公开(公告)号：US20100213490A1

公开(公告)日：2010-08-26

申请号：US12711636

申请日：2010-02-24

申请人： Il Woo PARK ,  Yong Chun Kim ,  Na Na Park ,  Bang Won Oh

发明人： Il Woo PARK ,  Yong Chun Kim ,  Na Na Park ,  Bang Won Oh

IPC分类号： H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  C08L63/04 ,  C09K11/02

CPC分类号： H05B33/04 ,  C08G59/306 ,  C08G59/3281 ,  C08L63/00 ,  H01L33/501 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： According to an aspect of the present invention, there is provided a sealing composition for a light emitting device, the sealing composition including: a silicone/epoxy compound resin including a silicone resin having at least one silicon atom-bonded hydroxyl group and an epoxy resin having at least one oxirane group while the hydroxyl group of the silicone resin and the oxirane group of the epoxy resin are chemically bound to each other.

摘要翻译： 根据本发明的一个方面，提供了一种用于发光器件的密封组合物，所述密封组合物包括：包含具有至少一个与硅原子键合的羟基的硅酮树脂和环氧树脂的硅氧烷/环氧化合物树脂 具有至少一个环氧乙烷基团，而硅氧烷树脂的羟基和环氧树脂的环氧乙烷基团彼此化学键合。

公开(公告)号：US08445927B2

公开(公告)日：2013-05-21

申请号：US12360250

申请日：2009-01-27

申请人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

发明人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

IPC分类号： H01L21/50

CPC分类号： H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

公开(公告)号：US08507299B2

公开(公告)日：2013-08-13

申请号：US12785024

申请日：2010-05-21

申请人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

发明人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

摘要翻译： 本发明涉及发光二极管封装及其制造方法。 发光二极管封装包括基板，安装在基板的上部的LED芯片，涂覆在基板上部的模塑材料，其包括LED芯片的外表面，以及涂覆在基板的下部的密封剂 并且可以提高发光效率，最小化封装故障，并且通过促进制造工艺来降低制造成本。

公开(公告)号：US08890188B2

公开(公告)日：2014-11-18

申请号：US13290639

申请日：2011-11-07

申请人： Na Na Park ,  Il Woo Park ,  Chang Hoon Kwak

发明人： Na Na Park ,  Il Woo Park ,  Chang Hoon Kwak

IPC分类号： H01L33/60 ,  H01L33/48 ,  H01L33/62 ,  H01L33/50

CPC分类号： H01L33/507 ,  H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2924/00014

摘要： A light emitting device package includes: first and second electrodes, at least a portion of a lower surface thereof being exposed; a light emitting device disposed on an upper surface of at least one of the first and second electrodes; a reflection wall disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and a fluorescent film disposed on the reflection wall to cover an upper portion of the mounting part. The mounting part is filled with air.

摘要翻译： 发光器件封装包括：第一和第二电极，其下表面的至少一部分被暴露; 设置在所述第一和第二电极中的至少一个的上表面上的发光器件; 反射壁，设置在第一和第二电极的上表面上并围绕发光装置，以在其中形成安装部分; 以及设置在所述反射壁上以覆盖所述安装部的上部的荧光膜。 安装部分充满空气。

公开(公告)号：US20140141283A1

公开(公告)日：2014-05-22

申请号：US14127878

申请日：2011-08-12

申请人： Seung Jae Lee ,  Na Na Park ,  Gyeong Seon Seon Park ,  Bo Kyoung Kim ,  Jong Rak Sohn ,  Chang Hoon Kwak

发明人： Seung Jae Lee ,  Na Na Park ,  Gyeong Seon Seon Park ,  Bo Kyoung Kim ,  Jong Rak Sohn ,  Chang Hoon Kwak

IPC分类号： C09K11/02 ,  B05D5/06

CPC分类号： C09K11/025 ,  B05D5/06 ,  C08J7/06 ,  C09K11/08

摘要： A method of manufacturing a phosphor resin film and a phosphor resin film manufactured thereby are provided. The method of manufacturing a phosphor resin film includes preparing a polymer slurry by mixing a polymer resin and a latent curing agent in a solvent, spreading the polymer slurry such that it has a film shape, drying the spread polymer slurry to form a semi-hardened resin film, and providing phosphor powder to the semi-hardened resin film. A phosphor resin film includes semi-hardened resin film including a polymer resin and a latent curing agent and phosphors uniformly formed on one surface of the semi-hardened resin film.

摘要翻译： 提供了制造荧光体树脂膜的方法和由此制造的荧光体树脂膜。 制造荧光体树脂膜的方法包括通过在溶剂中混合聚合物树脂和潜在性固化剂来制备聚合物浆料，将聚合物浆料铺展成膜形状，干燥扩展聚合物浆料以形成半硬化 树脂膜，并向半硬化树脂膜提供荧光体粉末。 荧光体树脂膜包括半固化树脂膜，其包含聚合物树脂和潜在性固化剂以及均匀地形成在半硬化树脂膜的一个表面上的荧光体。

公开(公告)号：US20120181571A1

公开(公告)日：2012-07-19

申请号：US13350516

申请日：2012-01-13

申请人： Na Na Park ,  II Woo Park ,  Kyu Jin Lee

发明人： Na Na Park ,  II Woo Park ,  Kyu Jin Lee

IPC分类号： H01L33/48 ,  H01L33/40 ,  B82Y99/00

CPC分类号： H01L33/62 ,  F21V21/0808 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/0753 ,  H01L33/0095 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32245 ,  H01L2224/83191 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/0543 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： Provided is an adhesive film for an LED chip, including: a double-sided adhesive layer having the LED chip adhered to an upper surface thereof and a lead frame adhered to a lower surface thereof; an ultraviolet (UV) cured layer adhered to one surface of the double-sided adhesive layer; and upper and lower cover layers respectively adhered to faces exposed to the exterior of the double-sided adhesive layer and the UV cured layer.

摘要翻译： 本发明提供一种LED芯片用粘合膜，其特征在于，包括：具有附着在其上表面的LED芯片的双面粘合剂层和粘附于其下表面的引线框架; 附着在双面粘合剂层的一个表面上的紫外线（UV）固化层; 以及分别粘附到暴露于双面粘合剂层和UV固化层的外部的表面的上和下覆盖层。

公开(公告)号：US20110260192A1

公开(公告)日：2011-10-27

申请号：US13122323

申请日：2009-10-01

申请人： Chang Hoon Kwak ,  II Woo Park ,  Jong Rak Sohn ,  Hyo Jin Lee ,  Na Na Park ,  Seong Ah Joo

发明人： Chang Hoon Kwak ,  II Woo Park ,  Jong Rak Sohn ,  Hyo Jin Lee ,  Na Na Park ,  Seong Ah Joo

IPC分类号： H01L33/60 ,  H01L33/38

CPC分类号： H01L33/56 ,  H01L24/48 ,  H01L33/02 ,  H01L33/382 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01084 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A light emitting diode (LED) package using a liquid crystal polymer, includes: a package main body formed by using a liquid crystal polymer; a lead frame formed on the package main body; an LED chip mounted on the lead frame; and a resin packaging unit encapsulating the LED chip, the resin packaging unit including phosphors. The LED package is highly reliable.

摘要翻译： 使用液晶聚合物的发光二极管（LED）封装包括：通过使用液晶聚合物形成的封装主体; 形成在所述包装主体上的引线框架; 安装在引线框架上的LED芯片; 以及封装LED芯片的树脂封装单元，所述树脂封装单元包括荧光体。 LED封装非常可靠。

公开(公告)号：US20100127290A1

公开(公告)日：2010-05-27

申请号：US12360250

申请日：2009-01-27

申请人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  II Woo Park

发明人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  II Woo Park

IPC分类号： H01L21/50 ,  H01L33/00

CPC分类号： H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

摘要翻译： 本发明涉及发光二极管封装及其制造方法。 发光二极管封装包括基板，安装在基板的上部的LED芯片，涂覆在基板上部的模塑材料，其包括LED芯片的外表面，以及涂覆在基板的下部的密封剂 并且可以提高发光效率，最小化封装故障，并且通过促进制造工艺来降低制造成本。