公开(公告)号：JP4158714B2

公开(公告)日：2008-10-01

申请号：JP2004030346

申请日：2004-02-06

Applicant: 松下電器産業株式会社

Inventor： 法人 塚原 ,  正浩 小野 ,  郁久 後藤 ,  大輔 櫻井 ,  和宏 西川

IPC: H05K3/32 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01L24/96 ,  H01L21/568 ,  H01L23/3135 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a small and thin electronic component mounted board wherein, when a plurality of electronic components are mounted to be buried in a resin layer at high density, the components can be mounted while connection positions with a conductor circuit pattern are not deviated, and to provide a method for manufacturing the board. SOLUTION: In the method, a plurality of electronic components 100 are pressed into a thin first resin substrate 110 smaller than the height of the component 100 to be thereby arranged at predetermined positions without being deviated therefrom. Thereafter, the electronic components 100 are buried with a second resin substrate 120, or the components 100 are fitted in recesses formed in a support jig and buried into the resin substrate. Consequently, the plurality of electronic components 100 are mounted at high density in the form of a small-size and a thin dimension without deviations in their connection positions with a predetermined conductor circuit pattern 104. COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP4114576B2

公开(公告)日：2008-07-09

申请号：JP2003321371

申请日：2003-09-12

Applicant: 松下電器産業株式会社

Inventor： 法人 塚原 ,  大輔 櫻井 ,  和宏 西川

IPC: H05K3/46

公开(公告)号：JPWO2006027981A1

公开(公告)日：2008-05-08

申请号：JP2006535695

申请日：2005-08-31

Applicant: 松下電器産業株式会社

Inventor： 大輔 櫻井 ,  大輔 櫻井 ,  正浩 小野 ,  正浩 小野 ,  西川　和宏 ,  和宏 西川

IPC: H01L25/10 ,  H01L25/065 ,  H01L25/07 ,  H01L25/11 ,  H01L25/18

CPC classification number: H01L25/18 ,  G11C5/04 ,  H01L23/5386 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/92 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/15331 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4614

Abstract: 立体的電子回路装置(100)は、接続端子(120)、制御回路(130)および第1の配線パターン(140)を備えた筐体(150)に、電子部品(190)を埋設した第1の樹脂シートからなる基板モジュールを積層した構成の基板モジュールユニットを嵌め込み、電気的、機械的に接続した構造を有する。この立体的電子回路装置(100)により、マザー基板が不要になる。さらに、基板モジュールの薄型化により、限られた実装空間に多くの基板モジュールを積層した基板モジュールユニットを搭載できるため、記憶容量の増大と高機能化を実現できる。

公开(公告)号：JP3985791B2

公开(公告)日：2007-10-03

申请号：JP2004034687

申请日：2004-02-12

Applicant: 松下電器産業株式会社

Inventor： 新一 佐藤 ,  邦泰 内山 ,  博 荒島 ,  義和 西原 ,  和宏 西川

IPC: F24F11/02 ,  F24F13/22

Abstract: PROBLEM TO BE SOLVED: To provide an air conditioner capable of significantly reducing the amount of remaining drain water of a water receptor, and capable of preventing generation of slime and water leakage. SOLUTION: A first drain pump 1 is provided for discharging drain water accumulated in the water receptor 3 to the outside, and a second drain pump 2 is provided lower than the first drain pump for discharging to the outside the drain water remaining in the water receptor that could not be discharged to the outside by the first drain pump. By operating the first drain pump and the second drain pump a predetermined time right after operation stoppage of the air conditioner and every time a predetermined time passes after stoppage, the remaining water of the water receptor can be eliminated. COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP4186756B2

公开(公告)日：2008-11-26

申请号：JP2003306666

申请日：2003-08-29

Applicant: 松下電器産業株式会社

Inventor： 法人 塚原 ,  大輔 櫻井 ,  和宏 西川

IPC: H05K1/18 ,  H01L21/48 ,  H01L21/60 ,  H01L23/12 ,  H01L23/482 ,  H01L23/538 ,  H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/46

CPC classification number: H05K1/185 ,  H01L21/4846 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/10674 ,  H05K2203/1189 ,  Y10T29/4913 ,  H01L2224/82 ,  H01L2924/00

Abstract: Apply heat to thermoplastic resin film, which is eventually to become an insulating resin layer, and press the film against a mold for forming grooves on a surface of the film. Next, press-fit an electronic component into the resin film from a back-face of the film, thereby exposing electrodes of the component from a bottom of the grooves. Then cool the film for curing. Peel the film off the mold, then fill the grooves with conductive paste, and cure the paste for forming circuit patterns. The foregoing procedure allows bringing the electrodes positively into conduction with the circuit patterns of a circuit board incorporating the electronic component, and achieving a narrower pitch between routings of the circuit patterns.

公开(公告)号：JP4151541B2

公开(公告)日：2008-09-17

申请号：JP2003335268

申请日：2003-09-26

Applicant: 松下電器産業株式会社

Inventor： 法人 塚原 ,  大輔 櫻井 ,  和宏 西川

IPC: H05K1/09 ,  H05K3/12 ,  H01B5/14 ,  H05K3/24

CPC classification number: H05K3/247 ,  H01L2924/0002 ,  H05K1/095 ,  H05K2201/0266 ,  H05K2201/035 ,  H01L2924/00

公开(公告)号：JP4036176B2

公开(公告)日：2008-01-23

申请号：JP2003343019

申请日：2003-10-01

Applicant: 松下電器産業株式会社

Inventor： 法人 塚原 ,  和宏 西川

IPC: H05K1/09 ,  H05K3/24

公开(公告)号：JP3584936B2

公开(公告)日：2004-11-04

申请号：JP2003370410

申请日：2003-10-30

Applicant: 松下電器産業株式会社

Inventor： 博澄 伊藤 ,  富康 栂村 ,  徳哉 浅田 ,  和宏 西川

IPC: A61M16/10 ,  B01D53/22 ,  F24F1/00 ,  F24F11/02

Abstract: PROBLEM TO BE SOLVED: To provide a gas enriching device capable of stably securing a desirable supply quantity of the enriched air by considering temperature characteristic of a permeation membrane of a gas enriching device. SOLUTION: This gas enriching device is provided with an oxygen enrichment membrane 2a as a selective gas permeation membrane for selectively permeating a specified gas, a variable capacity pump 3 for generating a pressure difference on a side for permeating the specified gas to carry the oxygen-enriched air, and a temperature detecting sensor 5 for detecting temperature near the oxygen enrichment membrane. Operation capacity of the pump 3 can be changed on the basis of the temperature detected by the temperature detecting sensor 5. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP3514211B2

公开(公告)日：2004-03-31

申请号：JP2000127482

申请日：2000-04-27

Applicant: 松下電器産業株式会社

Inventor： 康裕 中村 ,  広治 栗須谷 ,  健二 白井 ,  和宏 西川

IPC: F24F13/32

公开(公告)号：JP4186843B2

公开(公告)日：2008-11-26

申请号：JP2004058436

申请日：2004-03-03

Applicant: 松下電器産業株式会社

Inventor： 正浩 小野 ,  和宏 西川 ,  繁 近藤

IPC: H05K1/02 ,  H05K9/00 ,  H01L23/00 ,  H05K1/14 ,  H05K1/18

CPC classification number: H01L2224/16225 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/3025