公开(公告)号：US20190252954A1

公开(公告)日：2019-08-15

申请号：US16395481

申请日：2019-04-26

Applicant: DENSO CORPORATION

Inventor： Masayoshi NISHIHATA ,  Nobumasa UEDA ,  Hiroki KIYOSE

IPC: H02K11/33 ,  H02K3/50 ,  H01L23/367 ,  H01L23/50 ,  H01L25/07

CPC classification number: H02K11/33 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/48 ,  H01L23/50 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/40245 ,  H02K3/50 ,  H02K2203/09 ,  H02M7/48

Abstract: A semiconductor device includes: a plurality of control modules that controls a rotating electric machine. Each control module includes at least two sets of arms, each set including high-side and low-side switching elements that provide an inverter. A plurality of arms of each control module are coupled in parallel to each other with respect to a bus bar coupled to one power source. Each control module includes a metal plate on which the high-side and low-side switching elements are mounted, and mediates an electric coupling with the power source. Each metal plate includes a first metal plate on which one set of arms is disposed, a second metal plate on which another set of arms is disposed, and a coupling plate that couples the first and second metal plates.

公开(公告)号：US20190139874A1

公开(公告)日：2019-05-09

申请号：US16239796

申请日：2019-01-04

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA ,  DENSO CORPORATION

Inventor： Takuya KADOGUCHI ,  Takahiro HIRANO ,  Arata HARADA ,  Tomomi OKUMURA ,  Keita FUKUTANI ,  Masayoshi NISHIHATA

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L23/433 ,  H02M7/00 ,  H01L29/861 ,  H01L29/739

Abstract: A semiconductor device includes a first switching element; a second switching element; a first metal member; a second metal member; a first terminal that has a potential on a high potential side; a second terminal that has a potential on a low potential side; a third terminal that has a midpoint potential; and a resin part. A first potential part has potential equal to potential of the first terminal. A second potential part has potential equal to potential of the second terminal. A third potential part has potential equal to potential of the third terminal. A first creepage distance between the first potential part and the second potential part is longer than a minimum value of a second creepage distance between the first potential part and the third potential part and a third creepage distance between the second potential part and the third potential part.

公开(公告)号：US20220200471A1

公开(公告)日：2022-06-23

申请号：US17690170

申请日：2022-03-09

Applicant: DENSO CORPORATION

Inventor： Hiromi ICHIJYO ,  Yuu YAMAHIRA ,  Kazuya TAKEUCHI ,  Masanori SAKATA ,  Masayoshi NISHIHATA

IPC: H02M7/00 ,  H02M7/5387 ,  H01L25/18 ,  H01L23/31 ,  H01L23/528

Abstract: A first module includes a first switch having a first electrode and a second electrode; a second switch having a third electrode and a fourth electrode; a second internal bus bar connecting the second electrode with the third electrode; and a first resin member encapsulating those components. A second module with includes a third switch having a fifth electrode and a sixth electrode; a fourth switch having a seventh electrode and an eighth electrode; a fifth internal bus bar connecting the sixth electrode with the seventh electrode; and a second resin member encapsulating those components. At least one of a first terminal of the second internal bus bar exposed from the first resin member and a second terminal of the fifth internal bus bar exposed from the second resin member extends toward the other and are directly joined with each other.

公开(公告)号：US20190260274A1

公开(公告)日：2019-08-22

申请号：US16394473

申请日：2019-04-25

Applicant: DENSO CORPORATION

Inventor： Masayoshi NISHIHATA ,  Nobumasa UEDA ,  Hiroki KIYOSE

IPC: H02K11/33 ,  H02K3/50 ,  H01L23/367 ,  H01L23/50 ,  H01L25/07

Abstract: A semiconductor device includes: a plurality of control modules to control a rotating electric machine. The plurality of control modules are circularly arranged around a rotary shaft of the rotating electric machine. Each control module includes at least one switching element supplied with a current from a bus bar coupled to a power source. The at least one switching element in one of the control modules under a structural condition of arrangement has a lower resistance than another switching element.

公开(公告)号：US20160322726A1

公开(公告)日：2016-11-03

申请号：US15110224

申请日：2014-12-30

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA ,  DENSO CORPORATION

Inventor： Takuya KADOGUCHI ,  Takahiro HIRANO ,  Arata HARADA ,  Tomomi OKUMURA ,  Keita FUKUTANI ,  Masayoshi NISHIHATA

IPC: H01R13/03 ,  H01R13/05 ,  H01R13/11 ,  H01R12/71

CPC classification number: H01R13/03 ,  H01R12/716 ,  H01R13/05 ,  H01R13/11 ,  H01R2201/26

Abstract: A terminal connecting structure includes: a male terminal; and a female terminal to which the male terminal is fitted. The male terminal includes a first metal material and a first metal film that is formed on an outermost surface of the male terminal to coat the first metal material directly or indirectly. The female terminal includes a second metal material and a second metal film that is formed on an outermost surface of the female terminal to coat the second metal material directly or indirectly. A hardness of the first metal material is different from a hardness of the second metal material.

Abstract translation: 终端连接结构包括：公终端; 以及一个母端子，该公端子被安装到该母端子上。 阳端子包括第一金属材料和第一金属膜，其形成在阳端子的最外表面上以直接或间接地涂覆第一金属材料。 阴端子包括第二金属材料和第二金属膜，其形成在阴端子的最外表面上以直接或间接地涂覆第二金属材料。 第一金属材料的硬度与第二金属材料的硬度不同。

公开(公告)号：US20220200470A1

公开(公告)日：2022-06-23

申请号：US17690141

申请日：2022-03-09

Applicant: DENSO CORPORATION

Inventor： Hiromi ICHIJYO ,  Yuu YAMAHIRA ,  Kazuya TAKEUCHI ,  Masanori SAKATA ,  Masayoshi NISHIHATA

IPC: H02M7/00 ,  H02M7/5387 ,  H01L25/18 ,  H01L23/31 ,  H01L23/528

Abstract: First switches include first electrodes, which are mutually connected with each other via a first internal bus bar, and second electrodes, which are mutually connected with each other via a second internal bus bar. A first resin member encapsulates the first switches and the first and second internal bus bars. Second switches include third electrodes, which are mutually connected with each other via a third internal bus bar, and fourth electrodes, which are mutually connected with each other via a fourth internal bus bar. A second resin member that encapsulates the second switches and the third and fourth internal bus bars. The second module is arranged alongside with the first module. The second internal bus bar and the third internal bus bar are partially exposed from the first resin member and the second resin member, respectively, and are directly joined with each other.

公开(公告)号：US20160225690A1

公开(公告)日：2016-08-04

申请号：US14916136

申请日：2014-08-29

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA ,  DENSO CORPORATION

Inventor： Takuya KADOGUCHI ,  Takahiro HIRANO ,  Takanori KAWASHIMA ,  Tomomi OKUMURA ,  Masayoshi NISHIHATA

IPC: H01L23/367 ,  H01L29/739 ,  H01L29/861 ,  H01L25/07

CPC classification number: H01L23/49568 ,  H01L23/051 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/072 ,  H01L29/7397 ,  H01L29/861 ,  H01L2224/2612 ,  H01L2224/26175 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83007 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83815 ,  H01L2224/92242 ,  H01L2224/92247 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

Abstract: A semiconductor device includes: opposed first and second metal plates; a plurality of semiconductor elements each interposed between the first metal plate and the second metal plate; a metal block interposed between the first metal plate and each of the semiconductor elements; a solder member interposed between the first metal plate and the metal block and connecting the first metal plate to the metal block; and a resin molding sealing the semiconductor elements and the metal block. A face of the first metal plate, which is on an opposite side of a face of the first metal plate to which the metal block is connected via the solder member, is exposed from the resin molding. The first metal plate has a groove formed along an outer periphery of a region in which the solder member is provided, the groove collectively surrounding the solder member.

Abstract translation: 一种半导体器件包括：相对的第一和第二金属板; 多个半导体元件，各自插入在所述第一金属板和所述第二金属板之间; 介于所述第一金属板和所述半导体元件之间的金属块; 插入在第一金属板和金属块之间并将第一金属板连接到金属块的焊料构件; 以及密封半导体元件和金属块的树脂模制件。 第一金属板的与第一金属板的通过焊料部件连接的第一金属板的面相反一侧的面从树脂成形体露出。 第一金属板具有沿着设置有焊料构件的区域的外周形成的槽，槽围绕焊料构件。

公开(公告)号：US20140203426A1

公开(公告)日：2014-07-24

申请号：US14220277

申请日：2014-03-20

Applicant: DENSO CORPORATION

Inventor： Kuniaki MAMITSU ,  Takahisa KANEKO ,  Masaya TONOMOTO ,  Masayoshi NISHIHATA ,  Hiroyuki WADO ,  Chikage NORITAKE ,  Eiji NOMURA ,  Toshiki ITOH

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L23/3672 ,  H01L23/3736 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/46 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/06181 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1517 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

公开(公告)号：US20170117212A1

公开(公告)日：2017-04-27

申请号：US15398178

申请日：2017-01-04

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA ,  DENSO CORPORATION

Inventor： Takuya KADOGUCHI ,  Takahiro HIRANO ,  Takanori KAWASHIMA ,  Tomomi OKUMURA ,  Masayoshi NISHIHATA

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/051

CPC classification number: H01L23/49568 ,  H01L23/051 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/072 ,  H01L29/7397 ,  H01L29/861 ,  H01L2224/2612 ,  H01L2224/26175 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83007 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83815 ,  H01L2224/92242 ,  H01L2224/92247 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

Abstract: A semiconductor device includes: opposed first and second metal plates; a plurality of semiconductor elements each interposed between the first metal plate and the second metal plate; a metal block interposed between the first metal plate and each of the semiconductor elements; a solder member interposed between the first metal plate and the metal block and connecting the first metal plate to the metal block; and a resin molding sealing the semiconductor elements and the metal block. A face of the first metal plate, which is on an opposite side of a face of the first metal plate to which the metal block is connected via the solder member, is exposed from the resin molding. The first metal plate has a groove formed along an outer periphery of a region in which the solder member is provided, the groove collectively surrounding the solder member.

公开(公告)号：US20170018484A1

公开(公告)日：2017-01-19

申请号：US15123794

申请日：2015-01-15

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA ,  DENSO CORPORATION

Inventor： Takuya KADOGUCHI ,  Takahiro HIRANO ,  Takanori KAWASHIMA ,  Keita FUKUTANI ,  Tomomi OKUMURA ,  Masayoshi NISHIHATA

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49513 ,  H01L21/4825 ,  H01L21/4882 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84138 ,  H01L2224/92165 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: The semiconductor device includes a semiconductor element, and an electro-conductive first plate-like part electrically connected to a top-face-side electrode of the semiconductor element and including a first joint part projecting from a side face, and an electro-conductive second plate-like part including a second joint part projecting from a side face. A bottom face of the first joint part and a top face of the second joint part face one another, and are electrically connected via an electro-conductive bonding material. A bonding-material-thickness ensuring means is provided in a zone where the bottom face of the first joint part and the top face of the second joint part face one another to ensure a thickness of the electro-conductive bonding material between an upper portion of a front end of the second joint part and the bottom face of the first joint part.

Abstract translation: 半导体器件包括半导体元件和电连接到半导体元件的顶面侧电极的导电的第一板状部件，并且包括从侧面突出的第一接合部，以及导电第二部件 板状部分包括从侧面突出的第二接合部。 第一接合部的底面和第二接合部的顶面彼此面对，并且经由导电接合材料电连接。 在第一接合部的底面和第二接合部的顶面彼此面对的区域中设置接合材料厚度确保装置，以确保导电接合材料的上部 第二接合部的前端和第一接合部的底面。