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1.发明授权Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body 有权发光元件，树脂封装，树脂成形体，以及制造发光元件，树脂封装和树脂成形体的方法公开(公告)号：US08530250B2
公开(公告)日：2013-09-10
申请号：US12737940
申请日：2009-08-27
IPC分类号： H01L21/00
CPC分类号： H01L33/486 , B29C45/0055 , B29C45/14655 , B29C2793/009 , H01L24/97 , H01L33/0095 , H01L33/504 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/3025 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a simple and low-cost method for manufacturing, in a short time, many light emitting devices wherein adhesiveness between a leadframe and a thermosetting resin composition is high. The method for manufacturing the light emitting device having a resin package (20) wherein the optical reflectivity at a wavelength of 350-800 nm after thermal curing is 70% or more and a resin section (25) and a lead (22) are formed on substantially a same surface on an outer surface (20b) has: a step of sandwiching a leadframe (21) provided with a notched section (21a) by an upper molding die (61) and a lower molding die (62); a step of transfer-molding a thermosetting resin (23) containing a light-reflecting substance (26), in a molding die (60) sandwiched by the upper molding die (61) and the lower molding die (62) and forming a resin-molded body (24) on the leadframe (21); and a step of cutting the resin-molded body (24) and the leadframe (21) along the notched section (21a).
摘要翻译： 提供了一种在短时间内制造其中引线框和热固性树脂组合物之间的粘合性高的许多发光器件的简单且低成本的方法。 制造具有树脂封装（20）的发光器件的方法，其中热固化后350-800nm波长的光反射率为70％以上，树脂部分（25）和引线（22）形成 在外表面（20b）上的基本上相同的表面上具有：通过上模制件（61）和下成型模具（62）夹持设置有切口部分（21a）的引线框架（21）的步骤; 在由上成型模具（61）和下成型模具（62）夹持的成型模具（60）中，将含有光反射物质（26）的热固性树脂（23）转印成型的步骤，形成树脂 在引线框架（21）上的模塑体（24）; 以及沿着切口部分（21a）切割树脂模制体（24）和引线框架（21）的步骤。
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公开(公告)号：USD664103S1
公开(公告)日：2012-07-24
申请号：US29361546
申请日：2010-05-12
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公开(公告)号：US20080233678A1
公开(公告)日：2008-09-25
申请号：US12045919
申请日：2008-03-11
申请人： Hiroki TAKAHASHI , Shimpei SASAOKA
发明人： Hiroki TAKAHASHI , Shimpei SASAOKA
IPC分类号： H01L21/50
CPC分类号： H01L21/561 , H01L23/3121 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L24/97 , H01L25/0753 , H01L33/52 , H01L33/54 , H01L2223/54426 , H01L2223/54473 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49175 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12035 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/20752 , H01L2924/3025 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a semiconductor device having a substrate on which conductor wiring is disposed, electrodes provided to the conductor wiring, a semiconductor element connected to the electrodes, and a sealing member that covers the semiconductor element, comprises; mounting a plurality of semiconductor elements on the substrate in the X-axial direction and the Y-axial direction, forming marks in the X-axial direction, supplying the sealing material onto the substrate to continuously-covering the plurality of semiconductor elements arranged in the X-axial direction along the marks, dicing the sealing member and the substrate in the Y-axial direction to form cut planes of the sealing member and the substrate in substantially one plane and being a pair of cut planes opposite one another.
摘要翻译： 一种半导体器件的制造方法，其具有设置有导体布线的基板，设置在导体布线上的电极，与该电极连接的半导体元件以及覆盖该半导体元件的密封部件。 在X轴方向和Y轴方向上在基板上安装多个半导体元件，在X轴方向上形成标记，将密封材料供给到基板上，以连续地覆盖布置在基板中的多个半导体元件 沿着标记的X轴方向，在Y轴方向上切割密封构件和基板，以在基本上一个平面内形成密封构件和基板的切割面，并且是彼此相对的一对切割平面。
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公开(公告)号：USD698047S1
公开(公告)日：2014-01-21
申请号：US29424444
申请日：2012-06-12
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公开(公告)号：US07915090B2
公开(公告)日：2011-03-29
申请号：US12045919
申请日：2008-03-11
申请人： Hiroki Takahashi , Shimpei Sasaoka
发明人： Hiroki Takahashi , Shimpei Sasaoka
IPC分类号： H01L21/00
CPC分类号： H01L21/561 , H01L23/3121 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L24/97 , H01L25/0753 , H01L33/52 , H01L33/54 , H01L2223/54426 , H01L2223/54473 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49175 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12035 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/20752 , H01L2924/3025 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a semiconductor device having a substrate on which conductor wiring is disposed, electrodes provided to the conductor wiring, a semiconductor element connected to the electrodes, and a sealing member that covers the semiconductor element, comprises; mounting a plurality of semiconductor elements on the substrate in the X-axial direction and the Y-axial direction, forming marks in the X-axial direction, supplying the sealing material onto the substrate to continuously-covering the plurality of semiconductor elements arranged in the X-axial direction along the marks, dicing the sealing member and the substrate in the Y-axial direction to form cut planes of the sealing member and the substrate in substantially one plane and being a pair of cut planes opposite one another.
摘要翻译： 一种半导体器件的制造方法，其具有设置有导体布线的基板，设置在导体布线上的电极，与该电极连接的半导体元件以及覆盖该半导体元件的密封部件。 在X轴方向和Y轴方向上在基板上安装多个半导体元件，在X轴方向上形成标记，将密封材料供给到基板上，以连续地覆盖布置在基板中的多个半导体元件 沿着标记的X轴方向，在Y轴方向上切割密封构件和基板，以在基本上一个平面内形成密封构件和基板的切割面，并且是彼此相对的一对切割平面。
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6.发明申请LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHODS FOR MANUFACTURING LIGHT EMITTING DEVICE, RESIN PACKAGE AND RESIN-MOLDED BODY 有权发光装置，树脂包装，树脂模制体和制造发光装置的方法，树脂包装和树脂模体公开(公告)号：US20110210354A1
公开(公告)日：2011-09-01
申请号：US12737940
申请日：2009-08-27
CPC分类号： H01L33/486 , B29C45/0055 , B29C45/14655 , B29C2793/009 , H01L24/97 , H01L33/0095 , H01L33/504 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/3025 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a simple and low-cost method for manufacturing, in a short time, many light emitting devices wherein adhesiveness between a leadframe and a thermosetting resin composition is high. The method for manufacturing the light emitting device having a resin package (20) wherein the optical reflectivity at a wavelength of 350-800 nm after thermal curing is 70% or more and a resin section (25) and a lead (22) are formed on substantially a same surface on an outer surface (20b) has: a step of sandwiching a leadframe (21) provided with a notched section (21a) by an upper molding die (61) and a lower molding die (62); a step of transfer-molding a thermosetting resin (23) containing a light-reflecting substance (26), in a molding die (60) sandwiched by the upper molding die (61) and the lower molding die (62) and forming a resin-molded body (24) on the leadframe (21); and a step of cutting the resin-molded body (24) and the leadframe (21) along the notched section (21a).
摘要翻译： 提供了一种在短时间内制造其中引线框和热固性树脂组合物之间的粘合性高的许多发光器件的简单且低成本的方法。 制造具有树脂封装（20）的发光器件的方法，其中热固化后350-800nm波长的光反射率为70％以上，树脂部分（25）和引线（22）形成 在外表面（20b）上的基本上相同的表面上具有：通过上模制件（61）和下成型模具（62）夹持设置有切口部分（21a）的引线框架（21）的步骤; 在由上成型模具（61）和下成型模具（62）夹持的成型模具（60）中，将含有光反射物质（26）的热固性树脂（23）转印成型的步骤，形成树脂 在引线框架（21）上的模塑体（24）; 以及沿着切口部分（21a）切割树脂模制体（24）和引线框架（21）的步骤。
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