆盖散热构件的散热构件壳体137。 版权所有（C）2009，JPO＆INPIT

    Semiconductor device and method of manufacturing the same
    9.
    发明专利
    Semiconductor device and method of manufacturing the same 审中-公开
    半导体器件及其制造方法

    公开(公告)号：JP2009158908A

    公开(公告)日：2009-07-16

    申请号：JP2008145933

    申请日：2008-06-03

    Applicant: Samsung Electro Mech Co Ltd ,  三星電機株式会社

    Inventor： KWEON YOUNG DO ,  LEE JAE KWANG ,  BAEK JONG HWAN ,  JEON HYUNG JIN ,  YUAN JINGLI

    IPC: H01L23/12 ,  H01L21/3205 ,  H01L23/52

    CPC classification number: H01L24/11 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/05599 ,  H01L2224/05099

    Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device which can minimize damage to a solder bump caused by a difference in thermal expansion coefficient thereby having enhanced reliability and achieves the simplification of a manufacturing process thereby achieving reduction in manufacturing cost and enhancement in productivity. SOLUTION: The semiconductor device is provided which includes: a wafer 110 having an electrode pad 120; an insulation layer 130 that is formed on the wafer 110 and has an exposure hole 131 exposing the electrode pad 120; a redistribution layer 140 that is formed on the exposure hole 131 of the insulation layer 130 and the insulation layer 130 and has one end connected to the electrode pad 120; a conductive post 150 that is formed at the other end of the redistribution layer 140; an encapsulation layer 160 that is formed on the redistribution layer 140 and the insulation layer 130 so that the upper end of the conductive post 150 is exposed; and a solder bump 170 that is formed on the exposed upper portion of the conducive post 150. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种半导体器件，其可以最小化由热膨胀系数的差异引起的对焊料凸起的损害，从而具有增强的可靠性并且实现制造工艺的简化，从而实现制造成本的降低和增强 生产率。 解决方案：提供半导体器件，其包括：具有电极焊盘120的晶片110; 形成在晶片110上并具有露出电极焊盘120的曝光孔131的绝缘层130; 形成在绝缘层130的曝光孔131和绝缘层130上并且一端连接到电极焊盘120的再分布层140; 在再分布层140的另一端形成的导电柱150; 在再分布层140和绝缘层130上形成的封装层160，使得导电柱150的上端露出; 以及形成在导电柱150的暴露的上部上的焊料凸块170.版权所有（C）2009，JPO＆INPIT

    Gallium nitride-based light emitting element with led for protecting esd and its manufacturing method
    10.
    发明专利
    Gallium nitride-based light emitting element with led for protecting esd and its manufacturing method 审中-公开
    基于氮化镓的LED发光元件，用于保护ESD及其制造方法

    公开(公告)号：JP2009152637A

    公开(公告)日：2009-07-09

    申请号：JP2009089385

    申请日：2009-04-01

    Applicant: Samsung Electro Mech Co Ltd ,  三星電機株式会社

    Inventor： SHIN HYUN-SOO ,  KIM HYUN KYUNG ,  PYEON IN JOON ,  KIM CHANG WAN

    IPC: H01L33/08 ,  H01L33/32 ,  H01L33/42

    CPC classification number: H01L27/15 ,  H01L33/32

    Abstract: PROBLEM TO BE SOLVED: To provide a gallium nitride-based light emitting element with high resistance against reverse directional ESD voltage and provide its manufacturing method. SOLUTION: The gallium nitride-based light emitting element includes a substrate; a main GaN-based LED formed in a first region on the substrate and having a first p side electrode and a first n side electrode; and an ESD protecting GaN-based LED formed in a second region of the substrate and having a second p side electrode and a second n side electrode. The first region and the second region are separated from each other by an element separation region. The first p side electrode is connected electrically with the second n side electrode, while the first n side electrode is connected electrically with the second p side electrode. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供对反向ESD电压具有高电阻的氮化镓基发光元件并提供其制造方法。 解决方案：氮化镓系发光元件包括基板; 形成在基板上的第一区域中的具有第一p侧电极和第一n侧电极的主GaN基LED; 以及形成在所述基板的第二区域中并具有第二p侧电极和第二n侧电极的ESD保护GaN基LED。 第一区域和第二区域通过元件分离区域彼此分离。 第一p侧电极与第二n侧电极电连接，而第一n侧电极与第二p侧电极电连接。 版权所有（C）2009，JPO＆INPIT

Patent Agency Ranking