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公开(公告)号：US4422713A
公开(公告)日：1983-12-27
申请号：US369284
申请日：1982-04-16
CPC分类号： G03H1/181 , G03C1/66 , G03H2001/185 , G03H2260/10 , Y10S359/90
摘要： A method for making high diffraction efficiency holograms from dichromated gelatin (DCG) including the steps of curing the DCG for a specified time under controlled temperature and humidity conditions, periodically removing the DCG material from the curing conditions, placing a dye spot on the cured DCG material, measuring the extent of diffusion of the dye spot after a predetermined time, replacing the DCG material into the curing conditions, repeating the method until dye spot diffusion of a predetermined size occurs, and using the DCG material at that cure state to make holograms.
摘要翻译： 一种用于从重铬酸盐明胶（DCG）制备高衍射效率全息图的方法，包括在控制温度和湿度条件下固化DCG一段特定时间的步骤，从固化条件周期性地除去DCG材料，将染料斑点置于固化的DCG上 材料，测量在预定时间之后染料斑点的扩散程度，将DCG材料替换成固化条件，重复该方法直到发生预定尺寸的染料斑点扩散，并且在该固化状态下使用DCG材料制成全息图 。
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2.发明授权
公开(公告)号：US4427478A
公开(公告)日：1984-01-24
申请号：US392998
申请日：1982-06-28
申请人： Barbara D. Grant , Carol R. Jones
发明人： Barbara D. Grant , Carol R. Jones
CPC分类号： H05K7/06 , H05K3/386 , H05K2201/10287 , H05K3/103 , H05K3/4611
摘要： A process is described for fabricating an encapsulated circuit board. The process involves use of an adhesive which is photochemically curable to a limited preselected depth so as to rigidly fix the circuit wires in X and Y directions while permitting limited pliability of the adhesive and hence mobility of the wires in the Z direction. The adhesive preferably is one which is also thermally curable so that at a later stage of fabrication (e.g., either as a part of or after lamination of individual circuit boards into a multilayered circuit board), the complete unit may be thermally bulk cured to rigidly fix all wires in the Z direction.
摘要翻译： 描述了一种用于制造封装电路板的工艺。 该方法包括使用可光化学固化到有限的预选深度的粘合剂，以便将电路线刚性地固定在X和Y方向上，同时允许粘合剂的柔韧性受限并且因此导线在Z方向上的移动性。 粘合剂优选是也可热固化的粘合剂，使得在稍后的制造阶段（例如，作为将各个电路板层叠到多层电路板中的一部分或之后），完整单元可以热固化至刚性 将所有电线固定在Z方向。
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公开(公告)号：US4402573A
公开(公告)日：1983-09-06
申请号：US274988
申请日：1981-06-18
申请人： Carol R. Jones
发明人： Carol R. Jones
CPC分类号： G02F1/1521 , C09K9/02
摘要： A display device containing an electrochromic solution comprising a para substituted triphenylamine compound having the formula ##STR1## wherein R is lower alkoxy, lower alkyl or halogen.
摘要翻译： 包含电致变色溶液的显示装置，其包含具有下式的对位取代的三苯胺化合物，其中R是低级烷氧基，低级烷基或卤素。
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公开(公告)号：US4574095A
公开(公告)日：1986-03-04
申请号：US672975
申请日：1984-11-19
CPC分类号： C23C18/1879 , C23C18/1608 , C23C18/1612 , C23C18/182 , C23C18/1831 , C23C18/1868 , C23C18/204 , C23C18/30 , C23C18/38 , H05K3/184 , H05K2203/107
摘要： A process for selectively depositing copper by first selectively depositing palladium seeds by irradiating a palladium compound with light. Following the deposition of the palladium seeds, copper is deposited by an electroless process.
摘要翻译： 一种选择性沉积铜的方法，首先通过用光照射钯化合物来选择性地沉积钯种子。 在钯种子沉积之后，通过无电镀方法沉积铜。
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公开(公告)号：US5208067A
公开(公告)日：1993-05-04
申请号：US700833
申请日：1991-05-16
申请人： Carol R. Jones , Robin A. Susko
发明人： Carol R. Jones , Robin A. Susko
摘要： A silicon modified organic surface is roughened by treatment with an oxygen containing plasma. If necessary the organic surface may be silicon-modified by treatment with a silicon containing material prior to plasma treatment. The roughened organic surface provides improved adhesion to other organic surfaces and to deposited metals. Improvements in methods for laminating organic surfaces and for depositing metals on organic surfaces which achieve improved adhesion are disclosed. Structures comprising laminated organic layers or metal deposited on organic surfaces which provide improved adhesion between the organic layers or between the metal and the organic-surface are also disclosed.
摘要翻译： 通过用含氧等离子体处理使硅改性有机表面粗糙化。 如果需要，有机表面可以在等离子体处理之前用含硅材料进行硅改性。 粗糙的有机表面提供对其它有机表面和沉积金属的改善的粘合性。 公开了有机表面的层叠方法和在有机表面上沉积金属的方法的改进，这些改善了附着力。 还公开了包括层叠的有机层或沉积在有机表面上的金属的结构，其提供了有机层之间或金属与有机表面之间的改善的粘附性。
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公开(公告)号：US5039569A
公开(公告)日：1991-08-13
申请号：US449184
申请日：1989-12-13
申请人： Carol R. Jones , Robin A. Susko
发明人： Carol R. Jones , Robin A. Susko
CPC分类号： H05K3/381 , C23C18/22 , Y10T428/24355 , Y10T428/31663
摘要： A silicon-modified organic surface is roughened by treatment with an oxygen containing plasma. If necessary the organic surface may be silicon-modified by treatment with a silicon containing material prior to plasma treatment. The roughened organic surface provides improved adhesion to other organic surfaces and to deposited metals. Improvements in methods for laminating organic surfaces and for depositing metals on organic surfaces which achieve improved adhesion are disclosed. Structures comprising laminated organic layers of metal deposited on organic surfaces which provide improved adhesion between the organic layers or between the metal and the organic surface are also disclosed.
摘要翻译： 通过用含氧等离子体处理使硅改性有机表面粗糙化。 如果需要，有机表面可以在等离子体处理之前用含硅材料进行硅改性。 粗糙的有机表面提供对其它有机表面和沉积金属的改善的粘合性。 公开了有机表面的层叠方法和在有机表面上沉积金属的方法的改进，这些改善了附着力。 还公开了包括沉积在有机表面上的金属层的有机层的结构，其提供了有机层之间或金属和有机表面之间的改善的粘合性。
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公开(公告)号：US4908094A
公开(公告)日：1990-03-13
申请号：US93923
申请日：1987-09-08
申请人： Carol R. Jones , Robin A. Susko
发明人： Carol R. Jones , Robin A. Susko
摘要： A silicon-modified organic surface is roughened by treatment with an oxygen containing plasma. If necessary the organic surface may be silicon-modified by treatment with a silicon containing material prior to plasma treatment. The roughened organic surface provides improved adhesion to other organic surfaces and to deposited metals. Improvements in methods for laminating organic surfaces and for depositing metals on organic surfaces which achieve improved adhesion are disclosed. Structures comprising laminated organic layers or metal deposited on organic surfaces which provide improved adhesion between the organic layers or between the metal and the organic surface are also disclosed.
摘要翻译： 通过用含氧等离子体处理使硅改性有机表面粗糙化。 如果需要，有机表面可以在等离子体处理之前用含硅材料进行硅改性。 粗糙的有机表面提供对其它有机表面和沉积金属的改善的粘合性。 公开了有机表面的层叠方法和在有机表面上沉积金属的方法的改进，这些改善了附着力。 还公开了包含层叠的有机层或沉积在有机表面上的金属的结构，其提供了有机层之间或金属和有机表面之间的改善的粘附性。
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公开(公告)号：US4715941A
公开(公告)日：1987-12-29
申请号：US851856
申请日：1986-04-14
申请人： Carol R. Jones , Robin A. Susko
发明人： Carol R. Jones , Robin A. Susko
IPC分类号： H01L21/768 , C08J7/00 , C23C18/22 , H01L23/522 , H05K3/18 , H05K3/38 , C23C14/00
摘要： A silicon-modified organic surface is roughened by treatment with an oxygen containing plasma. If necessary the organic surface may be silicon-modified by treatment with a silicon containing material prior to plasma treatment. The roughened organic surface provides improved adhesion to other organic surfaces and to deposited metals. Improvements in methods for laminating organic surfaces and for depositing metals on organic surfaces which achieve improved adhesion are disclosed. Structures comprising laminated organic layers or metal deposited on organic surfaces which provide improved adhesion between the organic layers or between the metal and the organic surface are also disclosed.
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