公开(公告)号：US20240213131A1

公开(公告)日：2024-06-27

申请号：US18089499

申请日：2022-12-27

Applicant: Intel Corporation

Inventor： Yi YANG ,  Andrew WENTZEL ,  Marcel WALL ,  Suddhasattwa NAD

IPC: H01L23/498 ,  C25D3/38 ,  C25D7/12 ,  C25D17/00 ,  H01L23/15

CPC classification number: H01L23/49827 ,  C25D3/38 ,  C25D7/12 ,  C25D17/001 ,  H01L23/15 ,  H01L24/16 ,  H01L2224/16225

Abstract: In an embodiment, a package substrate is described. In an embodiment, the package substrate comprises a layer, where the layer is a dielectric material. In an embodiment, a via opening is provided through a thickness of the layer. In an embodiment, a conductive via is in the via opening, where the conductive via has a substantially uniform composition throughout a thickness of the conductive via. In an embodiment the conductive via directly contacts the layer.

公开(公告)号：US20230420322A1

公开(公告)日：2023-12-28

申请号：US17848615

申请日：2022-06-24

Applicant: Intel Corporation

Inventor： Yi YANG ,  Srinivas V. PIETAMBARAM ,  Suddhasattwa NAD ,  Darko GRUJICIC ,  Marcel WALL

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/495

CPC classification number: H01L23/3142 ,  H01L23/49827 ,  H01L23/49513

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to an organic adhesion promoter layer on the surface of a copper trace to reduce delamination between a dielectric material and the surface of the copper trace, and to facilitate a smooth surface interface between the surface of the copper trace and of a copper feature, such as a copper-filled via, placed on the surface of the copper trace. The smooth surface interface reduces insertion loss and enables routing of higher frequency signals on a package, and does not require roughing of the copper trace in order to adhere to the dielectric material. Other embodiments may be described and/or claimed.

公开(公告)号：US20230317614A1

公开(公告)日：2023-10-05

申请号：US17707351

申请日：2022-03-29

Applicant: Intel Corporation

Inventor： Yi YANG ,  Rahul N. MANEPALLI ,  Suddhasattwa NAD ,  Marcel WALL ,  Benjamin DUONG

IPC: H01L23/532 ,  H05K1/03 ,  H05K1/11 ,  H01L21/48

CPC classification number: H01L23/5329 ,  H05K1/036 ,  H05K1/111 ,  H01L23/53228 ,  H01L21/4857 ,  H01L21/486 ,  H05K2201/0145 ,  H05K2201/0195

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate with a plurality of first layers, where the first layers comprise an organic material. In an embodiment, a trace is embedded in the package substrate, and a second layer is over the trace, where the second layer comprises silicon and nitrogen. In an embodiment, the second layer is chemically bonded to the one of the first layers

公开(公告)号：US20180041557A1

公开(公告)日：2018-02-08

申请号：US15554693

申请日：2015-04-07

Applicant: Intel Corporation

Inventor： Bin ZHU ,  Yi YANG ,  He LIN ,  Yuming LI ,  Zuo WANG ,  Zhouyi XIE

IPC: H04L29/06 ,  H04N21/414 ,  H04W4/06

CPC classification number: H04W4/50 ,  G06F9/547 ,  H04L65/4084 ,  H04L65/4092 ,  H04L65/602 ,  H04L67/1097 ,  H04L67/125 ,  H04L67/42 ,  H04N21/41407 ,  H04W4/06

Abstract: Apparatuses, methods and storage medium associated with cloud computing for mobile client devices are disclosed herein. In embodiments, a cloud server may include one or more processors, and a mobile computing operating system to host execution of an application. The cloud server may also include a cloud application server to interact with a cloud application client of a mobile client device to provide audio and video streams to the mobile client device, and to receive touch, key and sensor events from the mobile client device, to enable the application to be executed for the mobile client device. Other embodiments may be described or claimed.

公开(公告)号：US20250045573A1

公开(公告)日：2025-02-06

申请号：US18709267

申请日：2022-03-03

Applicant: Intel Corporation

Inventor： Anbang YAO ,  Yikai WANG ,  Zhaole SUN ,  Yi YANG ,  Feng CHEN ,  Zhuo WANG ,  Shandong WANG ,  Yurong CHEN

IPC: G06N3/0495 ,  G06N3/0464

Abstract: The disclosure relates to decimal-bit network quantization of CNN models. Methods, apparatus, systems, and articles of manufacture for quantizing a CNN model includes, for a convolutional layer of the CNN model: allocating a 1-bit convolutional kernel subset to the convolutional layer, wherein the convolutional layer includes 32-bit or 16-bit floating-point convolutional kernels with a size of K×K and the 1-bit convolutional kernel subset includes 2N 1-bit convolutional kernel candidates with the size of K×K, 1≤N

公开(公告)号：US20240111089A1

公开(公告)日：2024-04-04

申请号：US17956750

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Yi YANG ,  Suddhasattwa NAD ,  Robert Alan MAY

IPC: G02B6/12 ,  B82Y20/00 ,  G02B1/115 ,  G02B6/122 ,  G02B6/132 ,  G02B6/136 ,  G02B6/43

CPC classification number: G02B6/12004 ,  B82Y20/00 ,  G02B1/115 ,  G02B6/1228 ,  G02B6/132 ,  G02B6/136 ,  G02B6/43 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12147 ,  G02B2006/12176

Abstract: Embodiments herein relate to systems, apparatuses, techniques, or processes for improving the refractive index of the coating that optically couples with an optical medium, wherein the coating includes one or more layers that include a plurality of nanorods. The plurality of nanorods within each of the one or more layers may have a similar orientation in the chemical composition. The nanorods within separate layers may have different characteristics, including different orientations, different sizes, and/or different chemical compositions. Other embodiments may be described and/or claimed.

公开(公告)号：US20240006297A1

公开(公告)日：2024-01-04

申请号：US17853582

申请日：2022-06-29

Applicant: Intel Corporation

Inventor： Suddhasattwa NAD ,  Kristof DARMAWIKARTA ,  Srinivas V. PIETAMBARAM ,  Tarek A. IBRAHIM ,  Rahul N. MANEPALLI ,  Darko GRUJICIC ,  Marcel WALL ,  Yi YANG

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/538

CPC classification number: H01L23/49894 ,  H01L21/4846 ,  H01L23/538 ,  H01L21/481

Abstract: Embodiments herein relate to systems, apparatuses, or processes for forming a silicide and a silicon nitrate layer between a copper feature and dielectric to reduce delamination of the dielectric. Embodiments allow an unroughened surface for the copper feature to reduce the insertion loss for transmission lines that go through the unroughened surface of the copper. Embodiments may include sequential interlayers between a dielectric and copper. Other embodiments may be described and/or claimed.

公开(公告)号：US20240006283A1

公开(公告)日：2024-01-04

申请号：US17853487

申请日：2022-06-29

Applicant: Intel Corporation

Inventor： Suddhasattawa NAD ,  Rahul N. MANEPALLI ,  Gang DUAN ,  Srinivas V. PIETAMBARAM ,  Yi YANG ,  Marcel WALL ,  Darko GRUJICIC ,  Haobo CHEN ,  Aaron GARELICK

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49822 ,  H01L23/49866 ,  H01L21/4857 ,  H01L2224/16225 ,  H01L24/16

Abstract: Embodiments disclosed herein include package substrates and methods of forming such substrates. In an embodiment, a package substrate comprises a core, a first layer over the core, where the first layer comprises a metal, and a second layer over the first layer, where the second layer comprises an electrical insulator. In an embodiment, the package substrate further comprises a third layer over the second layer, where the third layer comprises a dielectric material, and where an edge of the core extends past edges of the first layer, the second layer, and the third layer.

公开(公告)号：US20230317584A1

公开(公告)日：2023-10-05

申请号：US17707371

申请日：2022-03-29

Applicant: Intel Corporation

Inventor： Yi YANG ,  Suddhasattwa NAD ,  Marcel WALL ,  Rahul N. MANEPALLI ,  Benjamin DUONG

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/18

CPC classification number: H01L23/49822 ,  H01L23/49866 ,  H01L23/49894 ,  H01L21/4857 ,  H01L21/486 ,  H05K1/181 ,  H01L24/16

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a package substrate with a plurality of first layers, where the first layers comprise an organic material. In an embodiment, a trace is embedded in the package substrate. In an embodiment, a second layer is over the trace, where the second layer comprises silicon and nitrogen, and wherein the second layer is chemically bonded to one of the first layers by an oxygen containing ligand and/or a nitrogen containing ligand.

公开(公告)号：US20230317583A1

公开(公告)日：2023-10-05

申请号：US17707358

申请日：2022-03-29

Applicant: Intel Corporation

Inventor： Rahul N. MANEPALLI ,  Yi YANG ,  Suddhasattwa NAD ,  Benjamin DUONG ,  Marcel WALL

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/18

CPC classification number: H01L23/49822 ,  H01L23/49866 ,  H01L23/49894 ,  H01L21/4857 ,  H05K1/181 ,  H01L24/16

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate with a plurality of first layers, where the first layers comprise an organic material. In an embodiment, a trace is embedded in the package substrate. In an embodiment, a second layer is over the trace, where the second layer comprises silicon, nitrogen, and a catalyst, and where the second layer is chemically bonded to one of the first layers.