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公开(公告)号：US20150325362A1
公开(公告)日：2015-11-12
申请号：US14649388
申请日：2013-11-27
Applicant: DEXERIALS CORPORATION
Inventor： Tatsuo KUMURA , Yusuke KUBO
IPC: H01F27/28 , H01F38/14 , H01F27/255 , H01F27/29
CPC classification number: H01F27/2885 , H01F5/00 , H01F27/255 , H01F27/2804 , H01F27/2871 , H01F27/29 , H01F27/365 , H01F38/14 , H01F2017/048 , H01Q1/40 , H01Q7/06
Abstract: A coil module is provided which has been reduced in size and thickness by incorporating a material and a structure resistant to magnetic saturation. The coil module includes a magnetic shielding layer containing a magnetic material, and a spiral coil. The magnetic shielding layer has a plurality of magnetic resin layers containing magnetic particles, and at least a portion of the spiral coil is buried in a portion of the magnetic resin layers. This allows a reduction in size and thickness while achieving a heat dissipation effect by the magnetic resin layers. In addition, since magnetic resin layers resistant to magnetic saturation are provided, the coil inductance changes only slightly even in an environment where a strong magnetic field is applied, and thus stable communication can be provided.
Abstract translation: 提供了一种线圈模块，其通过结合材料和抵抗磁饱和的结构而减小了尺寸和厚度。 线圈模块包括含有磁性材料的磁屏蔽层和螺旋线圈。 磁屏蔽层具有含有磁性粒子的多个磁性树脂层，螺旋线圈的至少一部分埋设在一部分磁性树脂层中。 这允许在实现磁性树脂层的散热效果的同时减小尺寸和厚度。 此外，由于提供了耐磁饱和的磁性树脂层，即使在施加强磁场的环境中线圈电感也变化很小，因此可以提供稳定的通信。
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公开(公告)号：US20240117148A1
公开(公告)日：2024-04-11
申请号：US18275450
申请日：2022-01-28
Applicant: DEXERIALS CORPORATION
Inventor： Keisuke ARAMAKI , Yuma SATO , Yusuke KUBO
IPC: C08K3/38 , C08L101/00
CPC classification number: C08K3/38 , C08L101/00 , C08K2003/385 , C08K2201/001 , C08L2203/20
Abstract: A thermally conductive sheet includes a binder resin and boron nitride flakes. The boron nitride flakes are oriented in a thickness direction of the thermally conductive sheet, and both surfaces of the thermally conductive sheet are tacky. A method for manufacturing a thermally conductive sheet includes preparing a thermally conductive composition containing a binder resin and boron nitride flakes. A molded block is formed from the thermally conductive composition. The molded block is sliced into a sheet shape to obtain a thermally conductive sheet precursor. The thermally conductive sheet precursor is pressed to obtain a thermally conductive sheet.
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公开(公告)号：US20150222018A1
公开(公告)日：2015-08-06
申请号：US14612731
申请日：2015-02-03
Applicant: DEXERIALS CORPORATION
Inventor： Tatsuo KUMURA , Yusuke KUBO , Hiroyuki RYOSON
CPC classification number: H01Q7/06 , H01F5/003 , H01F27/365 , H01F38/14 , H01Q1/243 , H02J7/0042 , H02J17/00
Abstract: An invented antenna device includes a spiral coil having terminal wires extending from an inner periphery side thereof and from an outer periphery side thereof, a magnetic layer supporting the spiral coil and being formed with a cutoff portion extending from an inner periphery side thereof to an outer periphery side thereof, and a circuit board having a pair of terminal portions for connecting to the terminal wire and a connecting terminal for connecting an external circuit. The circuit board is placed in the cutoff portion, and the terminal wire extending from the inner periphery side of the spiral coil is coupled to the terminal portion located on an inner periphery side of the circuit board whereas the terminal wire extending from the outer periphery side of the spiral coil is coupled to the terminal portion located on an outer periphery side of the circuit board.
Abstract translation: 本发明的天线装置包括：螺旋线圈，具有从其内周侧延伸的端子线及其外周侧，支撑螺旋线圈的磁性层，形成有从内周侧向外侧延伸的切断部 以及具有用于连接到端子线的一对端子部分和用于连接外部电路的连接端子的电路板。 电路板被放置在截止部分中，并且从螺旋线圈的内周侧延伸的端子线耦合到位于电路板的内周侧的端子部分，而从外周侧延伸的端子线 的螺旋线圈联接到位于电路板的外周侧的端子部分。
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4.发明申请ANTENNA DEVICE, NON-CONTACT POWER TRANSMISSION ANTENNA UNIT, AND ELECTRONIC APPARATUS 审中-公开天线设备，非接触式电力传输天线单元和电子设备公开(公告)号：US20150222017A1
公开(公告)日：2015-08-06
申请号：US14605293
申请日：2015-01-26
Applicant: DEXERIALS CORPORATION
Inventor： Tatsuo KUMURA , Yusuke KUBO , Hiroyuki RYOSON
Abstract: An antenna device according to the invention includes a spiral coil, a magnetic layer supporting the spiral coil and including a recess or a through hole for containing an extension from an inner periphery of the spiral coil, and a circuit board having a plurality of conducting patterns and being formed with a first terminal connecting the spiral coil to the conducting patterns and with a second terminal connecting the conducting patterns to an external circuit. The magnetic layer has at least a part of the circuit board inside. This invented antenna device is formed in a thinner size.
Abstract translation: 根据本发明的天线装置包括螺旋线圈，支撑螺旋线圈的磁性层，并且包括用于容纳从螺旋线圈的内周延伸的凹部或通孔，以及具有多个导电图案的电路板 并且形成有将螺旋线圈连接到导电图案的第一端子和将导电图案连接到外部电路的第二端子。 磁性层的内部至少有一部分电路板。 本发明的天线装置形成为更小的尺寸。
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公开(公告)号：US20240262979A1
公开(公告)日：2024-08-08
申请号：US18567857
申请日：2022-06-08
Applicant: DEXERIALS CORPORATION
Inventor： Yuma SATO , Yusuke KUBO
CPC classification number: C08K3/38 , C08J5/18 , C08K7/04 , C08L83/04 , C08K2003/385 , C08K2201/001 , C08L2203/206
Abstract: A thermally conductive sheet including: a cured material of a composition including: a binder resin, an anisotropically thermally conductive filler, and an additional thermally conductive filler other than the anisotropically thermally conductive filler. The thermally conductive sheet satisfies condition 1: a tack force of the thermally conductive sheet is 80 gf or higher; and condition 2: a bleed amount of the binder resin is 0.20 g or less after the thermally conductive sheet, which has a size of 25 mm×25 mm and a thickness of 1 mm, is left standing for 48 hours at 125° C. in a state of being compressed by 40%.
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Patent Agency Ranking
公开(公告)号：US20240120254A1
公开(公告)日：2024-04-11
申请号：US18276509
申请日：2022-02-09
Applicant: DEXERIALS CORPORATION
Inventor： Keisuke ARAMAKI , Yuma SATO , Yusuke KUBO
IPC: H01L23/373 , H01L23/00 , H01L23/367
CPC classification number: H01L23/3737 , H01L23/3672 , H01L24/32 , H01L2224/29291 , H01L2224/29318 , H01L2224/29324 , H01L2224/29386 , H01L2224/29393 , H01L2224/29399 , H01L2224/32245 , H01L2924/05032 , H01L2924/05432
Abstract: A thermally-conductive sheet includes: a binder; and an anisotropic thermally-conductive filler. The anisotropic thermally-conductive filler is oriented in a thickness direction of the thermally-conductive sheet An arithmetical mean height Sa is 5 μm or less and a maximum height Sz is 50 μm or less on either surface of the thermally-conductive sheet. A dielectric breakdown voltage of the thermally-conductive sheet is 0.5 kV/mm or higher.
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公开(公告)号：US20240010898A1
公开(公告)日：2024-01-11
申请号：US18021595
申请日：2021-08-03
Applicant: DEXERIALS CORPORATION
Inventor： Yuma SATO , Keisuke ARAMAKI , Yusuke KUBO
CPC classification number: C09K5/14 , C08K7/00 , C08L83/04 , C08K2201/001
Abstract: Provided is a thermally conductive sheet which is highly flexible and of which the thermal resistance value has small load dependency. A thermally conductive sheet 1 contains a curable resin composition 2, a flaky thermally conductive filler 3, and a non-flaky thermally conductive filler 4, wherein the amount of change between the thermal resistance value at load of 1 kgf/cm2 and the thermal resistance value at load in a range greater than 1 kgf/cm2 and not greater than 3 kgf/cm2 is not greater than 0.4° C.·cm2/W, and the amount of change between the compression rate at load of 3 kgf/cm2 and the compression rate at load of 1 kgf/cm2 is not less than 20%.
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公开(公告)号：US20220173494A1
公开(公告)日：2022-06-02
申请号：US17593631
申请日：2020-02-27
Applicant: Dexerials Corporation
Inventor： Sergey BOLOTOV , Hiroyuki RYOSON , Keisuke ARAMAKI , Yusuke KUBO
Abstract: The disclosure aims at providing an antenna array for 5G communications that has superior thermal dissipation and crosstalk suppression effect. To achieve the above-described object, an antenna array 1 for 5G communications according to the disclosure includes a substrate 10; at least one high-frequency semiconductor device 20, a noise-suppressing thermally conductive sheet 20, and a first thermal dissipation member 41 sequentially formed on one surface 10a of the substrate 10; and at least one antenna 50 and a second thermal dissipation member 42 sequentially formed on the other surface 10b of the substrate 10.
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公开(公告)号：US20210225777A1
公开(公告)日：2021-07-22
申请号：US16973765
申请日：2019-06-19
Applicant: Dexerials Corporation
Inventor： Sergey BOLOTOV , Yusuke KUBO
IPC: H01L23/552 , H01L23/367 , H01L23/373 , H01L21/48
Abstract: Provided is a semiconductor device having excellent heat dissipation capacity and electromagnetic wave suppression effect. A semiconductor device 1 includes a semiconductor device 30; a tubular conductive shield can 20 provided to surround a side surface 30a of the semiconductor device 30; a conductive cooling member 40; and a conductive thermally conductive sheet 10 formed between the semiconductor device 30 and the cooling member 40. The conductive shield can 20 and the cooling member 40 are electrically connected through the conductive thermally conductive sheet 10 therebetween.
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公开(公告)号：US20250153287A1
公开(公告)日：2025-05-15
申请号：US19023709
申请日：2025-01-16
Applicant: DEXERIALS CORPORATION
Inventor： Keisuke MUKASA , Yusuke KUBO , Keisuke ARAMAKI
Abstract: A heat transfer sheet includes: at least one of a carbon fiber and a boron nitride flake; an inorganic filler, and a binder resin. The at least one of the carbon fiber and the boron nitride flake is oriented in a thickness direction of the heat transfer sheet. When the heat transfer sheet is in a sealed state under a reduced pressure of 150 to 300 torr for one minute or more and removed from the sealed state, a tack force of the heat transfer sheet satisfies condition 1: the tack force of the heat transfer sheet is 100 gf or more when a probe having a diameter of 5.1 mm presses in the heat transfer sheet at a force of 200 gf at 2 mm/sec and pulls it off at 10 mm/sec.
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