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1.发明申请公开(公告)号：US20200310005A1
公开(公告)日：2020-10-01
申请号：US16828815
申请日：2020-03-24
Applicant: TriLumina Corp.
Inventor： Richard F. Carson , Preethi Dacha , Mial E. Warren
Abstract: Systems, methods, and devices disclosed herein relate to optical assemblies for spatial multiplexing, multi-zone illumination, and optical assemblies. In embodiments, light source arrays are aligned with one or more micro-lens assemblies to generate a specific field of illumination. In embodiments, surface-emitting light sources may be light-emitting diodes and/or surface-emitting lasers. The micro-lens array may be aligned with the light source arrays, on-axis or off-axis to a principal axis of corresponding lenses such that the light sources may be expanded to a desired divergence and field of illumination. In embodiments, multiple light sources may be combined to increase power output for a specific area of the field of illumination, and light sources may be driven independently depending on intended illumination.
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公开(公告)号：US10244181B2
公开(公告)日：2019-03-26
申请号：US15040975
申请日：2016-02-10
Applicant: TRILUMINA CORP.
Inventor： Mial E. Warren
IPC: H04N5/14 , H04N5/33 , H04N5/235 , H01S5/026 , H04N5/225 , H01S5/183 , H01S5/42 , H01S5/00 , H01S5/022 , H01S5/024 , H01S5/042 , H01S5/062
Abstract: Methods, devices and systems are described for selectively illuminating different zones of a field of view by a multi-zone illumination device. In one aspect, a multi-zone illuminator may include a plurality of vertical cavity surface emitting lasers (VCSELs), and a plurality of micro-optical devices aligned with apertures of individual or groups of VCSELs, which are configured to be individually activated to provide adjustable illumination to different zones of a field of view of an image sensor. In another aspect, a method of selective illumination may include receiving information specifying a field of view of a camera, and controlling at least two sub arrays or individual illuminators of an illuminating array to output light at independently adjustable illumination powers, wherein each of the at least two sub arrays are independently configurable to illuminate at least one of a plurality of separate zones corresponding to the field of view of the camera.
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公开(公告)号：US20200153195A1
公开(公告)日：2020-05-14
申请号：US16680404
申请日：2019-11-11
Applicant: TRILUMINA CORP.
Inventor： Kevin M. Kupcho
Abstract: Systems, methods, and devices are described for in-situ testing of vertical-cavity surface-emitting lasers (VCSELs), VCSEL arrays or laser diodes (each a laser). Testing may comprise bias voltage measurements of one or more lasers. Embodiments may comprise one of a laser, a driver circuit providing a bipolar drive to the laser, and a sensing circuit to measure and/or monitor damage or degradation of the laser. The bipolar drive may comprise a pulsed forward bias output configured to produce a light output during an on-time of the laser, and a pulsed reverse bias output during an off-time of the pulsed forward bias output. The pulsed outputs may comprise a variable, chirped frequency. One or more of a reverse leakage current, and a junction temperature may be measured to monitor a state of health of the laser.
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公开(公告)号：US20190036308A1
公开(公告)日：2019-01-31
申请号：US16045633
申请日：2018-07-25
Applicant: TRILUMINA CORP.
Inventor： Richard F. CARSON , Nein-Yi LI , Mial E. WARREN
Abstract: Methods, devices and systems are described for enabling a series-connected, single chip vertical-cavity surface-emitting laser (VCSEL) array. In one aspect, the single chip includes one or more non-conductive regions one the conductive layer to produce a plurality of electrically separate conductive regions. Each electrically separate region may have a plurality of VCSEL elements, including an anode region and a cathode region connected in series. The chip is connected to a sub-mount with a metallization pattern, which connects each electrically separate region on the conductive layer in series. In one aspect, the metallization pattern connects the anode region of a first electrically separate region to the cathode region of a second electrically separate region. The metallization pattern may also comprise cuts that maintain electrical separation between the anode and cathode regions on each conductive layer region, and that align with the etched regions.
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公开(公告)号：US09927558B2
公开(公告)日：2018-03-27
申请号：US15133094
申请日：2016-04-19
Applicant: TRILUMINA CORP.
Inventor： Richard F. Carson , John R. Joseph , Mial E. Warren , Thomas A. Wilcox
CPC classification number: G02B3/0012 , B01J8/00 , B01J2208/00008 , G02B1/14 , G02B3/0018 , G02B3/0025 , G02B3/0037 , G02B3/0043 , G02B3/0056 , G02B7/005 , H01J37/32009 , H01J2237/10 , H01J2237/334 , H01S5/005 , H01S5/423
Abstract: Embodiments comprise a system created through fabricating a lens array through which lasers are emitted. The lens array may be fabricated in the semiconductor substrate used for fabricating the lasers or may be a separate substrate of other transparent material that would be aligned to the lasers. In some embodiments, more lenses may be produced than will eventually be used by the lasers. The inner portion of the substrate may be formed with the lenses that will be used for emitting lasers, and the outer portion of the substrate may be formed with lenses that will not be used for emitting lasers—rather, through etching these additional lenses, the inner lenses may be created with a higher quality.
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Patent Agency Ranking
公开(公告)号：US20200235811A1
公开(公告)日：2020-07-23
申请号：US16840063
申请日：2020-04-03
Applicant: TriLumina Corp.
Inventor： John R. JOSEPH , Kevin L. LEAR , David ABELL
IPC: H04B10/11 , H04B10/50 , G02B27/09 , G02B5/32 , H01S5/022 , H01S5/42 , H01S5/00 , G02B27/10 , G02B5/02
Abstract: High power, high speed VCSEL arrays are employed in unique configurations of arrays and sub-arrays. Placement of a VCSEL array behind a lens allows spatial separation and directivity. Diffusion may be employed to increase alignment tolerance. Intensity modulation may be performed by operating groups of VCSEL emitters at maximum bias. Optical communications networks with high bandwidth may employ angular, spatial, and/or wavelength multiplexing. A variety of network topologies and bandwidths suitable for the data center may be implemented. Eye safe networks may employ VCSEL emitters may be paired with optical elements to reduce optical power density to eye safe levels.
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公开(公告)号：US10530128B2
公开(公告)日：2020-01-07
申请号：US16045633
申请日：2018-07-25
Applicant: TRILUMINA CORP.
Inventor： Richard F. Carson , Nein-Yi Li , Mial E. Warren
Abstract: Methods, devices and systems are described for enabling a series-connected, single chip vertical-cavity surface-emitting laser (VCSEL) array. In one aspect, the single chip includes one or more non-conductive regions one the conductive layer to produce a plurality of electrically separate conductive regions. Each electrically separate region may have a plurality of VCSEL elements, including an anode region and a cathode region connected in series. The chip is connected to a sub-mount with a metallization pattern, which connects each electrically separate region on the conductive layer in series. In one aspect, the metallization pattern connects the anode region of a first electrically separate region to the cathode region of a second electrically separate region. The metallization pattern may also comprise cuts that maintain electrical separation between the anode and cathode regions on each conductive layer region, and that align with the etched regions.
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公开(公告)号：US20190268068A1
公开(公告)日：2019-08-29
申请号：US16406846
申请日：2019-05-08
Applicant: TRILUMINA CORP.
Inventor： Preethi Dacha , David Podva , Mial E. Warren
IPC: H04B10/11 , H04B10/50 , G02B27/09 , G02B5/32 , H01S5/022 , G02B27/10 , H01S5/00 , G02B5/02 , H01S5/42
Abstract: A wide-angle illuminator module including a rigid support structure having a plurality of angled faces, a flexible circuit including one or more VCSEL arrays, each VCSEL array positioned over a face among the plurality of angled faces, each VCSEL array including a plurality of integrated microlenses with one microlens positioned over each VCSEL in the VCSEL array, and a driver circuit for providing electrical pulses to each VCSEL array, wherein the plurality of VCSEL arrays address illumination zones in a combined field of illumination. The support structure may also be a heatsink. The flexible circuit may be a single flexible circuit configured to be placed over the support structure or a plurality of flexible circuits, each including one VCSEL array.
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公开(公告)号：US20160080077A1
公开(公告)日：2016-03-17
申请号：US14946730
申请日：2015-11-19
Applicant: TriLumina Corp.
Inventor： John R. JOSEPH , Kevin L. LEAR , David ABELL
CPC classification number: H04B10/11 , G02B5/02 , G02B5/32 , G02B27/0905 , G02B27/0944 , G02B27/10 , H01S5/005 , H01S5/02248 , H01S5/02276 , H01S5/06226 , H01S5/423 , H01S5/50 , H04B10/503
Abstract: High power, high speed VCSEL arrays are employed in unique configurations of arrays and sub-arrays. Placement of a VCSEL array behind a lens allows spatial separation and directivity. Diffusion may be employed to increase alignment tolerance. Intensity modulation may be performed by operating groups of VCSEL emitters at maximum bias. Optical communications networks with high bandwidth may employ angular, spatial, and/or wavelength multiplexing. A variety of network topologies and bandwidths suitable for the data center may be implemented. Eye safe networks may employ VCSEL emitters may be paired with optical elements to reduce optical power density to eye safe levels.
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公开(公告)号：US20200335942A1
公开(公告)日：2020-10-22
申请号：US16917785
申请日：2020-06-30
Applicant: TRILUMINA CORP.
Inventor： Richard F. CARSON , Nein-Yi LI , Mial E. WARREN
Abstract: Methods, devices and systems are described for enabling a series-connected, single chip vertical-cavity surface-emitting laser (VCSEL) array. In one aspect, the single chip includes one or more non-conductive regions one the conductive layer to produce a plurality of electrically separate conductive regions. Each electrically separate region may have a plurality of VCSEL elements, including an anode region and a cathode region connected in series. The chip is connected to a sub-mount with a metallization pattern, which connects each electrically separate region on the conductive layer in series. In one aspect, the metallization pattern connects the anode region of a first electrically separate region to the cathode region of a second electrically separate region. The metallization pattern may also comprise cuts that maintain electrical separation between the anode and cathode regions on each conductive layer region, and that align with the etched regions.
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