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    DECOUPLING LAYER TO REDUCE UNDERFILL STRESS IN SEMICONDUCTOR DEVICES
    4.
    发明申请
    DECOUPLING LAYER TO REDUCE UNDERFILL STRESS IN SEMICONDUCTOR DEVICES 有权

    公开(公告)号：US20210066882A1

    公开(公告)日：2021-03-04

    申请号：US16554789

    申请日：2019-08-29

    Applicant: INTEL CORPORATION

    Inventor： Priyanka Dobriyal ,  Susheel G. Jadhav ,  Ankur Agrawal ,  Quan A. Tran ,  Raiyomand F. Aspandiar ,  Kenneth M. Brown

    IPC: H01S5/022 ,  G02F1/015

    Abstract: An integrated circuit assembly includes a support (e.g., package substrate or circuit board) and a semiconductor die including a device. The semiconductor die is mounted to the support with the device facing the support. The device can be, for example, a quantum well laser device or a photonics device. A layer of decoupling material is on the device. An underfill material is between the semiconductor die and the support, where the decoupling material is between the device and the underfill material. The decoupling layer decouples stress from transferring from the underfill material into the device. For example, the decoupling material forms only weak bonds with the underfill material and/or a passivation layer on the device, in an embodiment. Weak bonds include non-covalent bonds and non-ionic bonds, for example. The decoupling material can be, for instance, a PTFE film, a poly(p-xylylene) film, a fluorocarbon, or a compound lacking free hydroxyl groups.

    PROJECTED AUGMENTED REALITY TO OBSCURE PHYSICAL OBJECTS
    5.
    发明申请
    PROJECTED AUGMENTED REALITY TO OBSCURE PHYSICAL OBJECTS 审中-公开

    公开(公告)号：US20190043262A1

    公开(公告)日：2019-02-07

    申请号：US16017685

    申请日：2018-06-25

    Applicant: Intel Corporation

    Inventor： Glen J. Anderson ,  Carl Marshall ,  Ankur Agrawal ,  Meng Shi ,  Selvakumar Panneer

    IPC: G06T19/00 ,  G02B27/02 ,  G06T7/90 ,  G06T7/70 ,  G02B27/01

    Abstract: The present disclosure is directed to systems, apparatuses, and processes that provide mixed reality and/or augmented reality interactive environments. Disclosed embodiments include mechanisms to determine a location of a physical object within a mixed reality environment, determine a location of a viewer within the mixed reality environment, and project a display onto the physical object or on a portion of an area within the mixed reality environment proximate to the physical object to obscure the physical object from the viewer, based upon at least the location of the physical object with respect to the location of the viewer. Other embodiments may be disclosed and/or claimed.

    OPTICAL COMMUNICATION BETWEEN INTEGRATED CIRCUIT DEVICE ASSEMBLIES
    7.
    发明申请
    OPTICAL COMMUNICATION BETWEEN INTEGRATED CIRCUIT DEVICE ASSEMBLIES 有权

    公开(公告)号：US20220404553A1

    公开(公告)日：2022-12-22

    申请号：US17354446

    申请日：2021-06-22

    Applicant: Intel Corporation

    Inventor： Ankur Agrawal ,  Benjamin Duong ,  Ravindranath Mahajan ,  Debendra Mallik ,  Srinivas Pietambaram

    IPC: G02B6/26

    Abstract: An integrated circuit package may be formed comprising a first integrated circuit assembly, a second integrated circuit assembly, and a means to transfer optical signals therebetween. This optical signal transfer may be facilitated with a first lens or a first micro-lens array adjacent at least one waveguide of the first integrated circuit assembly and a second lens or second micro-lens array adjacent at least one waveguide of the second integrated circuit assembly, wherein the optical signals are transmitted across a gap between the first lens/micro-lens array and the second lens/micro-lens array. In further embodiments, the optical signal transfer assembly may comprise at least one photonic bridge between at least one waveguide of the first integrated circuit assembly and at least one waveguide of the second integrated circuit assembly.

    Technologies for physical programming
    9.
    发明授权
    Technologies for physical programming 有权

    公开(公告)号：US10275222B2

    公开(公告)日：2019-04-30

    申请号：US15070988

    申请日：2016-03-15

    Applicant: Intel Corporation

    Inventor： Glen J. Anderson ,  Rebecca A. Chierichetti ,  Meng Shi ,  Yevgeniy Y. Yarmosh ,  Mark R. Francis ,  Ravishankar Iyer ,  Reese Bowes ,  Ankur Agrawal

    IPC: G06F9/44 ,  G06F8/20 ,  G06F17/50

    Abstract: Apparatuses, methods and storage medium associated with a model compute system for physical programming are disclosed herein. In embodiments, an apparatus may include one or more processors, devices, and/or circuitry to identify first rules associated with one or more physical subcomponents, e.g., blocks, tiles, or the like, or combinations thereof, assembled in a constructed model in a first control modality, wherein at least one first rule defines a first predetermined behavior of the constructed model, and determine a first program stack for execution by the model compute system based on the first rules associated with the one or more physical subcomponents. Other embodiments may be described and/or claimed.

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