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    Patterned substrate for hetero-epitaxial growth of group-III nitride film
    3.
    发明授权
    Patterned substrate for hetero-epitaxial growth of group-III nitride film 有权
    III族氮化物膜的异质外延生长图案化衬底

    公开(公告)号：US08435820B2

    公开(公告)日：2013-05-07

    申请号：US13418098

    申请日：2012-03-12

    申请人： Chen-Hua Yu ,  Ding-Yuan Chen

    发明人： Chen-Hua Yu ,  Ding-Yuan Chen

    IPC分类号： H01L21/56

    CPC分类号： H01L27/156 ,  H01L31/0304 ,  H01L31/1035 ,  H01L33/007 ,  H01L33/20

    摘要： A circuit structure includes a substrate and a film over the substrate and including a plurality of portions allocated as a plurality of rows. Each of the plurality of rows of the plurality of portions includes a plurality of convex portions and a plurality of concave portions. In each of the plurality of rows, the plurality of convex portions and the plurality of concave portions are allocated in an alternating pattern.

    摘要翻译： 电路结构包括衬底和衬底上的膜，并且包括分配为多行的多个部分。 多个部分的多行中的每一个包括多个凸部和多个凹部。 在多行中的每一行中，以交替图案分配多个凸部和多个凹部。

    III-V compound semiconductor epitaxy from a non-III-V substrate
    4.
    发明授权
    III-V compound semiconductor epitaxy from a non-III-V substrate 有权
    III-V族化合物半导体外延从非III-V衬底

    公开(公告)号：US08377796B2

    公开(公告)日：2013-02-19

    申请号：US12539374

    申请日：2009-08-11

    申请人： Chia-Lin Yu ,  Chen-Hua Yu ,  Ding-Yuan Chen ,  Wen-Chih Chiou

    发明人： Chia-Lin Yu ,  Chen-Hua Yu ,  Ding-Yuan Chen ,  Wen-Chih Chiou

    IPC分类号： H01L21/768

    CPC分类号： H01L21/02365 ,  H01L21/02104 ,  H01L21/0237 ,  H01L21/02381 ,  H01L21/02458 ,  H01L21/02491 ,  H01L21/02502 ,  H01L21/02538 ,  H01L21/02639 ,  H01L21/02642 ,  H01L21/02645 ,  H01L29/12

    摘要： A method of forming a circuit structure includes providing a substrate; forming recesses in the substrate; forming a mask layer over the substrate, wherein the mask layer covers non-recessed portions of the substrate, with the recesses exposed through openings in the mask layer; forming a buffer/nucleation layer on exposed portions of the substrate in the recesses; and growing a group-III group-V (III-V) compound semiconductor material from the recesses until portions of the III-V compound semiconductor material grown from the recesses join each other to form a continuous III-V compound semiconductor layer.

    摘要翻译： 形成电路结构的方法包括提供基板; 在基板上形成凹部; 在所述基板上形成掩模层，其中所述掩模层覆盖所述基板的非凹部，所述凹部通过所述掩模层中的开口暴露; 在所述凹部中的所述基板的暴露部分上形成缓冲/成核层; 以及从所述凹部生长第III族V族化合物半导体材料，直到从所述凹部生长的所述III-V族化合物半导体材料的部分相互连接形成连续的III-V族化合物半导体层。

    LED device with embedded top electrode
    5.
    发明授权
    LED device with embedded top electrode 有权
    带嵌入式顶部电极的LED器件

    公开(公告)号：US08278679B2

    公开(公告)日：2012-10-02

    申请号：US12235269

    申请日：2008-09-22

    申请人： Chen-Hua Yu ,  Ding-Yuan Chen ,  Wen-Chih Chiou

    发明人： Chen-Hua Yu ,  Ding-Yuan Chen ,  Wen-Chih Chiou

    IPC分类号： H01L33/00

    CPC分类号： H01L33/42 ,  H01L33/005 ,  H01L33/20 ,  H01L33/382 ,  H01L33/405

    摘要： An LED device and a method of manufacturing, including an embedded top electrode, are presented. The LED device includes an LED structure and a top electrode. The LED structure includes layers disposed on a substrate, including an active light-emitting region. A top layer of the LED structure is a top contact layer. The top electrode is embedded into the top contact layer, wherein the top electrode electrically contacts the top contact layer.

    摘要翻译： 提出了一种LED器件及其制造方法，包括嵌入式顶部电极。 LED装置包括LED结构和顶部电极。 LED结构包括设置在基板上的层，包括有源发光区域。 LED结构的顶层是顶部接触层。 顶部电极嵌入到顶部接触层中，其中顶部电极电接触顶部接触层。

    Light-emitting diodes on concave texture substrate
    7.
    发明授权
    Light-emitting diodes on concave texture substrate 有权
    凹面纹理基板上的发光二极管

    公开(公告)号：US08134163B2

    公开(公告)日：2012-03-13

    申请号：US12247895

    申请日：2008-10-08

    申请人： Chen-Hua Yu ,  Hung-Ta Lin ,  Wen-Chih Chiou ,  Ding-Yuan Chen ,  Chia-Lin Yu

    发明人： Chen-Hua Yu ,  Hung-Ta Lin ,  Wen-Chih Chiou ,  Ding-Yuan Chen ,  Chia-Lin Yu

    IPC分类号： H01L33/08

    CPC分类号： H01L33/48 ,  H01L33/20 ,  H01L33/24

    摘要： A semiconductor device having light-emitting diodes (LEDs) formed on a concave textured substrate is provided. A substrate is patterned and etched to form recesses. A separation layer is formed along the bottom of the recesses. An LED structure is formed along the sidewalls and, optionally, along the surface of the substrate between adjacent recesses. In these embodiments, the surface area of the LED structure is increased as compared to a planar surface. In another embodiment, the LED structure is formed within the recesses such that the bottom contact layer is non-conformal to the topology of the recesses. In these embodiments, the recesses in a silicon substrate result in a cubic structure in the bottom contact layer, such as an n-GaN layer, which has a non-polar characteristic and exhibits higher external quantum efficiency.

    摘要翻译： 提供了一种形成在凹面纹理基板上的发光二极管（LED）的半导体器件。 对衬底进行图案化和蚀刻以形成凹陷。 沿着凹部的底部形成分离层。 沿着侧壁和任选地沿着相邻凹部之间的基板的表面形成LED结构。 在这些实施例中，与平面表面相比，LED结构的表面积增加。 在另一个实施例中，LED结构形成在凹部内，使得底部接触层与凹部的拓扑不一致。 在这些实施例中，硅衬底中的凹陷导致底接触层中的立方结构，例如具有非极性特性并且表现出更高外部量子效率的n-GaN层。

    III-V Compound Semiconductor Epitaxy From a Non-III-V Substrate
    8.
    发明申请
    III-V Compound Semiconductor Epitaxy From a Non-III-V Substrate 有权
    III-V族化合物半导体外延从非III-V基片

    公开(公告)号：US20100068866A1

    公开(公告)日：2010-03-18

    申请号：US12539374

    申请日：2009-08-11

    申请人： Chia-Lin Yu ,  Chen-Hua Yu ,  Ding-Yuan Chen ,  Wen-Chih Chiou

    发明人： Chia-Lin Yu ,  Chen-Hua Yu ,  Ding-Yuan Chen ,  Wen-Chih Chiou

    IPC分类号： H01L21/768

    CPC分类号： H01L21/02365 ,  H01L21/02104 ,  H01L21/0237 ,  H01L21/02381 ,  H01L21/02458 ,  H01L21/02491 ,  H01L21/02502 ,  H01L21/02538 ,  H01L21/02639 ,  H01L21/02642 ,  H01L21/02645 ,  H01L29/12

    摘要： A method of forming a circuit structure includes providing a substrate; forming recesses in the substrate; forming a mask layer over the substrate, wherein the mask layer covers non-recessed portions of the substrate, with the recesses exposed through openings in the mask layer; forming a buffer/nucleation layer on exposed portions of the substrate in the recesses; and growing a group-III group-V (III-V) compound semiconductor material from the recesses until portions of the III-V compound semiconductor material grown from the recesses join each other to form a continuous III-V compound semiconductor layer.

    摘要翻译： 形成电路结构的方法包括提供基板; 在基板上形成凹部; 在所述基板上形成掩模层，其中所述掩模层覆盖所述基板的非凹部，所述凹部通过所述掩模层中的开口暴露; 在所述凹部中的所述基板的暴露部分上形成缓冲/成核层; 以及从所述凹部生长第III族V族化合物半导体材料，直到从所述凹部生长的所述III-V族化合物半导体材料的部分相互连接形成连续的III-V族化合物半导体层。

    Light-Emitting Diode with Embedded Elements
    9.
    发明申请
    Light-Emitting Diode with Embedded Elements 有权
    具有嵌入元件的发光二极管

    公开(公告)号：US20100059779A1

    公开(公告)日：2010-03-11

    申请号：US12547428

    申请日：2009-08-25

    申请人： Ding-Yuan Chen ,  Wen-Chih Chiou ,  Chen-Hua Yu

    发明人： Ding-Yuan Chen ,  Wen-Chih Chiou ,  Chen-Hua Yu

    IPC分类号： H01L33/00

    CPC分类号： H01L33/44 ,  H01L33/08 ,  H01L33/20

    摘要： A light-emitting diode (LED) device is provided. The LED device has a substrate and an LED structure overlying the substrate. Embedded elements are embedded within one or more layers of the LED structure. In an embodiment, the embedded elements include a dielectric material extending through the LED structure such that the embedded elements are surrounded by the LED structure. In another embodiment, the embedded elements only extend through an upper layer of the LED structure, or alternatively, partially through the upper layer of the LED structure. Another conductive layer may be formed over the upper layer of the LED structure and the embedded elements.

    摘要翻译： 提供了一种发光二极管（LED）装置。 LED器件具有衬底和覆盖衬底的LED结构。 嵌入式元件嵌入LED结构的一层或多层内。 在一个实施例中，嵌入元件包括延伸穿过LED结构的电介质材料，使得嵌入元件被LED结构包围。 在另一个实施例中，嵌入式元件仅延伸穿过LED结构的上层，或者部分地穿过LED结构的上层。 另外的导电层可以形成在LED结构的上层和嵌入元件上。

    Light-Emitting Diode With Non-Metallic Reflector
    10.
    发明申请
    Light-Emitting Diode With Non-Metallic Reflector 有权
    具有非金属反射器的发光二极管

    公开(公告)号：US20100038661A1

    公开(公告)日：2010-02-18

    申请号：US12269497

    申请日：2008-11-12

    申请人： Ding-Yuan Chen ,  Wen-Chih Chiou ,  Chen-Hua Yu

    发明人： Ding-Yuan Chen ,  Wen-Chih Chiou ,  Chen-Hua Yu

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/16 ,  H01L33/0079 ,  H01L33/10

    摘要： A light-emitting diode (LED) device is provided. The LED device has a substrate, a reflective structure over the substrate, and an LED structure over the reflective structure. The reflective structure is formed of non-metallic materials. In one embodiment, the reflective structure is formed of alternating layers of different non-metallic materials having different refractive indices. In another embodiment, the reflective structure is formed of alternating layers of high-porosity silicon and low-porosity silicon. In yet another embodiment, the reflective structure is formed of silicon dioxide, which may allow the use of fewer layers. The reflective structure may be formed directly on the same substrate as the LED structure or formed on a separate substrate and then bonded to the LED structure.

    摘要翻译： 提供了一种发光二极管（LED）装置。 LED器件具有衬底，衬底上的反射结构以及反射结构上的LED结构。 反射结构由非金属材料形成。 在一个实施例中，反射结构由具有不同折射率的不同非金属材料的交替层形成。 在另一个实施例中，反射结构由高孔隙率硅和低孔隙率硅的交替层形成。 在另一个实施例中，反射结构由二氧化硅形成，其可以允许使用更少的层。 反射结构可以直接形成在与LED结构相同的基板上，或者形成在单独的基板上，然后结合到LED结构。