公开(公告)号：US20190023561A1

公开(公告)日：2019-01-24

申请号：US15653234

申请日：2017-07-18

Applicant: Infineon Technologies AG

Inventor： Sook Woon Chan ,  Chau Fatt Chiang ,  Kok Yau Chua ,  Swee Kah Lee ,  Chee Yang Ng

IPC: B81B7/00 ,  B81B7/02 ,  G01L19/00 ,  B81C1/00

Abstract: An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect.

公开(公告)号：US11081417B2

公开(公告)日：2021-08-03

申请号：US16514853

申请日：2019-07-17

Applicant: Infineon Technologies AG

Inventor： Sook Woon Chan ,  Chau Fatt Chiang ,  Kok Yau Chua ,  Soon Lock Goh ,  Swee Kah Lee ,  Joachim Mahler ,  Mei Chin Ng ,  Beng Keh See ,  Guan Choon Matthew Nelson Tee

IPC: H01L23/552 ,  H01L23/31 ,  C09D5/24 ,  C23C18/16 ,  C23C18/18 ,  H01L23/29 ,  C09D5/00 ,  C09D201/00 ,  C23C18/34 ,  H01L21/56 ,  H01L23/66 ,  H01L23/00

Abstract: A method of manufacturing a package, comprising embedding the semiconductor chip with an encapsulant comprising a transition metal in a concentration in a range between 10 ppm and 10,000 ppm; selectively converting of a part of the transition metal, such that the electrical conductivity of the encapsulant increases; and plating the converted part of the encapsulant with an electrically conductive material.

公开(公告)号：US09475691B1

公开(公告)日：2016-10-25

申请号：US14751316

申请日：2015-06-26

Applicant: Infineon Technologies AG

Inventor： Kok Yau Chua ,  Sook Woon Chan ,  Chau Fatt Chiang ,  Stefan Martens ,  Matthias Steiert ,  Kian Hong Yeo ,  Hock Siang Chua ,  Mei Chin Ng ,  Swee Kah Lee

IPC: H01L23/495 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0064 ,  B81B7/0032 ,  B81B7/0048 ,  B81B7/0051 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2203/0315 ,  B81B2207/093 ,  B81C1/00333 ,  B81C2203/0154 ,  B81C2203/032 ,  H01L23/04 ,  H01L23/24 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49575 ,  H01L23/49861 ,  H01L2224/16245

Abstract: A semiconductor package includes an electrically conductive lead-frame, including a first die paddle having a first opening, and a plurality of electrically conductive leads, a ridge formed around a perimeter of the first opening, and an electrically insulating molding compound. The electrically insulating molding compound includes an interior cavity being defined by a planar base surface and outer sidewalls, a second opening formed in the base surface, and an interior sidewall within the interior cavity. The molding compound is formed around the lead-frame with the first die paddle in the interior cavity. The first and second openings are aligned with one another so as to form a port that provides access to the interior cavity. The ridge and the interior sidewall form a dam that is configured to collect liquefied sealant and prevent the liquefied sealant from overflowing into the port or into adjacent regions of the interior cavity.

Abstract translation: 半导体封装包括导电引线框架，其包括具有第一开口的第一管芯焊盘和多个导电引线，围绕第一开口周边形成的脊，以及电绝缘模塑料。 电绝缘模制化合物包括由平坦的基面和外侧壁限定的内腔，形成在基底表面中的第二开口和内腔内的内侧壁。 模制化合物围绕引线架形成，其中第一管芯焊盘在内部空腔中。 第一和第二开口彼此对齐，以便形成提供通向内腔的通路的端口。 脊和内侧壁形成一个水坝，其构造成收集液化的密封剂并防止液化的密封剂溢出到内部空腔的端口或邻近的区域中。

公开(公告)号：US20220005778A1

公开(公告)日：2022-01-06

申请号：US17361950

申请日：2021-06-29

Applicant: Infineon Technologies AG

Inventor： Swee Kah Lee ,  Sook Woon Chan ,  Fong Mei Lum ,  Joachim Mahler ,  Muhammad Muhammat Sanusi

IPC: H01L23/00

Abstract: A method for fabricating a semiconductor device with a heterogeneous solder joint includes: providing a semiconductor die; providing a coupled element; and soldering the semiconductor die to the coupled element with a first solder joint. The first solder joint includes: a solder material including a first metal composition; and a coating including a second metal composition, different from the first metal composition, the coating at least partially covering the solder material. The second metal composition has a greater stiffness and/or a higher melting point than the first metal composition.

公开(公告)号：US20200048075A1

公开(公告)日：2020-02-13

申请号：US16659936

申请日：2019-10-22

Applicant: Infineon Technologies AG

Inventor： Sook Woon Chan ,  Chau Fatt Chiang ,  Kok Yau Chua ,  Swee Kah Lee ,  Chee Yang Ng

IPC: B81B7/00 ,  H01L29/84 ,  G01L19/00 ,  B81C1/00 ,  B81B7/02 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

Abstract: An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect.

公开(公告)号：US11682644B2

公开(公告)日：2023-06-20

申请号：US17361950

申请日：2021-06-29

Applicant: Infineon Technologies AG

Inventor： Swee Kah Lee ,  Sook Woon Chan ,  Fong Mei Lum ,  Joachim Mahler ,  Muhammad Muhammat Sanusi

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/11822 ,  H01L2224/1357 ,  H01L2224/1362 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13618 ,  H01L2224/13638 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/13664 ,  H01L2224/81801

Abstract: A method for fabricating a semiconductor device with a heterogeneous solder joint includes: providing a semiconductor die; providing a coupled element; and soldering the semiconductor die to the coupled element with a first solder joint. The first solder joint includes: a solder material including a first metal composition; and a coating including a second metal composition, different from the first metal composition, the coating at least partially covering the solder material. The second metal composition has a greater stiffness and/or a higher melting point than the first metal composition.

公开(公告)号：US11174152B2

公开(公告)日：2021-11-16

申请号：US16659936

申请日：2019-10-22

Applicant: Infineon Technologies AG

Inventor： Sook Woon Chan ,  Chau Fatt Chiang ,  Kok Yau Chua ,  Swee Kah Lee ,  Chee Yang Ng

IPC: B81B7/00 ,  H04R31/00 ,  H04R19/04 ,  H04R19/00 ,  B81B7/02 ,  B81C1/00 ,  G01L19/00 ,  H01L29/84 ,  H04R1/08 ,  H04R1/04

Abstract: An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect.

公开(公告)号：US10396007B2

公开(公告)日：2019-08-27

申请号：US15448018

申请日：2017-03-02

Applicant: Infineon Technologies AG

Inventor： Sook Woon Chan ,  Chau Fatt Chiang ,  Kok Yau Chua ,  Soon Lock Goh ,  Swee Kah Lee ,  Joachim Mahler ,  Mei Chin Ng ,  Beng Keh See ,  Guan Choon Matthew Nelson Tee

IPC: H01L23/552 ,  H01L23/31 ,  C09D5/00 ,  C09D201/00 ,  C23C18/16 ,  C23C18/18 ,  C23C18/34 ,  H01L21/56 ,  H01L23/29 ,  H01L23/66 ,  H01L23/00 ,  C09D5/24

Abstract: A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so that electrically conductive material is not plateable thereon.