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公开(公告)号：US20230221654A1
公开(公告)日：2023-07-13
申请号：US18122655
申请日：2023-03-16
Applicant: ASML NETHERLANDS B.V.
Inventor： Wim Tjibbo Tel , Yichen Zhang , Sarathi Roy
CPC classification number: G03F7/705 , G06F18/24 , G06F17/18 , G03F7/70633
Abstract: A method for generating metrology sampling scheme for a patterning process, the method including: obtaining a parameter map of a parameter of a patterning process for a substrate; decomposing the parameter map to generate a fingerprint specific to an apparatus of the patterning process and/or a combination of apparatuses of the patterning process; and based on the fingerprint, generating a metrology sampling scheme for a subsequent substrate at the apparatus of the patterning process and/or the combination of apparatuses of the patterning process, wherein the sampling scheme is configured to distribute sampling points on the subsequent substrate so as to improve a metrology sampling density.
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公开(公告)号：US11520238B2
公开(公告)日：2022-12-06
申请号：US17479078
申请日：2021-09-20
Applicant: ASML NETHERLANDS B.V.
Inventor： Jelle Nije , Alexander Ypma , Dimitra Gkorou , Georgios Tsirogiannis , Robert Jan Van Wijk , Tzu-Chao Chen , Frans Reinier Spiering , Sarathi Roy , Cédric Désiré Grouwstra
IPC: G03F7/20
Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.
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公开(公告)号：US11448973B2
公开(公告)日：2022-09-20
申请号：US16954384
申请日：2018-11-20
Applicant: ASML NETHERLANDS B.V.
Inventor： Manouk Rijpstra , Cornelis Johannes Henricus Lambregts , Wim Tjibbo Tel , Sarathi Roy , Cédric Désiré Grouwstra , Chi-Fei Nien , Weitian Kou , Chang-Wei Chen , Pieter Gerardus Jacobus Smorenberg
IPC: G03F7/20
Abstract: A method for determining a correction to a patterning process. The method includes obtaining a plurality of qualities of the patterning process (e.g., a plurality of parameter maps, or one or more corrections) derived from metrology data and data of an apparatus used in the patterning process, selecting, by a hardware computer system, a representative quality from the plurality of qualities, and determining, by the hardware computer system, a correction to the patterning process based on the representative quality.
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公开(公告)号：US11635698B2
公开(公告)日：2023-04-25
申请号：US16959736
申请日：2018-12-17
Applicant: ASML NETHERLANDS B.V.
Inventor： Wim Tjibbo Tel , Yichen Zhang , Sarathi Roy
Abstract: A method for generating metrology sampling scheme for a patterning process, the method including: obtaining a parameter map of a parameter of a patterning process for a substrate; decomposing the parameter map to generate a fingerprint specific to an apparatus of the patterning process and/or a combination of apparatuses of the patterning process; and based on the fingerprint, generating a metrology sampling scheme for a subsequent substrate at the apparatus of the patterning process and/or the combination of apparatuses of the patterning process, wherein the sampling scheme is configured to distribute sampling points on the subsequent substrate so as to improve a metrology sampling density.
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公开(公告)号：US11243470B2
公开(公告)日：2022-02-08
申请号：US16331547
申请日：2017-08-21
Applicant: ASML NETHERLANDS B.V.
Inventor： Nitish Kumar , Adrianus Johannes Hendrikus Schellekens , Sietse Thijmen Van Der Post , Ferry Zijp , Willem Maria Julia Marcel Coene , Peter Danny Van Voorst , Duygu Akbulut , Sarathi Roy
IPC: G03F7/20
Abstract: An optical system delivers illuminating radiation and collects radiation after interaction with a target structure on a substrate. A measurement intensity profile is used to calculate a measurement of the property of the structure. The optical system may include a solid immersion lens. In a method, the optical system is controlled to obtain a first intensity profile using a first illumination profile and a second intensity profile using a second illumination profile. The profiles are used to derive a correction for mitigating the effect of, e.g., ghost reflections. Using, e.g., half-moon illumination profiles in different orientations, the method can measure ghost reflections even where a solid immersion lens would cause total internal reflection. The optical system may include a contaminant detection system to control a movement based on received scattered detection radiation. The optical system may include an optical component having a dielectric coating to enhance evanescent wave interaction.
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Patent Agency Ranking
公开(公告)号：US11092902B2
公开(公告)日：2021-08-17
申请号：US16624609
申请日：2018-05-17
Applicant: ASML Netherlands B.V.
Inventor： Johannes Franciscus Martinus D'Achard Van Enschut , Tamara Druzhinina , Nitish Kumar , Sarathi Roy , Yang-Shan Huang , Arie Jeffrey Den Boef , Han-Kwang Nienhuys , Pieter-Jan Van Zwol , Sander Bas Roobol
Abstract: Disclosed is a method and associated inspection apparatus for detecting variations on a surface of a substrate. The method comprises providing patterned inspection radiation to a surface of a substrate. The inspection radiation is patterned such that an amplitude of a corresponding enhanced field is modulated in a manner corresponding to the patterned inspection radiation. The scattered radiation resultant from interaction between the enhanced field and the substrate surface is received and variations on the surface of the substrate are detected based on the interaction between the enhanced field and the substrate surface. Also disclosed is a method of detecting any changes to at least one characteristic of received radiation, the said changes being induced by the generation of a surface plasmon at said surface of the optical element.
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公开(公告)号：US12044979B2
公开(公告)日：2024-07-23
申请号：US18122655
申请日：2023-03-16
Applicant: ASML NETHERLANDS B.V.
Inventor： Wim Tjibbo Tel , Yichen Zhang , Sarathi Roy
CPC classification number: G03F7/705 , G03F7/70633 , G06F17/18 , G06F18/24
Abstract: A method for generating metrology sampling scheme for a patterning process, the method including: obtaining a parameter map of a parameter of a patterning process for a substrate; decomposing the parameter map to generate a fingerprint specific to an apparatus of the patterning process and/or a combination of apparatuses of the patterning process; and based on the fingerprint, generating a metrology sampling scheme for a subsequent substrate at the apparatus of the patterning process and/or the combination of apparatuses of the patterning process, wherein the sampling scheme is configured to distribute sampling points on the subsequent substrate so as to improve a metrology sampling density.
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公开(公告)号：US11994845B2
公开(公告)日：2024-05-28
申请号：US17367901
申请日：2021-07-06
Applicant: ASML NETHERLANDS B.V.
Inventor： Sarathi Roy , Edo Maria Hulsebos , Roy Werkman , Junru Ruan
IPC: G05B19/418 , G03F7/00 , G05B13/02 , G06N3/044
CPC classification number: G05B19/41875 , G03F7/70508 , G03F7/70525 , G05B13/027 , G05B19/41885 , G06N3/044 , G05B2219/33025 , G05B2219/45028 , G05B2219/45031
Abstract: A method for configuring a semiconductor manufacturing process, the method including: obtaining a first value of a first parameter based on measurements associated with a first operation of a process step in the semiconductor manufacturing process and a first sampling scheme; using a recurrent neural network to determine a predicted value of the first parameter based on the first value; and using the predicted value of the first parameter in configuring a subsequent operation of the process step in the semiconductor manufacturing process.
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公开(公告)号：US11281110B2
公开(公告)日：2022-03-22
申请号：US16973395
申请日：2019-05-20
Applicant: ASML NETHERLANDS B.V.
Inventor： Jeroen Van Dongen , Wim Tjibbo Tel , Sarathi Roy , Yichen Zhang , Andrea Cavalli , Bart Laurens Sjenitzer , Simon Philip Spencer Hastings
IPC: G03F7/20
Abstract: A method of determining a sampling control scheme and/or a processing control scheme for substrates processed by a device. The method uses a fingerprint model and an evolution model to generate the control scheme. The fingerprint model is based on fingerprint data for a processing parameter of at least one substrate processed by a device, and the evolution model represents variation of the fingerprint data over time. The fingerprint model and the evolution model are analyzed and a sampling and/or processing control scheme is generated using the analysis. The sampling control scheme provides an indication for where and when to take measurements on substrates processed by the device. The processing control scheme provides an indication for how to control the processing of the substrate. Also, there is provided a method of determining which of multiple devices contributed to a fingerprint of a processing parameter.
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公开(公告)号：US11150562B2
公开(公告)日：2021-10-19
申请号：US16486859
申请日：2018-02-22
Applicant: ASML NETHERLANDS B.V.
Inventor： Jelle Nije , Alexander Ypma , Dimitra Gkorou , Georgios Tsirogiannis , Robert Jan Van Wijk , Tzu-Chao Chen , Frans Reinier Spiering , Sarathi Roy , Cédric Désiré Grouwstra
IPC: G03F7/20
Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.
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