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公开(公告)号：US20250099999A1
公开(公告)日：2025-03-27
申请号：US18675465
申请日：2024-05-28
Applicant: SEMES CO., LTD.
Inventor： Yong Hoon HONG , Jin Ah HAN , Byung Sun BANG , Hyun Woo TAK
Abstract: A treatment liquid supply apparatus includes a discharge line through which treatment liquid is discharged from a substrate processing apparatus; a first tank storing recovered treatment liquid, recovered through the discharge line; a treatment liquid supply unit supplying new treatment liquid to the discharge line through a first transfer line; a first heating unit disposed between the treatment liquid supply unit and the discharge line and controlling a temperature of the new treatment liquid passing through the first transfer line; and a second tank resupplying the recovered treatment liquid supplied from the first tank through a second transfer line to the substrate processing apparatus through a supply line.
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公开(公告)号：US20250096018A1
公开(公告)日：2025-03-20
申请号：US18811189
申请日：2024-08-21
Applicant: SEMES CO., LTD.
Inventor： Changhwa JEONG , Jungsoo LEE , Youngkyu OH , Chungoh HONG , Jiyun AHN
IPC: H01L21/67 , H01L21/677 , H01L21/68
Abstract: A substrate processing apparatus includes an loading stage configured to receive first and second substrates and including a first substrate alignment portion for aligning the first substrate and a second substrate alignment portion for aligning the second substrate, the first substrate alignment portion being spaced apart from the first substrate alignment portion; an coating stage configured to sequentially receive the first substrate and the second substrate from the loading stage and including a first discharge nozzle for discharging a first chemical solution onto the first substrate and a second discharge nozzle for discharging a second chemical solution onto the second substrate; and an unloading stage configured to sequentially unload the first substrate and the second substrate from the coating stage.
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公开(公告)号：US12255050B2
公开(公告)日：2025-03-18
申请号：US17968179
申请日：2022-10-18
Applicant: SEMES CO., LTD.
Inventor： Yoon Seok Choi , Yun Sang Kim , Sun Wook Jung
IPC: H01J37/32 , H01L21/683 , H01Q7/00
Abstract: The inventive concept provides an antenna member. In an embodiment, the antenna member includes a first coil and a second coil which have a rotational symmetry to each other, and wherein the first coil includes a first supply terminal applied with a current and a first ground terminal connected to the ground, the second coil includes a second supply terminal applied with the current and a second ground terminal connected to the ground, and wherein the first coil and the second coil each include a first portion having an arc-shape and a second portion having an arc-shape which as a whole form one winding, and when seen from a side, the second portion has a relatively lower height than the first portion, and the second portion of the second coil is positioned below the first portion of the first coil, and the second portion of the first coil is positioned below the first portion of the second coil.
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公开(公告)号：US20250087512A1
公开(公告)日：2025-03-13
申请号：US18739844
申请日：2024-06-11
Applicant: SEMES CO., LTD.
Inventor： Kwang Pyo LEE
IPC: H01L21/673 , B65G47/90
Abstract: The container of the present invention accommodates a ring carrier for supporting a ring provided in a substrate processing apparatus and comprises a housing, in which an accommodation space is formed, a slot provided in the housing and having an insertion groove formed therein, and a block located in the insertion groove, wherein the block protrudes from the slot and extends to the ring carrier and has a support surface for supporting a lower circumference of the ring carrier, and a first inclined surface sloping upward from the support surface in a normal direction of the ring carrier and having a radius larger than an arc of the ring carrier, wherein a boundary line between the support surface and the first inclined surface has a radius at least the same as the arc of the ring carrier.
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公开(公告)号：US20250087504A1
公开(公告)日：2025-03-13
申请号：US18824861
申请日：2024-09-04
Applicant: SEMES CO., LTD.
Inventor： Changhoon OK , Jae Gyeong LEE , Jinsoo KIM
Abstract: Provided is a semiconductor package cutting system including a loading device storing at least one strip or at least one magazine containing the strip, a cutting device mounted behind the loading device to partial-cut at least a portion of the strip supplied from the loading device, an inspection device mounted behind the cutting device to inspect the strip cut by the cutting device, and an unloading device mounted behind the inspection device to unload the inspected strip.
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Patent Agency Ranking
公开(公告)号：US20250073853A1
公开(公告)日：2025-03-06
申请号：US18242031
申请日：2023-09-05
Applicant: SEMES CO., LTD.
Inventor： Inseok Ha , Jinhyuck Yang , Cheonsu Cho , Yongkyu Cho
IPC: B25B5/06
Abstract: The present disclosure provides a driving device including a driving member including a power source, a slider configured to linearly move according to power supply form the power source, a guide member coupled to the slider and configured to provide a movement path to the slider, and a bracket coupled to the slider, wherein the bracket is divided into a first bracket and a second bracket separated from each other by a first gap, and includes a first cooling member configured to cool the first bracket and a second cooling member configured to cool the second bracket, and the driving member includes a third cooling member configured to cool the power source.
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公开(公告)号：US12243847B2
公开(公告)日：2025-03-04
申请号：US17384750
申请日：2021-07-24
Applicant: SEMES CO., LTD.
Inventor： Gil Yong Moon
Abstract: A bonding apparatus includes a stage on which a substrate is seated, a gantry installed above the stage, a bonding unit for bonding a chip to the substrate while moving along the gantry, a first temperature sensor installed on the bonding unit and providing a first temperature value of the bonding unit, a second temperature sensor installed at a periphery of the bonding apparatus and providing a second temperature value of an atmospheric temperature at the periphery of the bonding apparatus, and a control part causing the bonding unit to be aligned with a bonding position on the substrate, controlling the bonding unit to allow the bonding unit to bond the chip at the bonding position, and determining a movement distance of the bonding unit based on a weighted sum of the first temperature value and the second temperature value.
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公开(公告)号：US12237180B2
公开(公告)日：2025-02-25
申请号：US17539070
申请日：2021-11-30
Applicant: SEMES CO., LTD.
Inventor： Jun Young Choi , Kyu Hwan Chang
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus comprises a first treating part performing, a liquid treatment on a plurality of substrates in a batch-type treating, method and a second treating part treating the substrates which have been treated at the first treating part, and performing, the liquid treatment or a drying treatment on a single substrate a single-type treating method.
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公开(公告)号：US12236574B2
公开(公告)日：2025-02-25
申请号：US17461610
申请日：2021-08-30
Applicant: SEMES CO., LTD.
Inventor： Ohyeol Kwon , Soo Yeon Shin , Jihyun Lee , Chang Yul Cho
Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes an imaging unit that photographs loci of the one or more discharge liquids discharged from the plurality of nozzles, and an inspection unit that calculates impact points of the one or more discharge liquids discharged from the plurality of nozzles and determines whether the impact points of the one or more discharge liquids discharged from the plurality of nozzles are normal. The inspection unit includes an image synthesizing unit that synthesizes a plurality of images captured by the imaging unit, a pre-processing unit that pre-processes image data generated through the image synthesizing unit, and a calculation unit that calculates whether the impact points of the one or more discharge liquids discharged from the plurality of nozzles are normal by comparing the image data pre-processed by the pre-processing unit.
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10.发明授权公开(公告)号：US12224189B2
公开(公告)日：2025-02-11
申请号：US17564562
申请日：2021-12-29
Applicant: SEMES CO., LTD.
Inventor： Young Seop Choi , Yong-Jun Seo , Sang Hyun Son , Jun Gwon Lee , Hak Hyon Kim , Sun Yong Park
Abstract: A substrate type sensor includes a substrate shape member, a pressure sensor panel provided at the substrate shape member, the pressure sensor panel including a plurality of pressure sensors, a central module including a transmission unit, the reception unit receiving data from the pressure sensor panel, and a battery proving power to the pressure sensor panel and the central module.
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