公开(公告)号：US20240345227A1

公开(公告)日：2024-10-17

申请号：US18585027

申请日：2024-02-22

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Junichiro Hayakawa ,  Kei Takeyama ,  Daisuke Iguchi

IPC: G01S7/484 ,  G01S7/48 ,  G01S17/10

CPC classification number: G01S7/484 ,  G01S7/4808 ,  G01S17/10

Abstract: A light emitting apparatus includes: a light emitting unit that has plural regions configured to individually emit light; a drive unit that drives a predetermined region among the plural regions of the light emitting unit to perform pulse light emission; and an acquisition unit that acquires a light reception result obtained by receiving reflected light of the light emitted from the light emitting unit toward a target object, in which in one acquisition acquired by the acquisition unit, the drive unit drives the predetermined region such that the pulse light emission of the predetermined region is performed plural times with time intervals.

公开(公告)号：US11605936B2

公开(公告)日：2023-03-14

申请号：US16953297

申请日：2020-11-19

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Daisuke Iguchi

IPC: H01S5/00 ,  H01S5/42 ,  H01S5/183 ,  H01S5/042 ,  H01S5/02345 ,  H01S5/024 ,  H01S5/30

Abstract: A light-emitting device includes an insulating base member having thermal conductivity of 10 W/m·K or more; a light-emitting element that has a cathode electrode and an anode electrode and is provided on a front surface side of the base member; a capacitive element that is provided on the base member and supplies an electric current to the light-emitting element; and a reference potential wire that is provided on a rear surface side of the base member and is connected to an external reference potential. The reference potential wire is connected to the capacitive element and is insulated from the cathode electrode and the anode electrode.

公开(公告)号：US11585903B2

公开(公告)日：2023-02-21

申请号：US16511029

申请日：2019-07-15

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Tomoaki Sakita ,  Satoshi Inada ,  Takeshi Minamiru ,  Daisuke Iguchi ,  Kazuhiro Sakai ,  Yoshinori Shirakawa

IPC: G01S7/481 ,  G01S17/89 ,  G01B11/24 ,  G06F21/45 ,  G01S17/04 ,  H01S5/183

Abstract: Provided is a light emitting device including: a base material mounted on a wiring substrate; a light emitting element array provided on the base material; a first conductive pattern provided on the surface of the base material, the first conductive pattern including a first facing region connected to the light emitting element array, the first facing region being along a side surface of the light emitting element array and facing to the light emitting element array, and a first extending region extended beyond the first facing region; and penetrating members penetrating the base material from the first conductive pattern to a back surface side of the base material, each penetrating member being connected to the first facing region or the first extending region.

公开(公告)号：US12107385B2

公开(公告)日：2024-10-01

申请号：US17111516

申请日：2020-12-04

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Daisuke Iguchi ,  Kazuhiro Sakai

IPC: H01S5/0233 ,  G01B11/24 ,  G06V40/16 ,  H01S5/183 ,  H01S5/343 ,  H01S5/42

CPC classification number: H01S5/0233 ,  G01B11/24 ,  H01S5/423 ,  G06V40/166 ,  H01S5/18313 ,  H01S5/18361 ,  H01S5/3432 ,  H01S5/34353

Abstract: A light emitting device includes a wiring board having a first wiring layer and a second wiring layer adjacent to the first wiring layer via an insulating layer, a laser having a cathode electrode and an anode electrode, mounted on the wiring board, and driven through low-side driving, and a capacitive element mounted on the wiring board and configured to supply a drive current to the laser. The first wiring layer includes a cathode wire connected to the cathode electrode, and an anode wire connected to the anode electrode. The second wiring layer includes a reference potential wire connected to a reference potential. The reference potential wire overlaps the anode wire. The anode wire surrounds the capacitive element.

公开(公告)号：US12057677B2

公开(公告)日：2024-08-06

申请号：US17138907

申请日：2020-12-31

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Daisuke Iguchi

IPC: H01S5/042 ,  G06V20/64 ,  G06V40/16 ,  H01L31/12 ,  H01S5/02345 ,  H01S5/024 ,  H01S5/183 ,  H01S5/343 ,  H01S5/42

CPC classification number: H01S5/0428 ,  G06V20/64 ,  G06V40/166 ,  H01L31/12 ,  H01S5/02345 ,  H01S5/02469 ,  H01S5/18311 ,  H01S5/18361 ,  H01S5/34313 ,  H01S5/423

Abstract: A light-emitting device includes an insulating base member having thermal conductivity of 10 W/m·K or more; a light-emitting element provided on a front surface side of the base member; a first rear surface wire that is provided on a rear surface side of the base member and is connected to one of a cathode electrode and an anode electrode of the light-emitting element; a second rear surface wire that is provided on the rear surface side of the base member and is connected to the other one of the cathode electrode and the anode electrode; and a reference potential wire that is provided on the rear surface side of the base member and is connected to an external reference potential.

公开(公告)号：US11732884B2

公开(公告)日：2023-08-22

申请号：US17358866

申请日：2021-06-25

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Kazuhiro Sakai ,  Daisuke Iguchi ,  Takeshi Minamiru ,  Yoshinori Shirakawa ,  Tomoaki Sakita ,  Tsutomu Otsuka

IPC: F21V23/00 ,  F21V33/00 ,  G06F1/16 ,  G06F1/18 ,  G06F21/32 ,  G06V40/16 ,  G01J1/08 ,  H01S5/0239 ,  F21Y105/16 ,  G01S7/00 ,  G01S17/00

CPC classification number: F21V33/0052 ,  G01J1/08 ,  G06F1/1686 ,  G06F1/189 ,  G06F21/32 ,  G06V40/161 ,  H01S5/0239 ,  F21Y2105/16 ,  G01S7/00 ,  G01S17/00

Abstract: A light-emitting device includes a wiring substrate, a base member provided on the wiring substrate, a light-emitting element array that has a first side surface and a second side surface facing each other, that has a third side surface and a fourth side surface facing each other and connecting the first side surface and the second side surface, and that is provided on the base member, a drive unit that is provided on the wiring substrate at a side of the first side surface and drives the light-emitting element array, a first circuit element that is provided on the base member at the side of the first side surface, a second circuit element that is provided on the base member at a side of the second side surface and has a larger occupation area on the base member than the first circuit element, and wiring members that are provided at a side of the third side surface and at a side of the fourth side surface and extend from an upper surface electrode of the light-emitting element array toward an outer side of the light-emitting element array.

公开(公告)号：US11495940B2

公开(公告)日：2022-11-08

申请号：US17110304

申请日：2020-12-03

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Daisuke Iguchi ,  Kazuhiro Sakai

IPC: H01S5/042 ,  H01S5/02255 ,  G01S17/894

Abstract: A light emitting device includes a wiring board having a first wiring layer and a second wiring layer adjacent to the first wiring layer via an insulating layer, and a laser having a cathode electrode and an anode electrode, mounted on the wiring board, and driven through low-side driving. The first wiring layer includes a cathode wire connected to the cathode electrode, an anode wire connected to the anode electrode, and a first reference potential wire connected to a reference potential. The second wiring layer includes a second reference potential wire connected to the reference potential. An area of an overlap between the second reference potential wire and the anode wire is larger than an area of an overlap between the second reference potential wire and the first reference potential wire.

公开(公告)号：US11211774B2

公开(公告)日：2021-12-28

申请号：US16719940

申请日：2019-12-18

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kazuhiro Sakai ,  Daisuke Iguchi ,  Takeshi Minamiru ,  Yoshinori Shirakawa ,  Tomoaki Sakita ,  Tsutomu Otsuka

IPC: H01S5/42 ,  H01S5/02255 ,  H01S5/02325 ,  H01S5/068 ,  H01S5/0687 ,  H01S5/042 ,  H01S5/02 ,  H01S5/183 ,  H01S5/30 ,  H01S5/343 ,  H01S5/20 ,  G02B27/42 ,  G02B5/02 ,  G06K9/00 ,  G06K9/20

Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.

公开(公告)号：US12107396B2

公开(公告)日：2024-10-01

申请号：US17478551

申请日：2021-09-17

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Takashi Kondo ,  Kenichi Ono ,  Daisuke Iguchi ,  Yoshinori Shirakawa ,  Tomoaki Sakita ,  Tsutomu Otsuka

IPC: H01S5/42 ,  G01B11/24 ,  G06V10/88 ,  G06V20/64 ,  G06V40/16

CPC classification number: H01S5/423 ,  G01B11/24 ,  G06V10/88 ,  G06V20/64 ,  G06V40/169

Abstract: A light-emitting device includes: a first light-emitting element array that includes plural first light-emitting elements arranged at a first interval; a second light-emitting element array that includes plural second light-emitting elements arranged at a second interval wider than the first interval, second light-emitting element array being configured to output a light output larger than a light output of the first light-emitting element array, and being configured to be driven independently from the first light-emitting element array; and a light diffusion member provided on an emission path of the second light-emitting element array.

公开(公告)号：US12027510B2

公开(公告)日：2024-07-02

申请号：US17355270

申请日：2021-06-23

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Takashi Kondo ,  Satoshi Inada ,  Takeshi Minamiru ,  Daisuke Iguchi ,  Kazuhiro Sakai ,  Tomoaki Sakita ,  Michiaki Murata

IPC: H01L25/16 ,  G01B11/24 ,  G06V20/64 ,  G06V40/16 ,  H01S5/02257 ,  H01S5/02345 ,  H01S5/0236 ,  H01S5/0239 ,  H01S5/026 ,  H01S5/183 ,  H01S5/343 ,  H01S5/42 ,  H01L33/46 ,  H01L33/60

CPC classification number: H01L25/167 ,  G01B11/24 ,  G06V20/64 ,  G06V40/172 ,  H01S5/02257 ,  H01S5/0236 ,  H01S5/0239 ,  H01S5/0262 ,  H01S5/18361 ,  H01S5/34313 ,  H01S5/423 ,  H01L33/46 ,  H01L33/60

Abstract: A light-emitting element array chip includes: a first light-emitting element array that includes a first light-emitting element including a first substrate, a light-emitting element layer formed on the first substrate, and a first cathode electrode electrically connected to the light-emitting element layer; and a second light-emitting element array that includes a second light-emitting element including a second substrate, a non-p-type lower reflector formed on the second substrate, and a second cathode electrode electrically connected to the non-p-type lower reflector, in which the first light-emitting element array is provided on an emission surface side of the second light-emitting element array.