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14 条记录 (耗时 0.024 秒)

    HIGH-EFFICIENCY LIGHT DIFFUSING POLYMERIC FILM AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    HIGH-EFFICIENCY LIGHT DIFFUSING POLYMERIC FILM AND MANUFACTURING METHOD THEREOF 有权
    高效光散射聚合物薄膜及其制造方法

    公开(公告)号：US20100295001A1

    公开(公告)日：2010-11-25

    申请号：US12496768

    申请日：2009-07-02

    申请人： Chang-Hoon SIM ,  Ki-Jeong Moon ,  Hae-Sang Jun

    发明人： Chang-Hoon SIM ,  Ki-Jeong Moon ,  Hae-Sang Jun

    IPC分类号： G02F1/361

    CPC分类号： G02B1/04 ,  C08J5/18 ,  C08J2323/06 ,  C08J2371/12 ,  G02B5/0242 ,  G02B5/0278

    摘要： A high-efficiency light diffusing polymeric film comprises a first polymer which is a light transmissible medium, and a second polymer which forms light scattering particles, wherein the polymers are immiscible and have a refractive index difference of about 0.001 to about 0.5, and the polymeric film comprises about 30 about to 70 parts by weight of the second polymer with respect to 100 parts by weight of the first polymer. A method for manufacturing a high-efficiency polymeric film is carried out such that a first polymer forms a continuous phase and a second polymer forms a dispersed phase through coating or extrusion.

    摘要翻译： 高效光扩散聚合物膜包括第一聚合物，其是透光介质，和形成光散射颗粒的第二聚合物，其中所述聚合物是不混溶的并且折射率差为约0.001至约0.5，聚合物 相对于100重量份的第一聚合物，膜包含约30至约70重量份的第二聚合物。 进行制造高效聚合物膜的方法，使得第一聚合物形成连续相，第二聚合物通过涂布或挤出形成分散相。

    High-efficiency light diffusing polymeric film and manufacturing method thereof
    2.
    发明授权
    High-efficiency light diffusing polymeric film and manufacturing method thereof 有权
    高效光漫射聚合物膜及其制造方法

    公开(公告)号：US08524833B2

    公开(公告)日：2013-09-03

    申请号：US12496768

    申请日：2009-07-02

    申请人： Chang-Hoon Sim ,  Ki-Jeong Moon ,  Hae-Sang Jun

    发明人： Chang-Hoon Sim ,  Ki-Jeong Moon ,  Hae-Sang Jun

    IPC分类号： C08L63/02 ,  F21V9/00

    CPC分类号： G02B1/04 ,  C08J5/18 ,  C08J2323/06 ,  C08J2371/12 ,  G02B5/0242 ,  G02B5/0278

    摘要： A high-efficiency light diffusing polymeric film comprises a first polymer which is a light transmissible medium, and a second polymer which forms light scattering particles, wherein the polymers are immiscible and have a refractive index difference of about 0.001 to about 0.5, and the polymeric film comprises about 30 about to 70 parts by weight of the second polymer with respect to 100 parts by weight of the first polymer. A method for manufacturing a high-efficiency polymeric film is carried out such that a first polymer forms a continuous phase and a second polymer forms a dispersed phase through coating or extrusion.

    摘要翻译： 高效光扩散聚合物膜包括第一聚合物，其是透光介质，和形成光散射颗粒的第二聚合物，其中所述聚合物是不混溶的，折射率差为约0.001至约0.5，聚合物 相对于100重量份的第一聚合物，膜包含约30至约70重量份的第二聚合物。 进行制造高效聚合物膜的方法，使得第一聚合物形成连续相，第二聚合物通过涂布或挤出形成分散相。

    ANISOTROPIC CONDUCTIVE FILM AND ADHESION METHOD THEREOF
    4.
    发明申请
    ANISOTROPIC CONDUCTIVE FILM AND ADHESION METHOD THEREOF 审中-公开
    各向异性导电膜及其粘合方法

    公开(公告)号：US20090294046A1

    公开(公告)日：2009-12-03

    申请号：US11950454

    申请日：2007-12-05

    申请人： Chang-Hoon SIM ,  Ki-Jeong Moon ,  Hae-Sang Jun

    发明人： Chang-Hoon SIM ,  Ki-Jeong Moon ,  Hae-Sang Jun

    IPC分类号： B32B37/00 ,  H01B5/00

    CPC分类号： H01B1/22 ,  H05K3/323 ,  H05K2201/083 ,  H05K2203/104

    摘要： The invention concerns an anisotropic conductive film used for adhering IC, e.g., LCD displays, etc. The conductive film is characterized by comprising a thermosetting adhesive, super-paramagnetic metal oxide nano-particles, and conductive particles, the super-paramagnetic metal oxide nano-particles and the conductive particles being dispersed in a thermosetting composition. With such a configuration in the invention, it is advantageous that low temperature curing is implemented by means of high frequencies and positions of particles can be controlled by means of a magnetic field in adhering IC, e.g., LCD displays, so that high connection reliability is achieved for connection electrodes of fine pitches.

    摘要翻译： 本发明涉及用于粘附IC的各向异性导电膜，例如LCD显示器等。导电膜的特征在于包括热固性粘合剂，超顺磁性金属氧化物纳米颗粒和导电颗粒，超顺磁性金属氧化物纳米 颗粒和导电颗粒分散在热固性组合物中。 通过本发明的这样的结构，通过高频实现低温固化是有利的，并且可以通过粘附IC（例如LCD显示器）中的磁场来控制颗粒的位置，使得高连接可靠性 实现了细间距连接电极。

    ADHESIVE FILM FOR STACKING SEMICONDUCTOR CHIPS
    5.
    发明申请
    ADHESIVE FILM FOR STACKING SEMICONDUCTOR CHIPS 有权
    用于堆叠半导体芯片的粘合膜

    公开(公告)号：US20080226884A1

    公开(公告)日：2008-09-18

    申请号：US11950470

    申请日：2007-12-05

    申请人： Chang-Hoon SIM ,  Ki-Jeong Moon ,  Hae-Sang Jun ,  Jun-Ho Lee ,  Yun-Min Park

    发明人： Chang-Hoon SIM ,  Ki-Jeong Moon ,  Hae-Sang Jun ,  Jun-Ho Lee ,  Yun-Min Park

    IPC分类号： B32B7/02 ,  B32B27/38

    CPC分类号： H01L24/83 ,  C09J7/10 ,  C09J2201/36 ,  C09J2461/00 ,  C09J2463/00 ,  H01L25/0657 ,  H01L2224/26135 ,  H01L2224/29083 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01012 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/351 ,  Y10T428/24975 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00

    摘要： The invention concerns an adhesive film for stacking chips which enables chips to be stacked in layers without using a separate spacer usually provided to keep a given distance between wires of an upper chip and a lower chip to have the same area. The adhesive film of the invention has an intermediate adhesive layer of thermoplastic phenoxy resin on both side of which a thermosetting adhesive layer of epoxy resin is placed, respectively, to make a three-layer structure, the thermoplastic phenoxy resin comprising UV curable small molecule compounds. The adhesive film of the invention is a multi-layered adhesive film produced by a method of comprising the steps of achieving compatibility on an interface between the thermosetting epoxy resin and thermoplastic phenoxy resin and then directly forming a phenoxy film of a high elastic modulus through UV curing in an adhesive film. With such a configuration, the adhesive film for stacking semiconductor chips according to the invention enables the semiconductor silicone chips to be stacked in 3 or more layers without using a separate spacer between chips in order to keep a wire distance between upper and lower chips in stacking the chips. With the configuration, it is advantageous that reliability of semiconductors is not lowered because adhesiveness is kept despite of a repeated process of stacking chips subject to high temperature.

    摘要翻译： 本发明涉及一种用于堆叠芯片的粘合膜，其使得芯片能够层叠而不使用通常设置用于保持上芯片和下芯片的导线之间的给定距离的单独间隔件具有相同的面积。 本发明的粘合膜具有热塑性苯氧基树脂的中间粘合剂层，其两侧分别放置环氧树脂的热固性粘合剂层以制成三层结构，所述热塑性苯氧基树脂包含可UV固化的小分子化合物 。 本发明的粘合膜是通过以下方法制造的多层粘合膜，该粘合膜包括以下步骤：在热固性环氧树脂和热塑性苯氧基树脂之间的界面上实现相容性，然后通过UV直接形成具有高弹性模量的苯氧基膜 在粘合膜中固化。 通过这样的结构，根据本发明的用于堆叠半导体芯片的粘合膜能够使半导体硅芯片层叠成3层以上，而不需要在芯片之间使用单独的间隔物，以便在堆叠中保持上下芯片之间的线间距 芯片。 通过该结构，由于尽管重叠堆叠处于高温的芯片的过程，因此保持了粘附性，因此有利的是半导体的可靠性不降低。

    POLYMER ELECTROLYTES FOR DYE-SENSITIZED SOLAR CELLS AND METHOD FOR MANUFACTURING MODULES OF DYE-SENSITIZED SOLAR CELLS USING THE SAME
    7.
    发明申请
    POLYMER ELECTROLYTES FOR DYE-SENSITIZED SOLAR CELLS AND METHOD FOR MANUFACTURING MODULES OF DYE-SENSITIZED SOLAR CELLS USING THE SAME 有权
    用于染料敏化太阳能电池的聚合物电解质及使用其制造透明的太阳能电池模块的方法

    公开(公告)号：US20120009715A1

    公开(公告)日：2012-01-12

    申请号：US13254241

    申请日：2010-03-22

    申请人： Chang-Hoon Sim ,  Sang-Pil Kim ,  Ki-Jeong Moon

    发明人： Chang-Hoon Sim ,  Sang-Pil Kim ,  Ki-Jeong Moon

    IPC分类号： H01L31/18 ,  H01G9/028

    CPC分类号： H01G9/2009 ,  H01G9/2031 ,  H01G9/2059 ,  Y02E10/542 ,  Y02P70/521

    摘要： This disclosure provides polymer electrolytes for dye-sensitized solar cells that can not only prevent electrolytes from leaking, but also exhibit a higher solar conversion efficiency when compared with conventional polymer electrolytes, whereby the polymer electrolytes are applicable to a process for manufacturing dye-sensitized solar cells with a large surface area or flexible dye-sensitized solar cells, and methods for manufacturing modules of dye-sensitized solar cells using the same.

    摘要翻译： 该公开内容提供了用于染料敏化太阳能电池的聚合物电解质，其不仅可以防止电解质泄漏，而且与常规的聚合物电解质相比也显示出更高的太阳能转换效率，由此聚合物​​电解质可用于制造染料敏化太阳能的方法 具有大表面积的电池或柔性染料敏化太阳能电池，以及使用其制造染料敏化太阳能电池组件的方法。

    HEAT-RESISTANT ADHESIVE SHEET
    9.
    发明申请
    HEAT-RESISTANT ADHESIVE SHEET 审中-公开
    耐热粘合片

    公开(公告)号：US20100247906A1

    公开(公告)日：2010-09-30

    申请号：US12159839

    申请日：2007-08-22

    申请人： Jun-Ho Lee ,  Hae-Sang Jeun ,  Ki-Jeong Moon ,  Chang-Hoon Sim

    发明人： Jun-Ho Lee ,  Hae-Sang Jeun ,  Ki-Jeong Moon ,  Chang-Hoon Sim

    IPC分类号： C09J7/02 ,  B32B15/08 ,  B32B7/12

    CPC分类号： H01L21/6835 ,  C09J7/22 ,  C09J7/30 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2401/006 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2477/006 ,  C09J2479/086 ,  C09J2481/006 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/2804 ,  Y10T428/2809 ,  H01L2924/00

    摘要： The present invention relates to a heat-resistant adhesive sheet (tape). More particularly, the invention relates to a heat-resistant adhesive sheet of high reliability and workability, in which crosslink reaction can be induced through irradiation of energy rays on an adhesive layer to achieve heat resistance at high temperature and also high dimension stability in parts, to achieve release without leaving any adhesive residues on an attached surface in releasing the layer and also to achieve no oxidation on the attached surface, e.g., a metallic surface at a high temperature. To this end, the heat-resistant adhesive sheet (tape) according to the invention is characterized by comprising a heat-resistant substrate, and an adhesive layer formed on at least one side of the heat-resistant substrate and made with a coating of liquid comprising energy ray curable olygomer resin, thermosetting adhesive resin, energy ray initiator and thermosetting agent, the adhesive layer being cured and heat resistant by irradiating energy rays to induce crosslink reaction.

    摘要翻译： 本发明涉及耐热粘合片（胶带）。 更具体地说，本发明涉及一种高可靠性和可加工性的耐热粘合片，其中可以通过在粘合剂层上照射能量射线来实现交联反应，以实现高温下的耐热性和部件中的高尺寸稳定性， 以在释放层中实现释放而不在附着表面上留下任何粘合剂残留物，并且也在附着的表面（例如高温下的金属表面）上实现不氧化。 为此，根据本发明的耐热粘合片（带）的特征在于包括耐热基材和形成在耐热基材的至少一侧上并由液体涂层制成的粘合剂层 包括能量射线固化性聚合胶体树脂，热固性粘合树脂，能量射线引发剂和热固性剂，粘合剂层通过照射能量射线固化并耐热以引起交联反应。