公开(公告)号：US11992894B2

公开(公告)日：2024-05-28

申请号：US16971501

申请日：2019-02-22

Applicant: CORNING INCORPORATED

Inventor： Hasan Fiaz ,  Jann Paul Kaminski ,  Raymond Miller Karam ,  Brian Nilsen ,  Marie Bernadette O'Regan ,  Garrett Andrew Piech ,  Sergio Tsuda ,  ChuanChe Wang ,  Ming Ying

IPC: B23K26/00 ,  B23K26/32 ,  C03B33/02 ,  C03C23/00 ,  C03C27/08

CPC classification number: B23K26/0006 ,  B23K26/32 ,  C03B33/0222 ,  C03C23/0025 ,  C03C27/08

Abstract: A method of separating a portion of an object comprising: presenting an object having a thickness; using a laser emission at a wavelength to perforate at least a portion of the thickness of the object sequentially over a length to form a series of perforations between a first portion of the object on one side of the series of perforations and a second portion of the object on the other side of the series of perforations; and applying a stress to the object at the series of perforations to separate the first portion of the object from the second portion of the object, wherein the thickness of the object, at the series of perforations, is transparent to the wavelength of the laser emission.

公开(公告)号：US20200254557A1

公开(公告)日：2020-08-13

申请号：US16776055

申请日：2020-01-29

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Andreas Simon Gaab ,  Garrett Andrew Piech ,  Alranzo Boh Ruffin ,  Daniel Arthur Sternquist ,  Michael Brian Webb

IPC: B23K26/00

Abstract: A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size w0, and a Rayleigh range ZR that is greater than F D  π  w 0 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

公开(公告)号：US20190389007A1

公开(公告)日：2019-12-26

申请号：US16430985

申请日：2019-06-04

Applicant: CORNING INCORPORATED

Inventor： Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: B23K26/364 ,  C03C23/00

Abstract: A method for laser processing a substrate stack includes forming a defect in a transparent workpiece of the substrate stack having a black matrix layer. Forming the defect includes directing a portion of a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater than F D  π   w 0 , 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. The pulsed laser beam directed into the transparent workpiece of the substrate stack forms a pulsed laser beam focal line disposed within the transparent workpiece, where a center of the pulsed laser beam focal line is offset from an edge of the black matrix layer by a distance that is about 20% or less of a total thickness of the substrate stack and generates an induced absorption within the transparent workpiece.

公开(公告)号：US20190312067A1

公开(公告)日：2019-10-10

申请号：US15972628

申请日：2018-05-07

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Daniel Wayne Levesque, JR. ,  Robert George Manley ,  Garrett Andrew Piech ,  Rajesh Vaddi ,  Heather Nicole Vanselous

IPC: H01L27/12 ,  H01L27/15

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

公开(公告)号：US10335902B2

公开(公告)日：2019-07-02

申请号：US15325893

申请日：2015-07-14

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Stephan Lvovich Logunov ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Pushkar Tandon ,  Sergio Tsuda

IPC: B23K26/402 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/08 ,  B23K26/359 ,  B23K26/57 ,  B23K26/53 ,  B23K26/073 ,  C03B33/07 ,  C03B33/02 ,  B23K103/00

Abstract: A method of arresting propagation of an incident crack through a transparent material includes focusing pulsed laser beams into a laser beam focal line directed into the transparent material a series of locations corresponding to a predetermined pattern that is designed to arrest an incident crack that propagates through the transparent material, and generating, with the laser beam focal line (1460), an induced absorption within the transparent material in order to produce a defect (1440) in the transparent material.

公开(公告)号：US10179748B2

公开(公告)日：2019-01-15

申请号：US15585305

申请日：2017-05-03

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: B32B3/00 ,  C03B33/02 ,  B32B17/06 ,  B23K26/53 ,  B23K26/55 ,  B23K26/06 ,  B23K26/073 ,  B23K26/00 ,  B23K26/0622 ,  B23K26/40 ,  B23K103/00

Abstract: A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.

公开(公告)号：US20180143371A1

公开(公告)日：2018-05-24

申请号：US15573022

申请日：2016-05-12

Applicant: Corning Incorporated

Inventor： Jacques Gollier ,  Shenping Li ,  Xinghua Li ,  Garrett Andrew Piech ,  Sergio Tsuda

IPC: F21V8/00 ,  C03B17/06 ,  C03B25/08

CPC classification number: G02B6/0068 ,  C03B17/06 ,  C03B25/08 ,  C03B33/07 ,  G02B6/0018 ,  G02B6/0043 ,  G02B6/0073 ,  G02B6/0078

Abstract: Described herein is a glass article, for example a light guide plate, for illuminating a display panel, and in particular a light guide plate comprising a glass substrate formed by a plurality of individual segments, the plurality of glass segments arranged edge-to-edge in a two dimensional array and laminated between at least two polymer films. A display device incorporating the glass article is also described.

公开(公告)号：US20180044219A1

公开(公告)日：2018-02-15

申请号：US15660009

申请日：2017-07-26

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Helmut Schillinger ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/02 ,  C03B33/09 ,  B23K26/035 ,  B23K26/0622 ,  B23K26/361 ,  C03B33/08 ,  B23K26/402 ,  B23K26/362 ,  B23K26/08 ,  B23K26/04 ,  B23K26/02 ,  C03C21/00 ,  B23K26/00 ,  B23K103/00

Abstract: Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.

公开(公告)号：US20180029920A1

公开(公告)日：2018-02-01

申请号：US15662788

申请日：2017-07-28

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/09 ,  C03B33/08 ,  B23K26/0622 ,  B23K26/53 ,  B23K26/00 ,  B23K26/08 ,  B23K26/402 ,  C03B33/033 ,  C03B33/02 ,  C03B23/025 ,  C03B23/023 ,  C03B23/02 ,  C03B33/10 ,  B23K103/16 ,  B23K103/00 ,  C03B33/023 ,  C03B33/04

CPC classification number: C03B33/091 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/0884 ,  B23K26/359 ,  B23K26/402 ,  B23K26/53 ,  B23K2103/172 ,  B23K2103/50 ,  B23K2103/54 ,  B65G2249/04 ,  C03B23/02 ,  C03B23/023 ,  C03B23/025 ,  C03B33/0222 ,  C03B33/023 ,  C03B33/033 ,  C03B33/04 ,  C03B33/082 ,  C03B33/102 ,  Y02P40/57 ,  Y10T428/15 ,  Y10T428/24777

Abstract: Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.

公开(公告)号：US20170023841A1

公开(公告)日：2017-01-26

申请号：US15288071

申请日：2016-10-07

Applicant: Corning Incorporated

Inventor： Moussa N'Gom ,  David Andrew Pastel ,  Garrett Andrew Piech ,  Robert Stephen Wagner ,  Chad Michael Wilcox

IPC: G02F1/153 ,  G02F1/15

CPC classification number: G02F1/1533 ,  B23K26/53 ,  B23K2103/54 ,  B32B17/00 ,  C03B33/0222 ,  C03B33/04 ,  C03B33/091 ,  C03C17/23 ,  C03C2217/219 ,  C03C2218/328 ,  G02F1/1523

Abstract: Disclosed herein are glass articles coated on at least one surface with an electrochromic layer and comprising minimal regions of laser damage, and methods for laser processing such glass articles. Insulated glass units comprising such coated glass articles are also disclosed herein.

Abstract translation: 本文公开了在至少一个表面上涂覆有电致变色层并且包括最小的激光损伤区域的玻璃制品，以及用于激光加工这种玻璃制品的方法。 包括这种涂覆的玻璃制品的绝缘玻璃单元也在本文中公开。