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    Ground via reinforcing preamplifier heat release in the hard disk drive
    2.
    发明专利
    Ground via reinforcing preamplifier heat release in the hard disk drive 有权

    公开(公告)号：JP5271557B2

    公开(公告)日：2013-08-21

    申请号：JP2008026940

    申请日：2008-02-06

    Applicant: 日東電工株式会社

    Inventor： カヤバン アレックス ,  ホゥ スズゥー−ハン ,  恭也 大薮 ,  ジョン マッカスリン マーティン

    IPC: H05K1/02

    CPC classification number: G11B33/1426 ,  G11B33/123 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/189 ,  H05K2201/09509 ,  H05K2201/09554

    Abstract: Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions. The first portion protrudes through the at least one via in the insulating layer to thermally couple with the stiffener and the second portion is disposed over the insulating layer, such that the second portion can be thermally coupled to the preamp.

    Wiring circuit substrate
    3.
    发明专利
    Wiring circuit substrate 有权
    接线电路

    公开(公告)号：JP2013114708A

    公开(公告)日：2013-06-10

    申请号：JP2011258865

    申请日：2011-11-28

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： ISHII ATSUSHI

    IPC: G11B5/60 ,  G11B21/21 ,  H05K1/05

    CPC classification number: H05K1/115 ,  G11B5/484 ,  G11B5/486 ,  G11B5/4873 ,  H05K1/056 ,  H05K1/118 ,  H05K3/40 ,  H05K2201/0394 ,  H05K2201/09554

    Abstract: PROBLEM TO BE SOLVED: To provide a wiring circuit substrate capable of improving electrical connection reliability between an electron element and a conductor layer.SOLUTION: A circuit-equipped suspension substrate 3 comprises: a base insulation layer 28 that includes a first base upper aperture 37 and a second base aperture 61 which are arranged at a distance from each other and penetrate in a thickness direction; a conductor layer 19 that comprises a piezo-side terminal 40 which overlaps the first upper aperture 37 at the time of projection in the thickness direction, comprises a power supply wire 25B which has one end part 62 overlapping the second base aperture 61 and extends to the piezo-side terminal 40, and is formed on the base insulation layer 28; a metal pedestal part 60 that is formed under the base insulation layer 28, is arranged around the first base upper aperture 37 which overlaps the second base aperture 61 at the time projection in the thickness direction, and supports a piezo element 5; and a conduction part 64 that is filled in the second base aperture 61 and electrically connects the power supply wire 25B and the metal pedestal part 60.

    Abstract translation: 解决的问题：提供能够提高电子元件与导体层之间的电连接可靠性的布线电路基板。 解决方案：具有电路的悬置基板3包括：基底绝缘层28，其包括彼此一定距离并且沿厚度方向穿透的第一基底上孔37和第二基孔61; 包括在厚度方向上突出时与第一上孔37重叠的压电端子40的导体层19包括：电源线25B，其具有与第二基座孔61重叠的一个端部62，并延伸到 压电侧端子40，并形成在基底绝缘层28上; 形成在基底绝缘层28下方的金属基座部60配置在第一基底上孔37周围，第一基底上孔37在厚度方向上的时间突出部与第二基底孔61重叠，并且支撑压电元件5; 以及填充在第二基座孔61中的导电部64，并且电连接电源线25B和金属基座部60.版权所有（C）2013，JPO＆INPIT

    Suspension board with circuit
    6.
    发明专利
    Suspension board with circuit 有权
    悬挂板与电路

    公开(公告)号：JP2009104712A

    公开(公告)日：2009-05-14

    申请号：JP2007275536

    申请日：2007-10-23

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： IGUCHI HIROTOSHI ,  OSAWA TETSUYA

    IPC: G11B5/60 ,  G11B21/21

    CPC classification number: H05K3/303 ,  G11B5/486 ,  H05K1/056 ,  H05K2201/09554 ,  H05K2201/09781 ,  H05K2201/10727 ,  H05K2201/2036 ,  Y02P70/613

    Abstract: PROBLEM TO BE SOLVED: To provide a suspension board with circuit, to support a slider in a stable attitude and maintain steady flying attitude (angle) of the slider. SOLUTION: The suspension board 1 with circuit includes three pedestals 12 arranged in mutually spaced apart at the slider mounting section 11 in order to support the slider 23 mounting the magnetic head 25. The slider 23 can be supported at 3 points by using three pedestals 12 on this suspension board 1. Thus, the slider 23 can be supported in a stable attitude. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供具有电路的悬挂板，以稳定的姿态支撑滑块并保持滑块的稳定的飞行姿态（角度）。 解决方案：具有电路的悬架板1包括在滑块安装部分11处彼此间隔开地布置的三个基座12，以便支撑安装磁头25的滑块23.滑块23可以通过使用 三个基座12。因此，滑块23可以以稳定的姿态被支撑。 版权所有（C）2009，JPO＆INPIT

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