公开(公告)号：US11446788B2

公开(公告)日：2022-09-20

申请号：US16541641

申请日：2019-08-15

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Daniel Redfield ,  Mahendra C. Orilall ,  Boyi Fu ,  Ashwin Chockalingam ,  Ashavani Kumar ,  Fred C. Redeker ,  Nag B. Patibandla

IPC: B24D18/00 ,  B24D3/28 ,  B33Y80/00 ,  B33Y10/00

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US10199281B2

公开(公告)日：2019-02-05

申请号：US15891290

申请日：2018-02-07

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhihong Wang ,  Wen-Chiang Tu ,  Zhefu Wang ,  Hassan G. Iravani ,  Boguslaw A. Swedek ,  Fred C. Redeker ,  William H. McClintock

IPC: H01L21/66 ,  H01L21/321

Abstract: A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.

公开(公告)号：US20180166347A1

公开(公告)日：2018-06-14

申请号：US15891290

申请日：2018-02-07

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhihong Wang ,  Wen-Chiang Tu ,  Zhefu Wang ,  Hassan G. Iravani ,  Boguslaw A. Swedek ,  Fred C. Redeker ,  William H. McClintock

IPC: H01L21/66 ,  H01L21/321

CPC classification number: H01L22/14 ,  H01L21/3212 ,  H01L22/26 ,  H01L22/30

Abstract: A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.

公开(公告)号：US12194591B2

公开(公告)日：2025-01-14

申请号：US17684285

申请日：2022-03-01

Applicant: Applied Materials, Inc.

Inventor： Ekaterina A. Mikhaylichenko ,  Fred C. Redeker ,  Brian J. Brown ,  Chirantha Rodrigo ,  Steven M. Zuniga ,  Jay Gurusamy

IPC: B24B37/04 ,  B24B37/11

Abstract: A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.

公开(公告)号：US11958162B2

公开(公告)日：2024-04-16

申请号：US16746065

申请日：2020-01-17

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Kasiraman Krishnan ,  Mahendra C. Orilall ,  Daniel Redfield ,  Fred C. Redeker ,  Nag B. Patibandla ,  Gregory E. Menk ,  Jason G. Fung ,  Russell Edward Perry ,  Robert E. Davenport

IPC: B24B37/26 ,  B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24D18/00 ,  B29C64/112 ,  B33Y80/00

CPC classification number: B24B37/26 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24D18/0018 ,  B24D18/0045 ,  B29C64/112 ,  B33Y80/00

Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

公开(公告)号：US10786885B2

公开(公告)日：2020-09-29

申请号：US15875867

申请日：2018-01-19

Applicant: Applied Materials, Inc.

Inventor： Robert D. Tolles ,  Gregory E. Menk ,  Eric Davey ,  You Wang ,  Huyen Karen Tran ,  Fred C. Redeker ,  Veera Raghava Reddy Kakireddy ,  Ekaterina Mikhaylichenko ,  Jay Gurusamy

IPC: B24D11/00 ,  H01L21/306 ,  C09K3/14 ,  B24D3/22 ,  B24B37/26 ,  B24B37/20

Abstract: A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or “micro-features” and/or a plurality of grooves or “macro-features” formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.

公开(公告)号：US09873180B2

公开(公告)日：2018-01-23

申请号：US14695299

申请日：2015-04-24

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Kasiraman Krishnan ,  Mahendra C. Orilall ,  Daniel Redfield ,  Fred C. Redeker ,  Nag B. Patibandla ,  Gregory E. Menk ,  Jason G. Fung ,  Russell Edward Perry ,  Robert E. Davenport

IPC: B24B37/26 ,  B24B37/24 ,  B33Y80/00 ,  B24B37/20 ,  B24B37/22 ,  B24D18/00 ,  B29C64/112

CPC classification number: B24B37/26 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24D18/0045 ,  B29C64/112 ,  B33Y80/00

Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

公开(公告)号：US20220410335A1

公开(公告)日：2022-12-29

申请号：US17896008

申请日：2022-08-25

Applicant: Applied Materials, Inc.

Inventor： Paul D. Butterfield ,  Thomas H. Osterheld ,  Jeonghoon Oh ,  Shou-Sung Chang ,  Steven M. Zuniga ,  Fred C. Redeker

IPC: B24B37/005 ,  B24B37/013 ,  B24B49/12 ,  B24B37/20 ,  B24B41/02 ,  B24B53/02

Abstract: A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.

公开(公告)号：US11511388B2

公开(公告)日：2022-11-29

申请号：US16706465

申请日：2019-12-06

Applicant: Applied Materials, Inc.

Inventor： Paul D. Butterfield ,  Thomas H. Osterheld ,  Jeonghoon Oh ,  Shou-Sung Chang ,  Steven M. Zuniga ,  Fred C. Redeker

IPC: B24B37/30 ,  B24B41/02 ,  B24B37/00 ,  B24B37/005 ,  B24B37/013 ,  B24B49/12 ,  B24B37/20 ,  B24B53/02

Abstract: A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.

公开(公告)号：US10562147B2

公开(公告)日：2020-02-18

申请号：US15691416

申请日：2017-08-30

Applicant: Applied Materials, Inc.

Inventor： Paul D. Butterfield ,  Thomas H. Osterheld ,  Jeonghoon Oh ,  Shou-Sung Chang ,  Steven M. Zuniga ,  Fred C. Redeker

IPC: B24B37/20 ,  B24B37/005 ,  B24B37/013 ,  B24B49/12 ,  B24B41/02 ,  B24B53/02

Abstract: A polishing system includes a platen having a top surface, an annular polishing pad supported on the platen, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure from which the carrier head is suspended and which is configured to move the hold the carrier head laterally across the polishing pad, and a controller. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen, and the inner edge of the annular polishing pad is positioned around the axis of rotation. The controller is configured to cause the support structure to position the carrier head such that a portion of the substrate overhangs the inner edge of the annular polishing pad while the substrate is contacting the polishing pad.