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1.发明申请公开(公告)号：US20210100141A1
公开(公告)日：2021-04-01
申请号：US16890336
申请日：2020-06-02
Applicant: APPLIED MATERIALS, INC.
Inventor： Gayatri Natu , Geetika Bajaj , Prerna Goradia , Darshan Thakare , David Fenwick , XiaoMing He , Sanni Seppaelae , Jennifer Sun , Rajkumar Thanu , Jeff Hudgens , Karuppasamy Muthukamatchy , Arun Dhayalan
Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.
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2.发明授权公开(公告)号：US11547030B2
公开(公告)日：2023-01-03
申请号：US16890346
申请日：2020-06-02
Applicant: APPLIED MATERIALS, INC.
Inventor： Gayatri Natu , Geetika Bajaj , Prerna Goradia , Darshan Thakare , David Fenwick , XiaoMing He , Sanni Seppaelae , Jennifer Sun , Rajkumar Thanu , Jeff Hudgens , Karuppasamy Muthukamatchy , Arun Dhayalan
Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.
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公开(公告)号：US10818481B2
公开(公告)日：2020-10-27
申请号：US15215382
申请日：2016-07-20
Applicant: APPLIED MATERIALS, INC.
Inventor： Jennifer Sun , Yikai Chen , Biraja Kanungo , Vahid Firouzdor
Abstract: Embodiments involve smart device fabrication for semiconductor processing tools via precision patterning. In one embodiment, a method of manufacturing a semiconductor processing tool component includes providing a substrate of the semiconductor processing tool component, patterning the substrate to form a sensor directly on the substrate, and depositing a top layer over the sensor. The sensor may include, for example, a temperature or strain sensor. The method can also include patterning the substrate to form one or more of: heaters, thermistors, and electrodes on the substrate. In one embodiment, the method involves patterning a surface of the component oriented towards a plasma region inside of the semiconductor processing tool.
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公开(公告)号：US09420639B2
公开(公告)日：2016-08-16
申请号：US14077043
申请日：2013-11-11
Applicant: Applied Materials, Inc.
Inventor： Jennifer Sun , Yikai Chen , Biraja Kanungo , Vahid Firouzdor
CPC classification number: H01J37/32935 , C23C4/01 , C23C4/134 , H01J37/32495 , H01J37/32522 , H01J37/32724 , H01J2237/244 , H01J2237/332 , H01J2237/334 , H01L21/67069 , H05B1/0233 , H05B3/265 , H05B2203/013
Abstract: Embodiments involve smart device fabrication for semiconductor processing tools via precision patterning. In one embodiment, a method of manufacturing a semiconductor processing tool component includes providing a substrate of the semiconductor processing tool component, patterning the substrate to form a sensor directly on the substrate, and depositing a top layer over the sensor. The sensor may include, for example, a temperature or strain sensor. The method can also include patterning the substrate to form one or more of: heaters, thermistors, and electrodes on the substrate. In one embodiment, the method involves patterning a surface of the component oriented towards a plasma region inside of the semiconductor processing tool.
Abstract translation: 实施例涉及通过精密图案化的半导体加工工具的智能装置制造。 在一个实施例中，制造半导体处理工具部件的方法包括提供半导体加工工具部件的基板，图案化基板以在基板上直接形成传感器，以及在传感器上沉积顶层。 传感器可以包括例如温度或应变传感器。 该方法还可以包括图案化衬底以形成衬底上的一个或多个：加热器，热敏电阻和电极。 在一个实施例中，该方法包括图案化部件的表面朝向半导体处理工具内部的等离子体区域。
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公开(公告)号：US20150321964A1
公开(公告)日：2015-11-12
申请号：US14704742
申请日：2015-05-05
Applicant: Applied Materials, Inc.
Inventor： Jennifer Sun , Biraja Prasad Kanungo , Yikai Chen , Vahid Firouzdor
IPC: C04B35/50 , C04B35/10 , C23C4/04 , C04B35/48 , C23C4/12 , C04B35/505 , C04B35/515
Abstract: Disclosed herein are methods for producing an ultra-dense and ultra-smooth ceramic coating. A method includes feeding a slurry of ceramic particles into a plasma sprayer. The plasma sprayer generates a stream of particles directed toward the substrate, forming a ceramic coating on the substrate upon contact.
Abstract translation: 本文公开了用于生产超致密和超平滑陶瓷涂层的方法。 一种方法包括将陶瓷颗粒的浆料进料到等离子喷涂机中。 等离子体喷雾器产生指向衬底的颗粒流，在接触时在衬底上形成陶瓷涂层。
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Patent Agency Ranking
6.发明授权公开(公告)号：US12004337B2
公开(公告)日：2024-06-04
申请号：US17985065
申请日：2022-11-10
Applicant: Applied Materials, Inc.
Inventor： Gayatri Natu , Geetika Bajaj , Prerna Goradia , Darshan Thakare , David Fenwick , XiaoMing He , Sanni Seppaelae , Jennifer Sun , Rajkumar Thanu , Jeff Hudgens , Karuppasamy Muthukamatchy , Arun Dhayalan
IPC: H05K9/00 , H01J37/20 , H01J37/32 , H01L21/687 , H05F1/02
CPC classification number: H05K9/0064 , H01J37/20 , H01J37/32477 , H01J37/32495 , H01L21/68707 , H01L21/68757 , H05F1/02
Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.
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公开(公告)号：US20200325073A1
公开(公告)日：2020-10-15
申请号：US16912428
申请日：2020-06-25
Applicant: Applied Materials, Inc.
Inventor： Jennifer Sun , Biraja Prasad Kanungo , Yikai Chen , Vahid Firouzdor
IPC: C04B35/10 , C04B35/515 , C23C4/04 , C23C4/02 , C23C4/18 , C23C24/10 , C23C28/04 , C23C4/11 , C04B35/488 , C04B35/505 , C04B35/44 , C04B35/50 , C04B35/486 , C04B35/16
Abstract: Disclosed herein are methods for producing an ultra-dense and ultra-smooth ceramic coating. A method includes feeding a slurry of ceramic particles into a plasma sprayer. The plasma sprayer generates a stream of particles directed toward the substrate, forming a ceramic coating on the substrate upon contact.
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公开(公告)号：US10730798B2
公开(公告)日：2020-08-04
申请号：US14704742
申请日：2015-05-05
Applicant: Applied Materials, Inc.
Inventor： Jennifer Sun , Biraja Prasad Kanungo , Yikai Chen , Vahid Firouzdor
IPC: C23C4/02 , C23C4/04 , C23C4/10 , C04B35/10 , C04B35/515 , C23C4/12 , C23C4/18 , C23C24/10 , C23C28/04 , C23C4/11 , C04B35/488 , C04B35/505 , C04B35/44 , C04B35/50 , C04B35/486 , C04B35/16
Abstract: Disclosed herein are methods for producing an ultra-dense and ultra-smooth ceramic coating. A method includes feeding a slurry of ceramic particles into a plasma sprayer. The plasma sprayer generates a stream of particles directed toward the substrate, forming a ceramic coating on the substrate upon contact.
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9.发明授权公开(公告)号：US09597734B2
公开(公告)日：2017-03-21
申请号：US14534574
申请日：2014-11-06
Applicant: Applied Materials, Inc.
Inventor： Jennifer Sun , Sumanth Banda , Ren-Guan Duan
IPC: B23B31/28 , B23Q3/00 , B05B1/14 , B23B31/02 , B32B15/08 , C04B35/626 , C04B35/634 , C04B37/00 , C04B37/02 , H01L21/683
CPC classification number: B23B31/28 , B05B1/14 , B23B31/02 , B23Q3/00 , B32B15/08 , C04B35/6269 , C04B35/63424 , C04B37/005 , C04B37/006 , C04B37/008 , C04B37/025 , C04B37/026 , C04B37/028 , C04B2235/604 , C04B2237/064 , C04B2237/08 , C04B2237/12 , C04B2237/34 , C04B2237/343 , C04B2237/365 , C04B2237/366 , C04B2237/402 , C04B2237/55 , C04B2237/62 , H01L21/6831 , Y10T156/10 , Y10T279/23
Abstract: Embodiments of the present disclosure generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present disclosure provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.
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公开(公告)号：US20250149373A1
公开(公告)日：2025-05-08
申请号：US18545643
申请日：2023-12-19
Applicant: Applied Materials, Inc.
Inventor： Nitin Deepak , Jennifer Sun , Mayur Govind Kulkarni , Miguel S. Fung , Darius "D" Alexander-Jones , Chih Peng , Deenesh Padhi , Kwangduk Douglas Lee , Ganesh Balasubramanian , Juan Carlos Rocha-Alvarez , Simmon Kuo , Nagarajan Rajagopalan , Shankho Sen
IPC: H01L21/687
Abstract: Semiconductor components and systems having substrate contacting surfaces with a reduced hardness are provided. Systems and components include a ceramic, metallic, or non-metallic component for contacting a substrate. Systems and components include a layer of coating material on at least a portion of a substrate contacting surface of the component. Systems and components include where the component for contacting a substrate includes a component Vickers hardness value, and the layer of coating material exhibits a coating layer Vickers hardness value. Systems and components include where the coating layer Vickers hardness value is greater than or about 10% less than the component Vickers hardness value.
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