公开(公告)号：US20060005549A1

公开(公告)日：2006-01-12

申请号：US11222793

申请日：2005-09-12

申请人： Minoru Ishinabe ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Hiroaki Date ,  Wataru Tanaka

发明人： Minoru Ishinabe ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Hiroaki Date ,  Wataru Tanaka

IPC分类号： F28D15/00 ,  F25B21/02

CPC分类号： F25B21/02 ,  F25B2321/0212 ,  F28D15/00 ,  F28D15/0266 ,  F28F3/12 ,  F28F2210/02 ,  G06F1/1607 ,  G06F1/20 ,  G06F1/203 ,  G06F2200/1612 ,  G06F2200/1631 ,  G06F2200/201 ,  G06F2200/203 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling structure for electronic equipment is designed for cooling a heat-generating body (2a) disposed inside a case (20) by recovering heat generated by the heat-generating body (2a) and dissipating the heat to the outside of the case (20). The cooling structure includes a heat-receiving section (4) for recovering heat generated in the heat-generating body (2a), a thermally insulated space (6) provided with an air inflow orifice (42a) and an air outflow orifice (42b) and thermally insulated from the heat-generating body (2a) and heat-receiving section (4) by a thermally insulating member (40), a heat-dissipating section (7) provided inside the thermally insulated space (6), a heat transfer member (5) for transferring the heat recovered in the heat-receiving section (4) to the heat-dissipating section (7), and a fan (22) for generating forcibly an air flow in the thermally insulated space (6). The heat generated by the heat-generating body (2a) is transferred to the heat-dissipating section (7) via the heat-receiving section (4) and heat transfer member (5) and dissipated in a concentrated fashion by using the fan (22) inside the thermally insulated space (6).

摘要翻译： 电子设备的冷却结构被设计用于通过回收由发热体（2a）产生的热并将热量散发到壳体的外部来冷却设置在壳体（20）内部的发热体（2a） （20）。 冷却结构包括用于回收在发热体（2a）中产生的热的热接收部分（4），设置有空气流入孔（42a）和空气流出孔 42b），并且通过隔热构件（40）与设置在隔热空间（6）内部的散热部（7）与发热体（2a）和受热部（4）热绝缘， 用于将在受热部分（4）中回收的热量传递到散热部分（7）的传热部件（5）和用于在绝热空间（6）中强制产生空气流的风扇（22） ）。 由发热体（2a）产生的热量经由受热部（4）和传热部件（5）传递到散热部（7），并且通过使用风扇（ 22）在隔热空间（6）内。

公开(公告)号：US07155914B2

公开(公告)日：2007-01-02

申请号：US11222793

申请日：2005-09-12

申请人： Minoru Ishinabe ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Hiroaki Date ,  Wataru Tanaka

发明人： Minoru Ishinabe ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Hiroaki Date ,  Wataru Tanaka

IPC分类号： F25D23/12

CPC分类号： F25B21/02 ,  F25B2321/0212 ,  F28D15/00 ,  F28D15/0266 ,  F28F3/12 ,  F28F2210/02 ,  G06F1/1607 ,  G06F1/20 ,  G06F1/203 ,  G06F2200/1612 ,  G06F2200/1631 ,  G06F2200/201 ,  G06F2200/203 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling structure for electronic equipment is designed for cooling a heat-generating body (2a) disposed inside a case (20) by recovering heat generated by the heat-generating body (2a) and dissipating the heat to the outside of the case (20). The cooling structure includes a heat-receiving section (4) for recovering heat generated in the heat-generating body (2a), a thermally insulated space (6) provided with an air inflow orifice (42a) and an air outflow orifice (42b) and thermally insulated from the heat-generating body (2a) and heat-receiving section (4) by a thermally insulating member (40), a heat-dissipating section (7) provided inside the thermally insulated space (6), a heat transfer member (5) for transferring the heat recovered in the heat-receiving section (4) to the heat-dissipating section (7), and a fan (22) for generating forcibly an air flow in the thermally insulated space (6). The heat generated by the heat-generating body (2a) is transferred to the heat-dissipating section (7) via the heat-receiving section (4) and heat transfer member (5) and dissipated in a concentrated fashion by using the fan (22) inside the thermally insulated space (6).

摘要翻译： 电子设备的冷却结构被设计用于通过回收由发热体（2a）产生的热并将热量散发到壳体的外部来冷却设置在壳体（20）内部的发热体（2a） （20）。 冷却结构包括用于回收在发热体（2a）中产生的热的热接收部分（4），设置有空气流入孔（42a）和空气流出孔 42b），并且通过隔热构件（40）与发热体（2a）和热接收部分（4）热绝缘，设置在隔热空间（6）内部的散热部分（7） ，用于将在所述受热部（4）中回收的热量传递到所述散热部（7）的传热部件（5），以及用于在所述绝热空间（12）中强制产生空气流的风扇（22） 6）。 由发热体（2a）产生的热量经由受热部（4）和传热部件（5）传递到散热部（7），并且通过使用风扇 （22）在隔热空间（6）内。

公开(公告)号：US20060065970A1

公开(公告)日：2006-03-30

申请号：US11020245

申请日：2004-12-27

申请人： Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Hiroaki Date ,  Jun Taniguchi

发明人： Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Hiroaki Date ,  Jun Taniguchi

IPC分类号： H01L23/053

CPC分类号： H01L23/373 ,  H01L21/4882 ,  H01L2924/0002 ,  H01L2924/00

摘要： A plurality of carbon fibers having a surface having a metal-plated layer (Cu-plated layer) are stood vertically on a flat plate-like provisional substrate by electrostatic flocking, and one end of the carbon fibers is provisionally adhered to the provisional substrate with an adhesive. The other end of the carbon fibers which is not provisionally adhered is contacted with a substrate (Cu plate) having a surface coated with a solder paste and, in this state, a brazing material (solder) is melted and cooled, and carbon fibers and a substrate are brazed (soldered). After completion of mechanical and thermal connection between the substrate and the carbon fibers, this is immersed in an organic solvent, and the provisionally adhered provisional substrate is peeled from the carbon fibers to manufacture a radiating fin.

摘要翻译： 将具有金属镀层（Cu镀层）的表面的多个碳纤维通过静电植绒垂直放置在平板状临时基板上，并且将碳纤维的一端临时粘附到临时基板上， 粘合剂。 未临时粘附的碳纤维的另一端与表面被焊膏涂布的基板（Cu板）接触，在该状态下，钎焊材料（焊料）熔融冷却，碳纤维和 衬底钎焊（焊接）。 在基板和碳纤维之间的机械和热连接完成之后，将其浸入有机溶剂中，并将临时粘附的临时基板从碳纤维上剥离以制造散热片。

公开(公告)号：US06576081B2

公开(公告)日：2003-06-10

申请号：US09438665

申请日：1999-11-12

申请人： Hiroaki Date ,  Yuko Motoyama ,  Hideshi Tokuhira ,  Makoto Usui ,  Nobuhiro Imaizumi

发明人： Hiroaki Date ,  Yuko Motoyama ,  Hideshi Tokuhira ,  Makoto Usui ,  Nobuhiro Imaizumi

IPC分类号： C09J902

CPC分类号： H01L24/28 ,  H01L21/563 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29373 ,  H01L2224/29386 ,  H01L2224/2949 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83097 ,  H01L2224/83099 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/303 ,  H05K3/386 ,  Y10T156/1011 ,  Y10T156/1018 ,  Y10T156/1026 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The present invention is characterized by comprising a two-pack adhesive of an A agent selected from components, an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and containing at least one or two of the acrylic monomer, the peroxide and the reducing agent, and a B agent containing all of the remaining components which are not selected in the A agent. The use of this adhesive makes it possible to stably obtain the bonding free from a thermal stress with the excellent heat resistance and the good reliability.

摘要翻译： 本发明的特征在于包括选自组分，丙烯酸类单体，过氧化物，还原剂，环氧树脂前体和固化剂的A试剂的双组分粘合剂，并且含有至少一种或两种丙烯酸类单体 ，过氧化物和还原剂，以及含有在A剂中未选择的所有剩余成分的B剂。 通过使用这种粘合剂，可以稳定地获得没有热应力的结合，具有优异的耐热性和良好的可靠性。

公开(公告)号：US07978470B2

公开(公告)日：2011-07-12

申请号：US12251172

申请日：2008-10-14

申请人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

发明人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  G06F2200/201

摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

摘要翻译： 具有MPU元件的第一壳体中的主体流动路径分别与形成在内部散热板和外部散热板中的内部流路和外部流路连通，并且泵驱动冷却液体在 这些流路。 在设置在第二壳体中的枢轴和设置在内部散热板中的枢轴之间布置有梁，在内部散热板的枢轴与设置在外部散热板中的枢轴之间布置有梁， 并且内部散热板和外部散热板可移动到第二壳体。 根据打开第二壳体的操作，第二壳体和内部散热板之间的距离以及内部流路和外部流路之间的距离增加。

公开(公告)号：US07610678B2

公开(公告)日：2009-11-03

申请号：US11012147

申请日：2004-12-16

申请人： Hideshi Tokuhira ,  Hiroaki Date ,  Hiroki Uchida ,  Minoru Ishinabe

发明人： Hideshi Tokuhira ,  Hiroaki Date ,  Hiroki Uchida ,  Minoru Ishinabe

IPC分类号： B21D53/02 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/3733 ,  H01L23/3737 ,  H01L23/42 ,  H01L24/28 ,  H01L2224/16225 ,  H01L2224/16257 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83886 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/351 ,  Y10S165/905 ,  Y10T29/4935 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/0133 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/0401

摘要： A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.

摘要翻译： 在作为发热元件的硅芯片的接合面上形成有绝缘树脂的图案，并且在作为散热元件的散热器的接合面上形成有绝缘树脂的图案， 与形成在硅芯片上的绝缘树脂部件对准。 硅芯片和散热片通过热转印片相互结合。 硅芯片和散热器通过金属彼此接合以在不形成绝缘树脂部分的区域中形成金属连接部分，而硅船和散热器通过树脂彼此接合以形成树脂 形成绝缘性树脂部的区域的连接部。

公开(公告)号：US20060209512A1

公开(公告)日：2006-09-21

申请号：US11165118

申请日：2005-06-24

申请人： Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masatomo Asano ,  Nobuhiro Nanri

发明人： Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masatomo Asano ,  Nobuhiro Nanri

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： G06F1/203 ,  G06F2200/201 ,  G06F2200/203

摘要： A heat receiving member of a heat receiving device includes a coolant passage comprising a bag formed of a flexible sheet made up of a thermally stable, flexible plastic material and a metal film having high heat conductivity. In the coolant passage flows a coolant having an anti-corrosion property. A heat generating member including a main body and a terminal portion is supported by an adapter fitted in an opening formed in the flexible sheet. The main body of the heat generating member comes into direct contact with the coolant flowing in the coolant passage. Since the heat from the heat generating member is directly transferred to the coolant, the heat transfer path between the heat generating member and the coolant becomes shorter. Therefore, the heat resistance is reduced, so that the heat receiving efficiency is extremely high.

摘要翻译： 热接收装置的受热部件包括冷却剂通道，其包括由热稳定的柔性塑料材料制成的柔性片和具有高导热性的金属膜形成的袋。 在冷却剂通道中流动具有防腐蚀性能的冷却剂。 包括主体和端子部分的发热元件由装配在柔性片中形成的开口中的适配器支撑。 发热构件的主体与在冷却剂通道中流动的冷却剂直接接触。 由于来自发热部件的热量直接传递给冷却剂，所以发热部件与冷却液之间的传热路径变短。 因此，耐热性降低，因此热接收效率极高。

公开(公告)号：US20060037741A1

公开(公告)日：2006-02-23

申请号：US11012147

申请日：2004-12-16

申请人： Hideshi Tokuhira ,  Hiroaki Date ,  Hiroki Uchida ,  Minoru Ishinabe

发明人： Hideshi Tokuhira ,  Hiroaki Date ,  Hiroki Uchida ,  Minoru Ishinabe

IPC分类号： H05K7/20

CPC分类号： H01L23/433 ,  H01L23/3733 ,  H01L23/3737 ,  H01L23/42 ,  H01L24/28 ,  H01L2224/16225 ,  H01L2224/16257 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83886 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/351 ,  Y10S165/905 ,  Y10T29/4935 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/0133 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/0401

摘要： A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.

公开(公告)号：US07551435B2

公开(公告)日：2009-06-23

申请号：US11898254

申请日：2007-09-11

申请人： Jun Taniguchi ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date ,  Masatomo Asano ,  Nobuhiro Nanri

发明人： Jun Taniguchi ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date ,  Masatomo Asano ,  Nobuhiro Nanri

IPC分类号： H05K7/20 ,  H01L23/36

CPC分类号： H01L23/473 ,  G06F1/203 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

摘要： Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU 2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

摘要翻译： 高度不同的电子元件（CPU2a，电容器2b和线圈元件2c）安装在印刷电路板1上。在印刷电路板1的上方设有吸热元件3，使得元件3 不仅接触CPU 2a的最短但电容器2b和线圈元件2c的侧面的顶表面。 为了循环冷却介质，在吸热部件3中形成有流路4.在CPU2a产生的热量经由吸热部件3从流路4的顶面向冷却介质传递。 在电容器2b和线圈元件2c处产生的热量经由吸热构件3从侧面传递到流路4中的冷却介质。

公开(公告)号：US07502227B2

公开(公告)日：2009-03-10

申请号：US11085483

申请日：2005-03-22

申请人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

发明人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  G06F2200/201

摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

摘要翻译： 具有MPU元件的第一壳体中的主体流动路径分别与形成在内部散热板和外部散热板中的内部流路和外部流路连通，并且泵驱动冷却液体在 这些流路。 在设置在第二壳体中的枢轴和设置在内部散热板中的枢轴之间布置有梁，在内部散热板的枢轴与设置在外部散热板中的枢轴之间布置有梁， 并且内部散热板和外部散热板可移动到第二壳体。 根据打开第二壳体的操作，第二壳体和内部散热板之间的距离以及内部流路和外部流路之间的距离增加。