-
公开(公告)号：US09240370B1
公开(公告)日：2016-01-19
申请号：US14569797
申请日：2014-12-15
Applicant: Industrial Technology Research Institute
Inventor： Shu-Jung Yang , Yu-Lin Chao , June-Chien Chang , Jing-Yao Chang
IPC: H01L23/495 , H01L23/522 , H01L23/00 , H01L25/07
CPC classification number: H01L25/072 , H01L23/13 , H01L23/3735 , H01L23/427 , H01L23/492 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L2224/291 , H01L2224/32227 , H01L2224/32237 , H01L2224/33181 , H01L2224/83447 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2924/00014 , H01L2924/014
Abstract: A power module includes a first substrate, at least two power elements, at least one conductive structure and at least one leadframe. The first substrate includes a first dielectric layer and two first metal layers. The first dielectric layer has at least two concavities and two opposite surfaces, the two first metal layers are respectively disposed on the two surfaces, and the two concavities are respectively formed on the two surfaces. The two power elements are respectively embedded in the two concavities of the first dielectric layer. The two power elements are electrically connected to each other through the conductive structure. The leadframe disposed at the first substrate is electrically connected to the two power elements, and is partially extended outside the first substrate.
Abstract translation: 功率模块包括第一衬底，至少两个功率元件，至少一个导电结构和至少一个引线框架。 第一衬底包括第一电介质层和两个第一金属层。 第一电介质层具有至少两个凹部和两个相对的表面，两个第一金属层分别设置在两个表面上，并且两个凹部分别形成在两个表面上。 两个功率元件分别嵌入在第一介电层的两个凹部中。 两个功率元件通过导电结构彼此电连接。 设置在第一基板处的引线框架电连接到两个功率元件，并且部分地延伸到第一基板的外部。
-
公开(公告)号：US11602128B2
公开(公告)日：2023-03-14
申请号：US16885250
申请日：2020-05-27
Applicant: Industrial Technology Research Institute
Inventor： Shu-Jung Yang , Yu-Lin Chao , Chih-Chung Chiu , Heng-Chieh Chien
Abstract: An ear tag module includes a rod member, a spike, a circuit component, and a temperature sensor. The spike is disposed on one side of the rod member, and the circuit component is disposed on another side of the rod member. The temperature sensor is electrically connected to the circuit component. When the spike penetrates an ear, the ear is in contact with a sensing area of the rod member, and the temperature sensor is located in the rod member to detect a temperature of the ear and transmit at least one temperature sensing information to the circuit component.
-
公开(公告)号：US09418921B2
公开(公告)日：2016-08-16
申请号：US14965909
申请日：2015-12-11
Applicant: Industrial Technology Research Institute
Inventor： Shu-Jung Yang , Yu-Lin Chao , Heng-Chieh Chien , Chun-Kai Liu
IPC: H01L23/34 , H01L23/495 , H01L25/18 , H01L25/07 , H01L23/498
CPC classification number: H01L23/49575 , H01L23/13 , H01L23/3735 , H01L23/492 , H01L23/49562 , H01L23/49568 , H01L23/49811 , H01L23/49861 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L25/072 , H01L25/18 , H01L2224/04105 , H01L2224/06181 , H01L2224/2518 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2224/83447 , H01L2924/00014 , H01L2224/291 , H01L2924/014
Abstract: A power module includes a first substrate, at least two power elements, at least one first conductive structure and at least one leadframe. The first substrate includes a dielectric frame, two first fan-out circuit structure layers and two dielectric plates. The two first fan-out circuit structure layers are respectively disposed on two opposite surfaces of the dielectric frame, the two dielectric plates are respectively disposed on the two first fan-out circuit structure layers, each of the dielectric plates has at least one opening, and the opening and the corresponding first fan-out circuit structure layer form a concavity. The two power elements are respectively embedded in the two concavities. The two power elements are electrically connected to each other through the first conductive structure. The leadframe disposed at the first substrate is electrically connected to the two power elements, and is partially extended outside the first substrate.
Abstract translation: 功率模块包括第一衬底，至少两个功率元件，至少一个第一导电结构和至少一个引线框架。 第一基板包括电介质框架，两个第一扇出电路结构层和两个电介质板。 两个第一扇出电路结构层分别设置在电介质框架的两个相对表面上，两个电介质板分别设置在两个第一扇出电路结构层上，每个电介质板具有至少一个开口， 并且开口和相应的第一扇出电路结构层形成凹陷。 两个功率元件分别嵌入两个凹面。 两个功率元件通过第一导电结构彼此电连接。 设置在第一基板处的引线框架电连接到两个功率元件，并且部分地延伸到第一基板的外部。
-
公开(公告)号：US20160172285A1
公开(公告)日：2016-06-16
申请号：US14965909
申请日：2015-12-11
Applicant: Industrial Technology Research Institute
Inventor： Shu-Jung Yang , Yu-Lin Chao , Heng-Chieh Chien , Chun-Kai Liu
IPC: H01L23/495 , H01L25/07 , H01L23/498 , H01L25/18
CPC classification number: H01L23/49575 , H01L23/13 , H01L23/3735 , H01L23/492 , H01L23/49562 , H01L23/49568 , H01L23/49811 , H01L23/49861 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L25/072 , H01L25/18 , H01L2224/04105 , H01L2224/06181 , H01L2224/2518 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2224/83447 , H01L2924/00014 , H01L2224/291 , H01L2924/014
Abstract: A power module includes a first substrate, at least two power elements, at least one first conductive structure and at least one leadframe. The first substrate includes a dielectric frame, two first fan-out circuit structure layers and two dielectric plates. The two first fan-out circuit structure layers are respectively disposed on two opposite surfaces of the dielectric frame, the two dielectric plates are respectively disposed on the two first fan-out circuit structure layers, each of the dielectric plates has at least one opening, and the opening and the corresponding first fan-out circuit structure layer form a concavity. The two power elements are respectively embedded in the two concavities. The two power elements are electrically connected to each other through the first conductive structure. The leadframe disposed at the first substrate is electrically connected to the two power elements, and is partially extended outside the first substrate.
Abstract translation: 功率模块包括第一衬底，至少两个功率元件，至少一个第一导电结构和至少一个引线框架。 第一基板包括电介质框架，两个第一扇出电路结构层和两个电介质板。 两个第一扇出电路结构层分别设置在电介质框架的两个相对表面上，两个电介质板分别设置在两个第一扇出电路结构层上，每个电介质板具有至少一个开口， 并且开口和相应的第一扇出电路结构层形成凹陷。 两个功率元件分别嵌入两个凹面。 两个功率元件通过第一导电结构彼此电连接。 设置在第一基板处的引线框架电连接到两个功率元件，并且部分地延伸到第一基板的外部。
-
公开(公告)号：US20250105486A1
公开(公告)日：2025-03-27
申请号：US18474239
申请日：2023-09-26
Applicant: Industrial Technology Research Institute
Inventor： Heng-Chieh Chien , Shu-Jung Yang , Feng-Hsiang Lo , Yu-Lin Chao
Abstract: An antenna-in-package with a heat dissipation structure includes a circuit board, an antenna substrate, a chip, a plurality of heat dissipation fins, a chassis, and dielectric fluid. The circuit board has a first surface and a second surface opposite to the first surface. The antenna substrate is disposed above the first surface of the circuit board. The chip is disposed between the antenna substrate and the first surface of the circuit board and is electrically connected to the antenna substrate. The plurality of heat dissipation fins protrude from the second surface of the circuit board. The chassis encapsulates the circuit board, the antenna substrate, the chip, and the plurality of heat dissipation fins. The dielectric fluid circulates and flows in the chassis through a cooling circulation device and is in direct contact with the plurality of heat dissipation fins.
-
Patent Agency Ranking
公开(公告)号：US10818574B2
公开(公告)日：2020-10-27
申请号：US16883470
申请日：2020-05-26
Applicant: Industrial Technology Research Institute
Inventor： Shu-Jung Yang , Yu-Lin Chao , Chun-Kai Liu , Ming Kaan Liang , Jiin Shing Perng
IPC: H01L23/36 , H01L23/373 , H01L25/065 , H01L23/427 , H01L25/11 , H01L25/07 , H01L23/31 , H01L23/467 , H01L23/367
Abstract: A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.
-
公开(公告)号：US20140138075A1
公开(公告)日：2014-05-22
申请号：US13853073
申请日：2013-03-29
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Shu-Jung Yang , Yu-Lin Chao , Chun-Kai Liu , Chi-Chuan Wang , Kun-Ying Liou
IPC: F28F3/02
CPC classification number: F28F3/02 , F28D15/0233 , F28D2021/0028 , F28F3/12 , F28F2250/06 , H01L23/3735 , H01L23/427 , H01L23/473 , H01L2224/32225 , H01L2224/48091 , H01L2224/48111 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
Abstract: A heat exchanger suitable for cooling a heat source is provided, wherein a bypass channel formed in the heat exchanger has a width greater than a width of other channels to reduce a flow resistance of a fluid and a pumping power for driving a system. That is, under the same pumping power loss, more fluid is driven to achieve a better heat dissipation effect. By applying the heat exchanger, electronic devices are bonded to a top of the heat exchanger through a supporting substrate. In this way, heat generated when the electronic devices are is transferred to the heat exchanger through the supporting substrate and dissipated to the outside via the heat exchanger. Since the distance of heat transfer is decreased, the thermal resistance generated by an interface between the devices is reduced to improve heat transfer efficiency and heat dissipation effect.
Abstract translation: 提供了一种适于冷却热源的热交换器，其中形成在热交换器中的旁通通道的宽度大于其它通道的宽度，以减小流体的流动阻力和用于驱动系统的泵送功率。 也就是说，在相同的泵浦功率损耗下，驱动更多的流体以实现更好的散热效果。 通过应用热交换器，电子设备通过支撑衬底结合到热交换器的顶部。 以这种方式，当电子设备通过支撑衬底传送到热交换器时产生的热量经由热交换器散发到外部。 由于传热距离减小，所以由设备之间的界面产生的热阻降低，以提高传热效率和散热效果。
-
公开(公告)号：US11942396B2
公开(公告)日：2024-03-26
申请号：US17564219
申请日：2021-12-29
Applicant: Industrial Technology Research Institute
Inventor： Heng-Chieh Chien , Shu-Jung Yang , Yu-Min Lin , Chih-Yao Wang , Yu-Lin Chao
IPC: H01L23/427 , H01L23/00 , H01L23/48 , H01L23/498 , H01L25/065
CPC classification number: H01L23/427 , H01L23/481 , H01L23/49816 , H01L23/49822 , H01L23/49833 , H01L23/49838 , H01L24/16 , H01L25/0655 , H01L2224/16235
Abstract: A heterogeneous integration semiconductor package structure including a heat dissipation assembly, multiple chips, a package assembly, multiple connectors and a circuit substrate is provided. The heat dissipation assembly has a connection surface and includes a two-phase flow heat dissipation device and a first redistribution structure layer embedded in the connection surface. The chips are disposed on the connection surface of the heat dissipation assembly and electrically connected to the first redistribution structure layer. The package assembly surrounds the chips and includes a second redistribution structure layer disposed on a lower surface and multiple conductive vias electrically connected to the first redistribution structure layer and the second redistribution structure layer. The connectors are disposed on the package assembly and electrically connected to the second redistribution structure layer. The circuit substrate is electrically connected to the second redistribution structure layer of the package assembly through the connectors.
-
公开(公告)号：US20230170279A1
公开(公告)日：2023-06-01
申请号：US17564219
申请日：2021-12-29
Applicant: Industrial Technology Research Institute
Inventor： Heng-Chieh Chien , Shu-Jung Yang , Yu-Min Lin , Chih-Yao Wang , Yu-Lin Chao
IPC: H01L23/427 , H01L25/065 , H01L23/00 , H01L23/498 , H01L23/48
CPC classification number: H01L23/427 , H01L25/0655 , H01L24/16 , H01L23/49816 , H01L23/49833 , H01L23/49822 , H01L23/49838 , H01L23/481 , H01L2224/16235
Abstract: A heterogeneous integration semiconductor package structure including a heat dissipation assembly, multiple chips, a package assembly, multiple connectors and a circuit substrate is provided. The heat dissipation assembly has a connection surface and includes a two-phase flow heat dissipation device and a first redistribution structure layer embedded in the connection surface. The chips are disposed on the connection surface of the heat dissipation assembly and electrically connected to the first redistribution structure layer. The package assembly surrounds the chips and includes a second redistribution structure layer disposed on a lower surface and multiple conductive vias electrically connected to the first redistribution structure layer and the second redistribution structure layer. The connectors are disposed on the package assembly and electrically connected to the second redistribution structure layer. The circuit substrate is electrically connected to the second redistribution structure layer of the package assembly through the connectors.
-
公开(公告)号：US20200286808A1
公开(公告)日：2020-09-10
申请号：US16883470
申请日：2020-05-26
Applicant: Industrial Technology Research Institute
Inventor： Shu-Jung Yang , Yu-Lin Chao , Chun-Kai Liu , Ming Kaan Liang , Jiin Shing Perng
IPC: H01L23/373 , H01L25/065 , H01L23/427 , H01L25/11 , H01L23/36 , H01L25/07
Abstract: A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.
-
-
-
-
-
-
-
-
-
Search Results
14
records
(took 0.016 seconds)
