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公开(公告)号：US09379046B2
公开(公告)日：2016-06-28
申请号：US14752295
申请日：2015-06-26
Applicant: Infineon Technologies AG
Inventor： Ralf Otremba , Xaver Schloegel , Khai Huat Jeffrey Low , Chee Soon Law
IPC: H01L21/00 , H01L23/495 , H01L23/00 , B81C1/00
CPC classification number: H01L23/49503 , B81C1/00301 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/00 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/84 , H01L24/85 , H01L24/91 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/37144 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/73213 , H01L2224/78301 , H01L2224/7865 , H01L2224/84801 , H01L2224/85045 , H01L2224/85099 , H01L2224/851 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85801 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48639 , H01L2224/48644 , H01L2924/01016 , H01L2924/01026 , H01L2924/01201
Abstract: A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
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公开(公告)号：US20150294926A1
公开(公告)日：2015-10-15
申请号：US14752295
申请日：2015-06-26
Applicant: Infineon Technologies AG
Inventor： Ralf Otremba , Xaver Schloegel , Khai Huat Jeffrey Low , Chee Soon Law
IPC: H01L23/495 , B81C1/00 , H01L23/00
CPC classification number: H01L23/49503 , B81C1/00301 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/00 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/84 , H01L24/85 , H01L24/91 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/37144 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/73213 , H01L2224/78301 , H01L2224/7865 , H01L2224/84801 , H01L2224/85045 , H01L2224/85099 , H01L2224/851 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85801 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48639 , H01L2224/48644 , H01L2924/01016 , H01L2924/01026 , H01L2924/01201
Abstract: A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
Abstract translation: 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。
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公开(公告)号：US20140110829A1
公开(公告)日：2014-04-24
申请号：US14144192
申请日：2013-12-30
Applicant: Infineon Technologies AG
Inventor： Ralf Otremba , Xaver Schloegel , Khai Huat Jeffrey Low , Chee Soon Law
IPC: H01L23/495
CPC classification number: H01L23/49503 , B81C1/00301 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/00 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/84 , H01L24/85 , H01L24/91 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/37144 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/73213 , H01L2224/78301 , H01L2224/7865 , H01L2224/84801 , H01L2224/85045 , H01L2224/85099 , H01L2224/851 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85801 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48639 , H01L2224/48644 , H01L2924/01016 , H01L2924/01026 , H01L2924/01201
Abstract: A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
Abstract translation: 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。
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公开(公告)号：US09123526B2
公开(公告)日：2015-09-01
申请号：US14144192
申请日：2013-12-30
Applicant: Infineon Technologies AG
Inventor： Ralf Otremba , Xaver Schloegel , Khai Huat Jeffrey Low , Chee Soon Law
CPC classification number: H01L23/49503 , B81C1/00301 , H01L23/4952 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/00 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/84 , H01L24/85 , H01L24/91 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/37144 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/73213 , H01L2224/78301 , H01L2224/7865 , H01L2224/84801 , H01L2224/85045 , H01L2224/85099 , H01L2224/851 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85801 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48639 , H01L2224/48644 , H01L2924/01016 , H01L2924/01026 , H01L2924/01201
Abstract: A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.
Abstract translation: 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。
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