公开(公告)号：US5777335A

公开(公告)日：1998-07-07

申请号：US721947

申请日：1996-09-27

申请人： Chiori Mochizuki ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Tadao Endo ,  Toshikazu Tamura

发明人： Chiori Mochizuki ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Tadao Endo ,  Toshikazu Tamura

IPC分类号： G01T1/20 ,  H01L27/14 ,  H01L27/146 ,  H04N5/32 ,  G01T1/29

CPC分类号： G01T1/2018

摘要： An imaging apparatus whose substrate or base stand is arranged to be a member to absorb or shield radiation in order to prevent semiconductor element, such as ICs, provided for driving photoelectric elements from making any malfunction or from being deteriorated by the irradiation of radiation, such as X-rays or .gamma.-rays, transmitted from the photoelectric conversion element substrate or base stand or in order to prevent radiation from being scattered.

摘要翻译： 一种成像装置，其基板或基座被布置为吸收或屏蔽辐射的部件，以便防止为驱动光电元件而导致的光电元件的半导体元件（例如IC）发生故障或由辐射照射而劣化 作为从光电转换元件基板或基座传送的X射线或γ射线，或者为了防止辐射被散射。

公开(公告)号：US06352875B1

公开(公告)日：2002-03-05

申请号：US09176258

申请日：1998-10-21

申请人： Shinichi Hayashi ,  Akira Funakoshi ,  Akira Tago ,  Satoshi Okada ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Chiori Mochizuki ,  Tadao Endo ,  Toshikazu Tamura

发明人： Shinichi Hayashi ,  Akira Funakoshi ,  Akira Tago ,  Satoshi Okada ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Chiori Mochizuki ,  Tadao Endo ,  Toshikazu Tamura

IPC分类号： H01L310203

CPC分类号： H01L27/14618 ,  H01L24/14 ,  H01L27/14634 ,  H01L27/14676 ,  H01L31/0203 ,  H01L31/02322 ,  H01L2924/12042 ,  H01L2924/351 ,  Y10T156/1077 ,  Y10T156/1092 ,  H01L2924/00

摘要： In a photoelectric conversion apparatus obtained by arranging and fixing a plurality of semiconductor element substrates onto a base with an adhesive, the levels of the upper surfaces of the substrates are adjusted with a desired thickness of the adhesive so as to set the upper surfaces within the same plane while the distance from the upper surface of the base to the semiconductor element surface of each substrate is kept to a design value, thereby realizing a photoelectric conversion apparatus constituted by a plurality of substrates arranged two-dimensionally, which eliminates level gaps between the substrates, and hence is free from problems such as a decrease in resolution, a deterioration in sensitivity, and peeling of a phosphor and the like.

摘要翻译： 在通过使用粘合剂将多个半导体元件基板布置并固定到基底上而获得的光电转换装置中，以期望的粘合剂厚度调整基板的上表面的水平，以将上表面设置在 从基板的上表面到每个基板的半导体元件表面的距离保持相同的平面，从而实现由二维排列的多个基板构成的光电转换装置，从而消除了 基板，因此没有诸如分辨率降低，灵敏度降低和荧光体剥离等问题。

公开(公告)号：US6049074A

公开(公告)日：2000-04-11

申请号：US379630

申请日：1999-08-24

申请人： Tadao Endo ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Toshikazu Tamura ,  Minoru Watanabe

发明人： Tadao Endo ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Toshikazu Tamura ,  Minoru Watanabe

IPC分类号： G01T1/20 ,  H01J35/10 ,  H01L27/00 ,  H01L27/14 ,  H01L27/144 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/115 ,  H04N5/32

CPC分类号： H01L27/14663 ,  H01L27/1446 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14676 ,  H01L31/02 ,  H01L31/02322 ,  H01L31/024 ,  H01L31/085 ,  H01L31/115 ,  H01L2924/0002 ,  H04N5/32

摘要： In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.

摘要翻译： 在包括外围IC的光电转换装置中，外围IC通过导热部件与具有光电转换元件的基板和底板热接触，该基板覆盖外围IC并具有高导热性，以消除不利影响 的外部IC产生的热量，例如低S / N比。

公开(公告)号：US5965872A

公开(公告)日：1999-10-12

申请号：US107283

申请日：1998-06-30

申请人： Tadao Endo ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Toshikazu Tamura ,  Minoru Watanabe

发明人： Tadao Endo ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Toshikazu Tamura ,  Minoru Watanabe

IPC分类号： G01T1/20 ,  H01J35/10 ,  H01L27/00 ,  H01L27/14 ,  H01L27/144 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/115 ,  H04N5/32

CPC分类号： H01L27/14663 ,  H01L27/1446 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14676 ,  H01L31/02 ,  H01L31/02322 ,  H01L31/024 ,  H01L31/085 ,  H01L31/115 ,  H01L2924/0002 ,  H04N5/32

摘要： In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.

摘要翻译： 在包括外围IC的光电转换装置中，外围IC通过导热部件与具有光电转换元件的基板和底板热接触，该基板覆盖外围IC并具有高导热性，以消除不利影响 的外部IC产生的热量，例如低S / N比。

公开(公告)号：US5856699A

公开(公告)日：1999-01-05

申请号：US733772

申请日：1996-10-18

申请人： Shinichi Hayashi ,  Akira Funakoshi ,  Akira Tago ,  Satoshi Okada ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Chiori Mochizuki ,  Tadao Endo ,  Toshikazu Tamura

发明人： Shinichi Hayashi ,  Akira Funakoshi ,  Akira Tago ,  Satoshi Okada ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Chiori Mochizuki ,  Tadao Endo ,  Toshikazu Tamura

IPC分类号： G01J1/44 ,  G01T1/20 ,  H01L27/14 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/042 ,  H01L31/09 ,  H01L31/14 ,  H04N1/028 ,  H04N1/04 ,  H04N5/335 ,  H05K3/30

CPC分类号： H01L27/14618 ,  H01L24/14 ,  H01L27/14634 ,  H01L31/0203 ,  H01L31/02322 ,  H01L27/14676 ,  H01L2924/12042 ,  H01L2924/351 ,  Y10T156/1077 ,  Y10T156/1092

摘要： In a photoelectric conversion apparatus obtained by arranging and fixing a plurality of semiconductor element substrates onto a base with an adhesive, the levels of the upper surfaces of the substrates are adjusted with a desired thickness of the adhesive so as to set the upper surfaces within the same plane while the distance from the upper surface of the base to the semiconductor element surface of each substrate is kept to a design value, thereby realizing a photoelectric conversion apparatus constituted by a plurality of substrates arranged two-dimensionally, which eliminates level gaps between the substrate, and hence is free from problems such as a decrease in resolution, a deterioration in sensitivity, and peeling of a phosphor and the like.

摘要翻译： 在通过使用粘合剂将多个半导体元件基板布置并固定到基底上而获得的光电转换装置中，以期望的粘合剂厚度调整基板的上表面的水平，以将上表面设置在 从基板的上表面到每个基板的半导体元件表面的距离保持相同的平面，从而实现由二维排列的多个基板构成的光电转换装置，从而消除了 基板，因此没有诸如分辨率降低，灵敏度劣化和荧光体剥离等问题。

公开(公告)号：US5811790A

公开(公告)日：1998-09-22

申请号：US803106

申请日：1997-02-20

申请人： Tadao Endo ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Toshikazu Tamura ,  Minoru Watanabe

发明人： Tadao Endo ,  Akira Funakoshi ,  Akira Tago ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Toshikazu Tamura ,  Minoru Watanabe

IPC分类号： G01T1/20 ,  H01J35/10 ,  H01L27/00 ,  H01L27/14 ,  H01L27/144 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/115 ,  H04N5/32

CPC分类号： H01L27/14663 ,  H01L27/1446 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14676 ,  H01L31/02 ,  H01L31/02322 ,  H01L31/024 ,  H01L31/085 ,  H01L31/115 ,  H01L2924/0002 ,  H04N5/32

摘要： In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.

摘要翻译： 在包括外围IC的光电转换装置中，外围IC通过导热部件与具有光电转换元件的基板和底板热接触，该基板覆盖外围IC并具有高导热性，以消除不利影响 的外部IC产生的热量，例如低S / N比。

公开(公告)号：US5793047A

公开(公告)日：1998-08-11

申请号：US710948

申请日：1996-09-24

申请人： Isao Kobayashi ,  Akira Funakoshi ,  Akira Tago ,  Noriyuki Kaifu ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Tadao Endo ,  Toshikazu Tamura ,  Kazuaki Tashiro

发明人： Isao Kobayashi ,  Akira Funakoshi ,  Akira Tago ,  Noriyuki Kaifu ,  Shinichi Takeda ,  Eiichi Takami ,  Masakazu Morishita ,  Shinichi Hayashi ,  Chiori Mochizuki ,  Tadao Endo ,  Toshikazu Tamura ,  Kazuaki Tashiro

IPC分类号： G01J1/44 ,  G01T1/24 ,  H01L21/02 ,  H01L27/12 ,  H01L27/146 ,  H04N1/028 ,  H04N1/04 ,  H04N5/335 ,  H04N5/369 ,  H04N9/07 ,  G01T1/20

CPC分类号： H01L27/14609 ,  H01L27/14623 ,  H01L27/14663

摘要： A photoelectric conversion apparatus comprises a plurality of transparent substrates. Each of the substrates has a a plurality of photoelectric conversion elements on a front surface thereof on a base. A light-absorbing member is provided on at least one of a rear surface and end faces of the substrate.

摘要翻译： 光电转换装置包括多个透明基板。 每个基板在其前表面上具有多个光电转换元件。 光吸收构件设置在基板的后表面和端面中的至少一个上。

公开(公告)号：US09547443B2

公开(公告)日：2017-01-17

申请号：US13460634

申请日：2012-04-30

申请人： Shinichi Hayashi

发明人： Shinichi Hayashi

IPC分类号： G06F12/02 ,  G06F3/06

CPC分类号： G06F3/0611 ,  G06F3/0649 ,  G06F3/0685

摘要： A storage system includes plural types of storage devices that define a plurality of virtual volumes and a plurality of logical volumes. A storage controller is configured to manage the plurality of virtual volumes and the plurality of logical volumes, the plurality of virtual volumes defining first storage areas and the plurality of logical volumes defining second storage areas. A second storage area of the plurality of logical volumes is allocated to a first storage area of the plurality of virtual volumes. The storage controller is configured to determine whether data of a first storage area of a swap file is to be stored in the first tier storage device or the second tier storage device based on access information from an application server that manages a swap file information of the swap file.

摘要翻译： 存储系统包括定义多个虚拟卷和多个逻辑卷的多种类型的存储设备。 存储控制器被配置为管理多个虚拟卷和多个逻辑卷，多个虚拟卷定义第一存储区域和限定第二存储区域的多个逻辑卷。 多个逻辑卷的第二存储区域被分配给多个虚拟卷的第一存储区域。 存储控制器被配置为基于来自管理交换文件的交换文件信息的应用服务器的访问信息来确定交换文件的第一存储区域的数据是否要存储在第一层存储设备或第二层存储设备中 交换文件。

公开(公告)号：US09281096B2

公开(公告)日：2016-03-08

申请号：US13806506

申请日：2011-06-21

申请人： Shinichi Hayashi ,  Hiroshi Hamachi

发明人： Shinichi Hayashi ,  Hiroshi Hamachi

IPC分类号： C09J9/02 ,  H01B1/20 ,  C08L23/08 ,  C08L71/00 ,  C09D167/00 ,  C09J129/14 ,  H01B1/22 ,  H01R4/04 ,  C09J123/08 ,  C08K5/14 ,  C08L63/10 ,  C08L67/07 ,  C08L75/16 ,  C08L79/08

CPC分类号： H01B1/20 ,  C08G2650/56 ,  C08K5/14 ,  C08L23/0853 ,  C08L31/04 ,  C08L63/00 ,  C08L63/10 ,  C08L67/00 ,  C08L67/07 ,  C08L71/00 ,  C08L75/16 ,  C08L79/08 ,  C08L2205/03 ,  C09D167/00 ,  C09J9/02 ,  C09J123/0853 ,  C09J129/14 ,  H01B1/22 ,  H01R4/04 ,  C08L2666/02

摘要： A process margin is improved and high connection reliability is obtained. Disclosed is an anisotropic conductive material including an adhesive composite and conductive particles dispersed in the adhesive composite, the adhesive composite containing a film forming resin, an ethylene vinyl acetate copolymer, a radical polymerizable resin, and a radical polymerization initiator, wherein the ethylene vinyl acetate copolymer to be used has a melt flow rate of not less than 400 g/10 min.

摘要翻译： 改善了加工余量，获得了较高的连接可靠性。 公开了一种各向异性导电材料，其包括分散在粘合剂复合材料中的粘合剂复合材料和导电颗粒，含有成膜树脂的粘合剂复合物，乙烯乙酸乙烯酯共聚物，可自由基聚合树脂和自由基聚合引发剂，其中乙烯醋酸乙烯酯 共聚物的熔体流动速率不小于400g / 10min。

公开(公告)号：US08683120B2

公开(公告)日：2014-03-25

申请号：US13072862

申请日：2011-03-28

申请人： Shinichi Hayashi

发明人： Shinichi Hayashi

IPC分类号： G06F12/00

CPC分类号： G06F3/0613 ,  G06F3/061 ,  G06F3/0631 ,  G06F3/064 ,  G06F3/0665 ,  G06F3/0683 ,  G06F3/0685 ,  G06F3/0689

摘要： A storage system comprises a plurality of hard disk drives and a storage controller providing a plurality of virtual volumes to a server and including a processor and a memory. The storage controller allocates pages of the plurality of virtual volumes to the plurality of hard disk drives in response to write requests. The storage controller controls to allocate outer sections of the plurality of hard disks to first addresses of the virtual volume and allocates inner sections of the plurality of hard disk drives to second addresses of the virtual volume, wherein the first addresses are lower than the second addresses.

摘要翻译： 存储系统包括多个硬盘驱动器和向服务器提供多个虚拟卷并且包括处理器和存储器的存储控制器。 存储控制器响应于写请求而将多个虚拟卷的页面分配给多个硬盘驱动器。 所述存储控制器控制将所述多个硬盘的外部部分分配给所述虚拟卷的第一地址，并将所述多个硬盘驱动器的内部部分分配给所述虚拟卷的第二地址，其中所述第一地址低于所述第二地址 。