Abstract:
An integrated circuit includes a first diffusion area for a first type transistor. The first type transistor includes a first drain region and a first source region. A second diffusion area for a second type transistor is separated from the first diffusion area. The second type transistor includes a second drain region and a second source region. A gate electrode continuously extends across the first diffusion area and the second diffusion area in a routing direction. A first metallic structure is electrically coupled with the first source region. A second metallic structure is electrically coupled with the second drain region. A third metallic structure is disposed over and electrically coupled with the first and second metallic structures. A width of the first metallic structure is substantially equal to or larger than a width of the third metallic structure.
Abstract:
A T-shaped gate structure and method for forming the same the method including providing a semiconductor substrate comprising at least one overlying sacrificial layer; lithographically patterning a resist layer overlying the at least one sacrificial layer for etching an opening; forming the etched opening through a thickness of the at least one sacrificial layer to expose the semiconductor substrate, said etched opening comprising a tapered cross section having a wider upper portion compared to a bottom portion; and, backfilling the etched opening with a gate electrode material to form a gate structure.
Abstract:
A frequency jitter generator and a frequency jitter PWM controller are provided for overcoming the shortcoming that a conventional PWM controller reduces the electromagnetic interference issue by means of varying the operating frequency of the PWM controller based on an input voltage, while resulting in the uncertainty of the range of frequency jitter and the difficulty circuit design due to the effect of the input voltage and the load. The frequency jitter generator and PWM controller adjust the range of frequency jitter by using a signal within a fixed voltage range. The invention not only gets rid of the effect of the input voltage and the loading, but also simplifies the circuit design by fixing the range of frequency jitter no greater than a predetermined percentage regardless of the operating frequency of the PWM controller.
Abstract:
A memory device comprises a first memory cell and a second memory cell. The first memory cell includes a first transistor coupled to a bit line and the second memory cell includes a second transistor coupled to a bit line bar. The first transistor includes a first gate terminal coupled to a first word line. The second transistor includes a second gate terminal coupled to a second word line. The first transistor and the second transistor are controlled by the first word line and the second word line respectively. A first sense amplifier having an asymmetric configuration is coupled to the bit line and the bit line bar and is capable to sense a status of at least one of the bit line and the bit line bar.
Abstract:
A method to reduce the inverse narrow width effect in NMOS transistors is described. An oxide liner is deposited in a shallow trench that is formed to isolate active areas in a substrate. A photoresist plug is formed in the shallow trench and is recessed below the top of the substrate to expose the top portion of the oxide liner. An angled indium implant through the oxide liner into the substrate is then performed. The plug is removed and an insulator is deposited to fill the trenches. After planarization and wet etch steps, formation of a gate dielectric layer and a patterned gate layer, the NMOS transistor exhibits an improved Vt roll-off of 40 to 45 mVolts for both long and short channels. The improvement is achieved with no degradation in junction or isolation performance. The indium implant dose and angle may be varied to provide flexibility to the process.
Abstract:
A method and an architecture for accessing hardware devices in a computer system and the chipset thereof are provided. A bi-directional two-wired serial interface, for instance, a system management bus (SMB), is configured to connect an I/O device, such as a local area network adapter, to a system controller such as a southbridge or a northbridge chipset. The I/O device which includes a SMB master controller serves as a SMB master device for generating a clock signal and transmitting a data signal defined by the SMB protocol to the system controller according to the clock signal. The system controller which includes a PCI master and a SMB slave controller serves as a SMB slave device for receiving commands and data bytes in the data signal from the SMB master device to drive the PCI master to access the register block of peripherals and system memory of the computer system.
Abstract:
Dynamic Random Access Memory (DRAM) cells are formed in a P well formed in a biased deep N well (DNW). PMOS transistors are formed in N wells. The NMOS channels stop implant mask is modified not to be a reverse of the N well mask in order to block the channels stop implant from an N+ contact region used for DNW biasing. In DRAMs and other integrated circuits, a minimal spacing requirement between a well of an integrated circuit on the one hand and adjacent circuitry on the other hand is eliminated by laying out the adjacent circuitry so that the well is located adjacent to a transistor having an electrode connected to the same voltage as the voltage that biases the well. For example, in DRAMs, the minimal spacing requirement between the DNW and the read/write circuitry is eliminated by locating the DNW next to a transistor precharging the bit lines before memory accesses. One electrode of the transistor is connected to a precharge voltage. This electrode overlaps the DNW which is biased to the same precharge voltage. This electrode provides the DNW N+ contact region.
Abstract:
An MOSFET device is fabricated with a plurality of conductors capacitively coupled to a first electrode, forming a mask on the surface of the first electrode exposing a predetermined zone of the first electrode, doping the first electrode through the mask, removing the mask from the surface of the first electrode, oxidizing the first electrode to form a layer of oxide over the first electrode with a thicker layer of oxide over the predetermined zone and a thinner layer of oxide elsewhere, forming at least one electrode over the first electrode on the thinner layer of oxide outside of the zone and forming at least one other electrode over the first electrode on the thicker layer of oxide inside the zone, whereby the one electrode and the other electrode have substantially different capacitive coupling to the electrode.
Abstract:
A method of forming a semiconductor structure includes providing a substrate including a fin at a surface of the substrate, and forming a fin field-effect transistor (FinFET), which further includes forming a gate stack on the fin; forming a thin spacer on a sidewall of the gate stack; and epitaxially growing a epitaxy region starting from the fin. After the step of epitaxially growing the epitaxy region, a main spacer is formed on an outer edge of the thin spacer. After the step of forming the main spacer, a deep source/drain implantation is performed to form a deep source/drain region for the FinFET.
Abstract:
A method of forming an integrated circuit includes forming a gate structure over a substrate. Portions of the substrate are removed to form recesses adjacent to the gate structure. A dopant-rich layer having first type dopants is formed on a sidewall and a bottom of each of the recesses. A silicon-containing material structure is formed in each of the recesses. The silicon-containing material structure has second type dopants. The second type dopants are opposite to the first type dopants.