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    Wiring circuit board and fuel cell
    8.
    发明专利
    Wiring circuit board and fuel cell 审中-公开
    接线电路板和燃料电池

    公开(公告)号：JP2008300238A

    公开(公告)日：2008-12-11

    申请号：JP2007145953

    申请日：2007-05-31

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： YAMAZAKI HIROSHI ,  SUEYOSHI HIROKI

    IPC: H01M8/02 ,  H01M8/10

    CPC classification number: H05K3/249 ,  H01M8/0206 ,  H01M8/0221 ,  H01M8/0228 ,  H01M8/04201 ,  H01M8/1011 ,  H01M8/1097 ,  H05K1/0272 ,  H05K1/16 ,  H05K3/06 ,  H05K2201/035 ,  H05K2201/056 ,  Y02E60/523

    Abstract: PROBLEM TO BE SOLVED: To provide a wiring circuit board in which corrosion of a conductor layer is prevented, and a fuel cell equipped with it.
    SOLUTION: An FPC board 1 is equipped with a base insulating layer 2 composed of for example polyimide. The conductor layer 3 composed of for example copper is formed on one face of the base insulating layer 2. The conductor layer 3 is composed of a pair of a rectangular current collecting parts 3a, 3b and extraction conductor parts 4a, 4b extended in a long length shape from the current collecting parts 3a, 3b. Covering layers 6a, 6b are formed on the base insulating layer 2 so as to cover the conductor layer 3. The covering layer 6a is formed so as to cover the current collecting part 3a and the extraction conductor part 4a of the conductor layer 3, and the covering layer 6b is formed so as to cover the current collecting part 3b and the extraction conductor part 4b of the conductor 3. The covering layers 6a, 6b is composed of a resin composition containing carbon.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供防止导体层腐蚀的布线电路板和配备有导体层的燃料电池。 解决方案：FPC基板1配备有由例如聚酰亚胺构成的基底绝缘层2。 由例如铜构成的导体层3形成在基极绝缘层2的一个面上。导体层3由一对矩形集电部分3a，3b和延长延伸的引出导体部分4a，4b组成 来自集电部3a，3b的长度形状。 覆盖层6a，6b形成在基底绝缘层2上以覆盖导体层3.覆盖层6a形成为覆盖导体层3的集电部分3a和提取导体部分4a，并且 覆盖层6b形成为覆盖导体3的集电部3b和引出导体部4b。覆盖层6a，6b由含有碳的树脂组合物构成。 版权所有（C）2009，JPO＆INPIT

    Electronic component packaging system and electronic component packaging method
    10.
    发明专利
    Electronic component packaging system and electronic component packaging method 有权
    电子元件包装系统和电子元件包装方法

    公开(公告)号：JP2008066626A

    公开(公告)日：2008-03-21

    申请号：JP2006245229

    申请日：2006-09-11

    Applicant: Matsushita Electric Ind Co Ltd ,  松下電器産業株式会社

    Inventor： OKAMOTO KAZUO ,  NISHI SHOICHI ,  MORITA TAKESHI ,  HIYOSHI MASAYOSHI ,  TOMOYASU KAZUHIKO

    IPC: H05K3/34 ,  H05K13/04

    CPC classification number: H05K3/3484 ,  H01L2224/81 ,  H05K3/1216 ,  H05K3/3436 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2203/0338 ,  H05K2203/163 ,  Y02P70/613

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic component packaging system and an electronic component packaging method in which packaging quality can be ensured in case of a such a substrate as the amount of solder is deficient owing to poor printing. SOLUTION: In a packaging system comprising a device for measuring the height of solder paste printed on an electrode and an electronic component mounting device, a decision is made whether the height of a solder paste is correct or not based on the measurement of the height of solder paste printed on the electrode, a decision is further made whether transfer of solder paste to the solder bump is required or not based on the judgment results, and the paste is transferred to an electronic component held on a mounting head if it is required. Consequently, a proper amount of solder is added in case of such a substrate as the amount of solder is deficient owing to poor printing, and packaging quality can be ensured. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种电子部件包装系统和电子部件包装方法，其中在由于打印不良而导致的焊料量不足的情况下可以确保包装质量。 解决方案：在包括用于测量印刷在电极上的焊膏的高度的装置和电子部件安装装置的包装系统中，基于测量值来确定焊膏的高度是否正确 印刷在电极上的焊膏的高度，进一步决定是否需要根据判断结果将焊膏传递到焊料凸块，并且如果糊状物被传送到保持在安装头上的电子部件 是必须的。 因此，由于印刷不良，在焊料量不足的基板的情况下，添加适量的焊料，能够确保包装质量。 版权所有（C）2008，JPO＆INPIT

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