公开(公告)号：US11732884B2

公开(公告)日：2023-08-22

申请号：US17358866

申请日：2021-06-25

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Kazuhiro Sakai ,  Daisuke Iguchi ,  Takeshi Minamiru ,  Yoshinori Shirakawa ,  Tomoaki Sakita ,  Tsutomu Otsuka

IPC: F21V23/00 ,  F21V33/00 ,  G06F1/16 ,  G06F1/18 ,  G06F21/32 ,  G06V40/16 ,  G01J1/08 ,  H01S5/0239 ,  F21Y105/16 ,  G01S7/00 ,  G01S17/00

CPC classification number: F21V33/0052 ,  G01J1/08 ,  G06F1/1686 ,  G06F1/189 ,  G06F21/32 ,  G06V40/161 ,  H01S5/0239 ,  F21Y2105/16 ,  G01S7/00 ,  G01S17/00

Abstract: A light-emitting device includes a wiring substrate, a base member provided on the wiring substrate, a light-emitting element array that has a first side surface and a second side surface facing each other, that has a third side surface and a fourth side surface facing each other and connecting the first side surface and the second side surface, and that is provided on the base member, a drive unit that is provided on the wiring substrate at a side of the first side surface and drives the light-emitting element array, a first circuit element that is provided on the base member at the side of the first side surface, a second circuit element that is provided on the base member at a side of the second side surface and has a larger occupation area on the base member than the first circuit element, and wiring members that are provided at a side of the third side surface and at a side of the fourth side surface and extend from an upper surface electrode of the light-emitting element array toward an outer side of the light-emitting element array.

公开(公告)号：US11211774B2

公开(公告)日：2021-12-28

申请号：US16719940

申请日：2019-12-18

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kazuhiro Sakai ,  Daisuke Iguchi ,  Takeshi Minamiru ,  Yoshinori Shirakawa ,  Tomoaki Sakita ,  Tsutomu Otsuka

IPC: H01S5/42 ,  H01S5/02255 ,  H01S5/02325 ,  H01S5/068 ,  H01S5/0687 ,  H01S5/042 ,  H01S5/02 ,  H01S5/183 ,  H01S5/30 ,  H01S5/343 ,  H01S5/20 ,  G02B27/42 ,  G02B5/02 ,  G06K9/00 ,  G06K9/20

Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.

公开(公告)号：US20240106194A1

公开(公告)日：2024-03-28

申请号：US18301994

申请日：2023-04-18

Applicant: FUJIFILM Business Innovation Corp. ,  FUJIFILM Corporation

Inventor： Daisuke IGUCHI ,  Kei Takeyama ,  Seiji Ono ,  Tomoaki Sakita ,  Takashi Kondo ,  Junichiro Hayakawa

IPC: H01S5/042 ,  G01B11/24 ,  G01S7/484 ,  G01S17/89 ,  H01S5/42

CPC classification number: H01S5/042 ,  G01B11/24 ,  G01S7/484 ,  G01S17/89 ,  H01S5/42

Abstract: A light-emitting array includes a light-emitting part having plural light-emitting block, a selection part that operates with a reference potential supplied from a reference part provided on an outside as a reference and selects the light-emitting block to be made to emit light, and a disconnection part that disconnects connection of the selection part and the reference part in a period during which a light emission current caused by low-side drive is flowing in the light-emitting block.

公开(公告)号：US11585903B2

公开(公告)日：2023-02-21

申请号：US16511029

申请日：2019-07-15

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Tomoaki Sakita ,  Satoshi Inada ,  Takeshi Minamiru ,  Daisuke Iguchi ,  Kazuhiro Sakai ,  Yoshinori Shirakawa

IPC: G01S7/481 ,  G01S17/89 ,  G01B11/24 ,  G06F21/45 ,  G01S17/04 ,  H01S5/183

Abstract: Provided is a light emitting device including: a base material mounted on a wiring substrate; a light emitting element array provided on the base material; a first conductive pattern provided on the surface of the base material, the first conductive pattern including a first facing region connected to the light emitting element array, the first facing region being along a side surface of the light emitting element array and facing to the light emitting element array, and a first extending region extended beyond the first facing region; and penetrating members penetrating the base material from the first conductive pattern to a back surface side of the base material, each penetrating member being connected to the first facing region or the first extending region.

公开(公告)号：US11908967B2

公开(公告)日：2024-02-20

申请号：US17406189

申请日：2021-08-19

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Takashi Kondo ,  Seiji Ono ,  Daisuke Iguchi ,  Tomoaki Sakita

IPC: H01L31/12 ,  G01B11/24 ,  H01L29/74 ,  H01L27/15

CPC classification number: H01L31/12 ,  G01B11/24 ,  H01L27/156 ,  H01L29/7412

Abstract: A light-emitting device includes one or more light-emitting units each including a light-emitting element including a function of a thyristor; an electrode for light emission to which a first voltage is applied for light emission of the light-emitting unit; and one or more light emission permission thyristors that permit the light-emitting element to emit light by a second voltage that is lower than the first voltage and set irrespective of the first voltage.

公开(公告)号：US11705695B2

公开(公告)日：2023-07-18

申请号：US17528177

申请日：2021-11-16

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kazuhiro Sakai ,  Daisuke Iguchi ,  Takeshi Minamiru ,  Yoshinori Shirakawa ,  Tomoaki Sakita ,  Tsutomu Otsuka

IPC: H01S5/02257 ,  H01S5/02345 ,  H01S5/42 ,  H01S5/183 ,  H01S5/068 ,  G02B5/02 ,  G06V20/64 ,  G06V10/145 ,  G06V40/16 ,  H01S5/0687 ,  G02B27/42 ,  H01S5/02255 ,  H01S5/02325 ,  H01S5/042 ,  H01S5/02 ,  H01S5/30 ,  H01S5/343 ,  H01S5/20

CPC classification number: H01S5/423 ,  G02B5/0278 ,  G02B27/4205 ,  G06V10/145 ,  G06V20/64 ,  G06V40/166 ,  H01S5/02255 ,  H01S5/02325 ,  H01S5/0687 ,  H01S5/06804 ,  H01S5/0206 ,  H01S5/04252 ,  H01S5/04254 ,  H01S5/18347 ,  H01S5/18361 ,  H01S5/2054 ,  H01S5/3054 ,  H01S5/34353

Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.

公开(公告)号：US12107396B2

公开(公告)日：2024-10-01

申请号：US17478551

申请日：2021-09-17

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Takashi Kondo ,  Kenichi Ono ,  Daisuke Iguchi ,  Yoshinori Shirakawa ,  Tomoaki Sakita ,  Tsutomu Otsuka

IPC: H01S5/42 ,  G01B11/24 ,  G06V10/88 ,  G06V20/64 ,  G06V40/16

CPC classification number: H01S5/423 ,  G01B11/24 ,  G06V10/88 ,  G06V20/64 ,  G06V40/169

Abstract: A light-emitting device includes: a first light-emitting element array that includes plural first light-emitting elements arranged at a first interval; a second light-emitting element array that includes plural second light-emitting elements arranged at a second interval wider than the first interval, second light-emitting element array being configured to output a light output larger than a light output of the first light-emitting element array, and being configured to be driven independently from the first light-emitting element array; and a light diffusion member provided on an emission path of the second light-emitting element array.

公开(公告)号：US12027510B2

公开(公告)日：2024-07-02

申请号：US17355270

申请日：2021-06-23

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Takashi Kondo ,  Satoshi Inada ,  Takeshi Minamiru ,  Daisuke Iguchi ,  Kazuhiro Sakai ,  Tomoaki Sakita ,  Michiaki Murata

IPC: H01L25/16 ,  G01B11/24 ,  G06V20/64 ,  G06V40/16 ,  H01S5/02257 ,  H01S5/02345 ,  H01S5/0236 ,  H01S5/0239 ,  H01S5/026 ,  H01S5/183 ,  H01S5/343 ,  H01S5/42 ,  H01L33/46 ,  H01L33/60

CPC classification number: H01L25/167 ,  G01B11/24 ,  G06V20/64 ,  G06V40/172 ,  H01S5/02257 ,  H01S5/0236 ,  H01S5/0239 ,  H01S5/0262 ,  H01S5/18361 ,  H01S5/34313 ,  H01S5/423 ,  H01L33/46 ,  H01L33/60

Abstract: A light-emitting element array chip includes: a first light-emitting element array that includes a first light-emitting element including a first substrate, a light-emitting element layer formed on the first substrate, and a first cathode electrode electrically connected to the light-emitting element layer; and a second light-emitting element array that includes a second light-emitting element including a second substrate, a non-p-type lower reflector formed on the second substrate, and a second cathode electrode electrically connected to the non-p-type lower reflector, in which the first light-emitting element array is provided on an emission surface side of the second light-emitting element array.

公开(公告)号：US11973321B2

公开(公告)日：2024-04-30

申请号：US18326981

申请日：2023-05-31

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kazuhiro Sakai ,  Daisuke Iguchi ,  Takeshi Minamiru ,  Yoshinori Shirakawa ,  Tomoaki Sakita ,  Tsutomu Otsuka

IPC: H01S5/42 ,  G01B11/24 ,  G01K7/22 ,  G02B5/02 ,  G02B27/42 ,  G06F3/044 ,  G06F21/32 ,  G06V10/145 ,  G06V20/64 ,  G06V40/16 ,  H01S5/02 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02325 ,  H01S5/02345 ,  H01S5/026 ,  H01S5/042 ,  H01S5/068 ,  H01S5/0687 ,  H01S5/183 ,  H01S5/343 ,  H01S5/20 ,  H01S5/30

CPC classification number: H01S5/423 ,  G02B5/0278 ,  G02B27/4205 ,  G06V10/145 ,  G06V20/64 ,  G06V40/166 ,  H01S5/02255 ,  H01S5/02325 ,  H01S5/06804 ,  H01S5/0687 ,  H01S5/0206 ,  H01S5/04252 ,  H01S5/04254 ,  H01S5/18347 ,  H01S5/18361 ,  H01S5/2054 ,  H01S5/3054 ,  H01S5/34353

Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.

公开(公告)号：US11936164B2

公开(公告)日：2024-03-19

申请号：US18326981

申请日：2023-05-31

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kazuhiro Sakai ,  Daisuke Iguchi ,  Takeshi Minamiru ,  Yoshinori Shirakawa ,  Tomoaki Sakita ,  Tsutomu Otsuka

IPC: H01S5/42 ,  G01B11/24 ,  G01K7/22 ,  G02B5/02 ,  G02B27/42 ,  G06F3/044 ,  G06F21/32 ,  G06V10/145 ,  G06V20/64 ,  G06V40/16 ,  H01S5/02 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02325 ,  H01S5/02345 ,  H01S5/026 ,  H01S5/042 ,  H01S5/068 ,  H01S5/0687 ,  H01S5/183 ,  H01S5/343 ,  H01S5/20 ,  H01S5/30

CPC classification number: H01S5/423 ,  G02B5/0278 ,  G02B27/4205 ,  G06V10/145 ,  G06V20/64 ,  G06V40/166 ,  H01S5/02255 ,  H01S5/02325 ,  H01S5/06804 ,  H01S5/0687 ,  H01S5/0206 ,  H01S5/04252 ,  H01S5/04254 ,  H01S5/18347 ,  H01S5/18361 ,  H01S5/2054 ,  H01S5/3054 ,  H01S5/34353

Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.