公开(公告)号：US06379484B2

公开(公告)日：2002-04-30

申请号：US09730193

申请日：2000-12-05

申请人： Takahito Nakazawa ,  Hiroshi Nomura ,  Yumiko Ohshima

发明人： Takahito Nakazawa ,  Hiroshi Nomura ,  Yumiko Ohshima

IPC分类号： H01L2128

CPC分类号： H01L21/6715 ,  B05B1/14 ,  B05B13/04 ,  B05C5/001 ,  B05C5/0208 ,  B05C9/14 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T156/1798 ,  H01L2924/00

摘要： An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip. According to the present invention, the resin is supplied such that it is relatively less concentrated near the peripheral portions of the chip so the resin spreads throughout the entire gap at substantially the same time as it flows along the peripheral portion of the chip. Thus, the formation of resin-less voids in the gap is deterred so that the grade and quality of the semiconductor device is improved.

摘要翻译： 提供一种用于制造半导体封装的装置，其中半导体芯片和安装板之间的间隙填充有树脂。 该装置包括用于沿着半导体芯片的一侧供应树脂的树脂供给装置和用于控制由树脂供给装置供应的树脂量使得在半导体芯片的中心部分附近提供更多树脂的树脂供给控制装置， 靠近半导体芯片的端部。 还提供了一种方法，其包括以下步骤：连接半导体芯片和安装板，并且以半导体芯片的一侧向树脂提供树脂，使得在半导体芯片的中心部分附近提供更多的树脂， 半导体芯片的端部。 根据本发明，提供树脂，使得其在芯片的周边部分附近相对较少集中，使得树脂在沿着芯片的周边部分流动的基本同时在整个间隙中扩展。 因此，阻止了间隙中无树脂的空隙的形成，从而提高了半导体器件的等级和质量。

公开(公告)号：US06191024B1

公开(公告)日：2001-02-20

申请号：US09294955

申请日：1999-04-20

申请人： Takahito Nakazawa ,  Hiroshi Nomura ,  Yumiko Ohshima

发明人： Takahito Nakazawa ,  Hiroshi Nomura ,  Yumiko Ohshima

IPC分类号： H01L21288

CPC分类号： H01L21/6715 ,  B05B1/14 ,  B05B13/04 ,  B05C5/001 ,  B05C5/0208 ,  B05C9/14 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  Y10T156/1798 ,  H01L2924/00

摘要： An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip. According to the present invention, the resin is supplied such that it is relatively less concentrated near the peripheral portions of the chip so the resin spreads throughout the entire gap at substantially the same time as it flows along the peripheral portion of the chip. Thus, the formation of resin-less voids in the gap is deterred so that the grade and quality of the semiconductor device is improved.

公开(公告)号：US06011312A

公开(公告)日：2000-01-04

申请号：US902430

申请日：1997-07-29

申请人： Takahito Nakazawa ,  Yumiko Ohshima

发明人： Takahito Nakazawa ,  Yumiko Ohshima

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L21/60 ,  H01L23/48 ,  H01L23/04 ,  H01L23/52

CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15151

摘要： A semiconductor package is provided that includes a semiconductor chip that is mounted on a mount board with metal bumps interposed therebetween so as to create a gap. A structure is provided in the gap for limiting the flow of a resin, which is deposited along side the semiconductor chip, around the peripheral portion of the semiconductor chip. The structure increases the resistance to the flow of the resin in the peripheral portion of the semiconductor chip. Therefore, the rate at which the resin flows in the peripheral portion of the semiconductor chip is made lower than the rate at which the resin flows near the central portion of semiconductor chip. Accordingly, the formation of a resin-less void in the gap is suppressed so that the grade and quality of the semiconductor device is improved. In one embodiment, the structure in the gap includes projections provided on a portion of the mount board that corresponds to the peripheral portion of the semiconductor chip. In another embodiment, the structure in the gap includes protruding, portions provided on portions of the mount board that correspond to side portions of the semiconductor chip. The protruding portions make the size of the gap near the central portion of the semiconductor chip larger than size of the gap near the side portions of the semiconductor chip.

摘要翻译： 提供一种半导体封装件，其包括安装在安装板上的半导体芯片，其间插入有金属凸块，以产生间隙。 在间隙中设置有用于限制沿着半导体芯片的侧面沉积的树脂的流动围绕半导体芯片的周边部分的结构。 该结构增加了对半导体芯片周边部分中树脂流动的阻力。 因此，树脂在半导体芯片的周边部分流动的速率比在半导体芯片的中心部附近树脂流动的速率低。 因此，抑制了间隙中无树脂的空隙的形成，从而提高了半导体器件的等级和质量。 在一个实施例中，间隙中的结构包括设置在对应于半导体芯片的周边部分的安装板的一部分上的突起。 在另一个实施例中，间隙中的结构包括设置在对应于半导体芯片的侧部的安装板的部分上的突出部分。 突起部分使得靠近半导体芯片的中心部分的间隙的尺寸大于靠近半导体芯片的侧部的间隙的尺寸。

公开(公告)号：US5935375A

公开(公告)日：1999-08-10

申请号：US902349

申请日：1997-07-29

申请人： Takahito Nakazawa ,  Hiroshi Nomura ,  Yumiko Ohshima

发明人： Takahito Nakazawa ,  Hiroshi Nomura ,  Yumiko Ohshima

IPC分类号： H01L21/60 ,  B05B1/14 ,  B05B13/04 ,  B05C5/00 ,  B05C5/02 ,  B05C9/14 ,  H01L21/00 ,  H01L21/56 ,  H01L23/16 ,  H01L23/28 ,  B05B5/00

CPC分类号： H01L21/6715 ,  B05C5/001 ,  B05C5/0208 ,  B05C9/14 ,  H01L24/743 ,  B05B1/14 ,  B05B13/04 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  Y10T156/1798

摘要： An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip. According to the present invention, the resin is supplied such that it is relatively less concentrated near the peripheral portions of the chip so the resin spreads throughout the entire gap at substantially the same time as it flows along the peripheral portion of the chip. Thus, the formation of resin-less voids in the gap is deterred so that the grade and quality of the semiconductor device is improved.

摘要翻译： 提供一种用于制造半导体封装的装置，其中半导体芯片和安装板之间的间隙填充有树脂。 该装置包括用于沿着半导体芯片的一侧供应树脂的树脂供给装置和用于控制由树脂供给装置供应的树脂量使得在半导体芯片的中心部分附近提供更多树脂的树脂供给控制装置， 靠近半导体芯片的端部。 还提供了一种方法，其包括以下步骤：连接半导体芯片和安装板，并且以半导体芯片的一侧向树脂提供树脂，使得在半导体芯片的中心部分附近提供更多的树脂， 半导体芯片的端部。 根据本发明，提供树脂，使得其在芯片的周边部分附近相对较少集中，使得树脂在沿着芯片的周边部分流动的基本同时在整个间隙中扩展。 因此，阻止了间隙中无树脂的空隙的形成，从而提高了半导体器件的等级和质量。

公开(公告)号：US06774011B2

公开(公告)日：2004-08-10

申请号：US09920628

申请日：2001-08-03

申请人： Takahito Nakazawa ,  Tetsuya Kurosawa ,  Hideo Numata ,  Shinya Takyu

发明人： Takahito Nakazawa ,  Tetsuya Kurosawa ,  Hideo Numata ,  Shinya Takyu

IPC分类号： H01L2146

CPC分类号： H01L21/67276 ,  H01L21/67132 ,  H01L2221/68318

摘要： A pickup device comprises a thrusting mechanism, a carrying mechanism and a controller. The thrusting mechanism is configured to thrust the chips sequentially by using pins from a back side of the adhesive tape with the adhesive tape between the chips and the pins so as to peel the chips off the adhesive tape. The carrying mechanism is configured to sequentially absorb the chips with use of a collet, hold the chips to be absorbed until the chips are peeled off the adhesive tape, thereafter pick the chips up by ascending the collet in order to be carried the chips to a subsequent process stage. The controller is configured to controlling the thrust of the chip by thrusting mechanism, the controller control an ascend time and a descend time of the pins, and keeping a predetermined period of a time when the pins arrive at their peak.

摘要翻译： 拾取装置包括推压机构，承载机构和控制器。 推力机构构造成通过使用来自胶带的背面的销从而将芯片顺序地推出，并且将芯片与销之间的粘合带剥离，从而将芯片从胶带剥离。 携带机构被配置为使用夹头顺序地吸收芯片，保持待吸收的芯片直到芯片从胶带剥离，然后通过升高夹头来拾取芯片，以将芯片运送到 后续流程阶段。 控制器被配置为通过推压机构控制芯片的推力，控制器控制销的上升时间和下降时间，并且当销到达其峰值时保持预定的一段时间。

公开(公告)号：US5998243A

公开(公告)日：1999-12-07

申请号：US172040

申请日：1998-10-14

申请人： Teikou Odashima ,  Mikio Matsui ,  Yoshiaki Sugizaki ,  Takahito Nakazawa

发明人： Teikou Odashima ,  Mikio Matsui ,  Yoshiaki Sugizaki ,  Takahito Nakazawa

IPC分类号： B29C45/32 ,  B29C45/02 ,  B29C45/14 ,  B29C45/34 ,  B29C45/73 ,  B29L31/34 ,  H01L21/56 ,  H01L21/60 ,  H01L21/44

CPC分类号： B29C45/14655 ,  H01L21/563 ,  H01L21/565 ,  H01L24/29 ,  B29C45/34 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/14 ,  H01L2924/181

摘要： In a method for manufacturing a flip-chip bonded semiconductor device is used an apparatus for resin-encapsulating, the apparatus which comprises a molding die consisting of a plurality of mold bodies, device for decompressing cavities of the molding die, device for heating the molding die, and device for injecting a liquid resin under pressure into the cavities, to form a resin-encapsulating layer by transfer molding. A bonded body having a semiconductor chip connected to a wiring substrate through its bumps is placed in the cavities of the molding die, the cavities are heated and decompressed, then the liquid resin is injected under pressure into the cavities through a gate to form a resin-encapsulating layer. Thus, the molding resin can be filled uniformly into the gap between the semiconductor chip and the wiring substrate in a short time to produce a flip-chip bonded semiconductor device having good performances.

摘要翻译： 在制造倒装芯片接合半导体器件的方法中，使用树脂封装装置，该装置包括由多个模体构成的成型模具，用于对成型模具进行减压的装置，用于加热模制件的装置 模具和用于在压力下将液态树脂注入到空腔中的装置，通过传递模塑形成树脂封装层。 将具有通过其凸块连接到布线基板的半导体芯片的接合体放置在成型模具的空腔中，将空腔加热和减压，然后将液体树脂通过浇口在压力下注入空腔中以形成树脂 胶囊层。 因此，可以在短时间内将成型树脂均匀地填充到半导体芯片和布线基板之间的间隙中，以制造具有良好性能的倒装芯片接合半导体器件。

公开(公告)号：US08241999B2

公开(公告)日：2012-08-14

申请号：US12706056

申请日：2010-02-16

申请人： Takafumi Ikeda ,  Takahito Nakazawa ,  Hideaki Maekawa ,  Yuuichi Tatsumi ,  Toshifumi Minami

发明人： Takafumi Ikeda ,  Takahito Nakazawa ,  Hideaki Maekawa ,  Yuuichi Tatsumi ,  Toshifumi Minami

IPC分类号： H01L23/544 ,  H01L21/301

CPC分类号： H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device has a circuit element region formed on a semiconductor substrate, and a protective pattern formed so as to surround the circuit element region. The protective pattern comprises a first element separation region formed on the semiconductor substrate, a second element separation region formed on the semiconductor substrate and having a width smaller than that of the first element separation region, a first element region formed between the first element separation region and the second element separation region, a first gate layer formed on the first element separation region, a wiring layer formed on the first gate layer, a passivation layer formed above the wiring layer, a second element region, an insulation film formed on the second element region, and a second gate layer formed on the insulation film, the first element separation region, the first element region, the second element separation region and the second element region being located in this order from the nearer side of the circuit element region.

摘要翻译： 半导体器件具有形成在半导体衬底上的电路元件区域和形成为围绕电路元件区域的保护图案。 保护图案包括形成在半导体衬底上的第一元件分离区域，形成在半导体衬底上的第二元件分离区域，其宽度小于第一元件分离区域的宽度;第一元素区域，形成在第一元素分离区域 和第二元件分离区域，形成在第一元件分离区域上的第一栅极层，形成在第一栅极层上的布线层，形成在布线层上方的钝化层，第二元素区域，形成在第二栅极层上的绝缘膜 元件区域和形成在绝缘膜上的第二栅极层，第一元件分离区域，第一元件区域，第二元件分离区域和第二元件区域从电路元件区域的更靠近的方向定位。

公开(公告)号：US20100237438A1

公开(公告)日：2010-09-23

申请号：US12706056

申请日：2010-02-16

申请人： Takafumi IKEDA ,  Takahito Nakazawa ,  Hideaki Maekawa ,  Yuuichi Tatsumi ,  Toshifumi Minami

发明人： Takafumi IKEDA ,  Takahito Nakazawa ,  Hideaki Maekawa ,  Yuuichi Tatsumi ,  Toshifumi Minami

IPC分类号： H01L29/06

CPC分类号： H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device has a circuit element region formed on a semiconductor substrate, and a protective pattern formed so as to surround the circuit element region. The protective pattern comprises a first element separation region formed on the semiconductor substrate, a second element separation region formed on the semiconductor substrate and having a width smaller than that of the first element separation region, a first element region formed between the first element separation region and the second element separation region, a first gate layer formed on the first element separation region, a wiring layer formed on the first gate layer, a passivation layer formed above the wiring layer, a second element region, an insulation film formed on the second element region, and a second gate layer formed on the insulation film, the first element separation region, the first element region, the second element separation region and the second element region being located in this order from the nearer side of the circuit element region.

摘要翻译： 半导体器件具有形成在半导体衬底上的电路元件区域和形成为围绕电路元件区域的保护图案。 保护图案包括形成在半导体衬底上的第一元件分离区域，形成在半导体衬底上的第二元件分离区域，其宽度小于第一元件分离区域的宽度;第一元素区域，形成在第一元素分离区域 和第二元件分离区域，形成在第一元件分离区域上的第一栅极层，形成在第一栅极层上的布线层，形成在布线层上方的钝化层，第二元素区域，形成在第二栅极层上的绝缘膜 元件区域和形成在绝缘膜上的第二栅极层，第一元件分离区域，第一元件区域，第二元件分离区域和第二元件区域从电路元件区域的更靠近的方向定位。

公开(公告)号：US06448665B1

公开(公告)日：2002-09-10

申请号：US09172038

申请日：1998-10-14

申请人： Takahito Nakazawa ,  Yoshiaki Sugizaki

发明人： Takahito Nakazawa ,  Yoshiaki Sugizaki

IPC分类号： H01L2348

CPC分类号： B29C45/34 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/552 ,  H01L24/16 ,  H01L24/29 ,  H01L24/31 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/83951 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2924/00012

摘要： In order to suppress the warp of a semiconductor package of an over-coat structure, when thermal expansion coefficient, Young's modulus and thickness of the wiring substrate are &agr;s, Es and Hs, respectively, and thermal expansion coefficient, Young's modulus and thickness of the resin layer are &agr;r, Er and Hr, respectively, the value R of (&agr;r·Er·Hr)/(&agr;s·Es·Hs) is set to be approximately 0.6 or more. With adoption of such a configuration, stress exerting on a semiconductor package can be effectively alleviated, and coplanarity of the semiconductor package can be improved.

摘要翻译： 为了抑制过涂层结构的半导体封装的翘曲，当热膨胀系数，杨氏模量和布线基板的厚度分别为Al，Es和Hs时，热膨胀系数，杨氏模量和厚度 树脂层分别为Alphar，Er和Hr，（alphar.Er.Hr）/（alphas.Es.Hs）的值R设定为约0.6以上。 通过采用这样的结构，能够有效地减轻施加在半导体封装上的应力，能够提高半导体封装的共面性。

公开(公告)号：US5677246A

公开(公告)日：1997-10-14

申请号：US575046

申请日：1995-11-28

申请人： Hideaki Maeta ,  Katsuhiko Oyama ,  Hiroshi Iwasaki ,  Yumiko Ohshima ,  Takahito Nakazawa

发明人： Hideaki Maeta ,  Katsuhiko Oyama ,  Hiroshi Iwasaki ,  Yumiko Ohshima ,  Takahito Nakazawa

IPC分类号： H01L21/56 ,  H01L21/60

CPC分类号： H01L21/561 ,  H01L21/563 ,  H01L24/29 ,  H01L24/743 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/14

摘要： In the disclosed method of manufacturing semiconductor devices with a single-sided resin-sealed package structure, when resin is filled into between the chip and the substrate, the occurrence of variations in the finishing dimensions of the package or defects in the outward appearance of the package is prevented. The disclosed manufacturing method comprises the step of using a guide plate for pouring resin and bringing one end of the guide plate into contact with one face end of a substrate or with a portion of one major surface near at least one side face of a chip in filling sealing resin between the chip and the substrate after the semiconductor chip has been mounted, with the face down, on one major surface of a wiring substrate having the wiring containing a connection section, the step of inclining the guide plate so that the guide plate may meet one major surface of the substrate at a specified angle, when or after one end of the guide plate is brought into contact with the substrate, and the step of supplying the resin to the opening between the chip and the substrate by supplying the resin onto the top surface of the guide plate and allowing the resin to flow over the top surface of the guide plate.

摘要翻译： 在所公开的制造具有单侧树脂密封封装结构的半导体器件的方法中，当树脂填充到芯片和基板之间时，封装的精加工尺寸的变化或外观上的缺陷的发生 包装被阻止。 所公开的制造方法包括以下步骤：使用用于浇注树脂的引导板，并且使引导板的一端与基板的一个面端部或与芯片的至少一个侧面附近的一个主表面的一部分接触 在半导体芯片已经被安装在芯片和基板之后，在具有包括连接部分的布线的布线基板的一个主表面上，将芯片和基板之间填充密封树脂，使引导板倾斜的步骤 当引导板的一端与基板接触时或之后，可以以特定的角度与基板的一个主表面相遇，以及通过供给树脂将树脂供给到芯片和基板之间的开口的步骤 在引导板的顶表面上并允许树脂流过导向板的顶表面。