摘要:
A particulate polymer which has imide groups and may be in gelled state can be produced by reacting a polyisocyanate with a polycarboxylic acid having at least one acid anhydride group, and if necessary together with a polycarboxylic acid other than that mentioned above in the presence of a liquid medium containing at least one non-aqueous organic liquid, and thereby obtaining the particulate polymer having imide groups dispersed in the non-aqueous organic liquid.
摘要:
A liquid chromatographic column packing material comprising porous styrene-divinylbenzene copolymer particles having --SO.sub.3.sup.- groups and, as counterion thereof, ions represented by the formula: .sup.+ NH.sub.n X.sub.m wherein X is --CH.sub.2 OH, --CH.sub.2 CH.sub.2 O--.sub.p H or --CR'.sub.q (CH.sub.2 OH).sub.r group; R' is hydrogen or a lower alkyl group; q and r are independently zero or an integer of 1 to 3, and q+r=3; p is an integer of 1 to 10; n is zero or an integer of 1; and m is an integer of 3 or 4, but m+n=4, is suited for separating sugars or sugaralcohols by liquid chromatography.
摘要翻译:一种液相色谱柱填充材料,其包含具有-SO 3 - 基团的多孔苯乙烯 - 二乙烯基苯共聚物颗粒,并且作为其抗衡离子,由式:+ NH n X m表示的离子,其中X是-CH 2 OH,-CH 2 CH 2 O-pH或-CR'q(CH 2 OH) r组 R'是氢或低级烷基; q和r分别为0或1〜3的整数,q + r = 3; p为1〜10的整数。 n为0或整数1; m为3或4的整数,但m + n = 4,适于通过液相色谱分离糖或糖醇。
摘要:
An insulated wire having excellent heat resistance, abrasion resistance and flexibility can be prepared by coating on an electric conductor directly or via another insulating material a polyamide-imide resin composition prepared by reacting an aromatic diisocyanate and a tricarboxylic acid anhydride in the presence of a basic solvent while adjusting the resin content at 40% by weight or more, and adding to the reaction system a lactam in an amount of 0.1 to 1.0 mole per mole of the aromatic diisocyanate, and if necessary, an alcohol and/or an oxime in an amount of 0.01 to 0.5 mole per mole of the aromatic diisocyanate before, during or after the above-mentioned reaction to mask terminal functional groups and to make the reduced viscosity of the composition 0.1 to 0.27, and baking the resin composition.
摘要:
A heat resistant resin produced by reacting (A) a polyamideimide resin with (B) an alcohol component and (C) an acid component with heating is soluble in a cresol type solvent and gives coatings excellent in heat resistance, thermal shock resistance, wear resistance, resistance to hydrolysis, etc., suitable for enamelled wire.
摘要:
A heat resistant resin produced by reacting (A) a polyamideimide resin with (B) an alcohol component and (C) an acid component with heating is soluble in a cresol type solvent and gives coatings excellent in heat resistance, thermal shock resistance, wear resistance, resistance to hydrolysis, etc., suitable for enamelled wire.
摘要:
Porous styrene-divinylbenzene copolymer particles having SO.sub.3.sup.- groups and counter ions for SO.sub.3.sup.- groups, said counter ions being (a) at least one of Ca.sup.++ and Sr.sup.++ and (b) at least one of Pb.sup.++ and Ba.sup.++ and the equivalent ratio of (a)/(b) being 1/2 to 2/1, are an excellent liquid chromatographic column packing material suited for separating sugars different in kind but the same in molecular weight.
摘要:
An integrated circuit device wherein layer insulation is attained by at least one of (i) an insulator layer interposed between two adjacent conductor layers, and (ii) a surface protecting layer fixedly covering the surface of the semiconductor chip, each of the insulator layer and the surface protecting layer being made of a heat-resistant resin obtainable by heating a heat-resistant resin paste. Said paste consists essentially of a first organic liquid, a second organic liquid, a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting of the first organic liquid and the second organic liquid, and fine particles of a heat-resistant resin (C) which is soluble in the first organic liquid but insoluble in the second organic liquid. The first organic liquid, the second organic liquid and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed.
摘要:
Disclosed is a polyamide-imide resin paste which comprises polyamide-imide resin solution dissolved in a non-nitrogen-containing solvent, wherein resin fine particles are dispersed in the solution in an amount of 1 to 50% by weight relative to the resulting polyamide-imide resin paste.According to the present invention, there can be provided a paste which does not cause any clogging of screen due to adhesion of the paste even in repeated printings over a long period of time and shows an excellent mechanical stability of a paste in printing.
摘要:
A polyamide-imide resin which can give a varnish having a high resin content, excellent in storage stability and heat resistant final products can be produced by reacting an aromatic diisocyanate with a tricarboxylic acid anhydride in the presence of a basic solvent while adjusting the resin content at 40% by weight or more, and adding a specific amount of lactam and a specific amount of an alcohol and/or an oxime separately before, during or after the above-mentioned reaction so as to adjust the reduced viscosity of the resin to 0.10 to 0.27.
摘要:
A polyamide-imide resin which can give a varnish having a high resin content, excellent in storage stability and heat resistant final products such as insulated wire can be produced by reacting an aromatic diisocyanate with a tricarboxylic acid anhydride in the presence of a basic solvent while adjusting the resin content at 40% by weight or more, and adding a compound having one active hydrogen atom before, during or after the above-mentioned reaction so as to adjust the reduced viscosity of the resin to 0.27 or lower.