Abstract:
A memory device comprising: a memory cell array and a memory controller configured to program data to memory cells during a programming cycle using operations comprising: during a setup stage, providing a first voltage level to word lines, a second voltage level to a first dummy word line, and a fourth voltage level to second dummy word lines being different from the first dummy word line, wherein the first voltage level is lower than a threshold voltage of a first transistor coupled to the first dummy word line and the second voltage level and the fourth voltage are higher than the threshold voltage, during a program stage, providing a third voltage level to first word lines to program data to memory cells coupled to the first word lines, the second voltage level to the first dummy word line, and the fourth voltage level to the second dummy word lines.
Abstract:
A memory device includes a memory array including a number of memory cell strings, a number of bit lines, a number of pre-charge circuits coupled to the memory cell strings, and a number of sense amplifier circuits coupled to the memory cell strings through the bit lines. Each memory cell string includes at least one first select transistor, a second select transistor and at least one memory cell. Each bit line includes a third select transistor, and is coupled to a memory cell string. During a pre-charging stage, the pre-charge circuits provide a first voltage to pre-charge the memory cell strings. During a programming stage, for the memory cell strings to be inhibited, the sense amplifier circuits provide a second voltage lower than the first voltage. For the memory cell strings to be programmed, the sense amplifier circuits provide a third voltage lower than the second voltage.
Abstract:
A method and a circuit for generating a clock signal from a clock integrated circuit are introduced herein. A compensation voltage is generated according to a temperature coefficient of a resistor and a clock period of a clock circuit, where the compensation voltage is resistor-corner independent. The clock period of the clock circuit is determined by the resistor and at least one capacitor of the clock circuit. The temperature dependence of the clock period of the clock circuit is reduced according to the compensation voltage.
Abstract:
A boost circuit includes a power rail to provide a supply voltage, a switch transistor controlling output of a boosted signal from a source of the switch transistor, and a timing and voltage control circuit configured to generate an equalization (EQ) signal to be applied to a gate of the switch transistor. The EQ waveform has a level being an EQ high level, an EQ low level lower than the EQ high level, or an EQ clamped level between the EQ low level and the EQ high level.
Abstract:
A boost circuit includes a power rail to provide a supply voltage, a switch transistor controlling output of a boosted signal from a source of the switch transistor, and a timing and voltage control circuit configured to generate an equalization (EQ) signal to be applied to a gate of the switch transistor. The EQ waveform has a level being an EQ high level, an EQ low level lower than the EQ high level, or an EQ clamped level between the EQ low level and the EQ high level.
Abstract:
A circuit for in-memory multiply-and-accumulate functions includes a plurality of NAND blocks. A NAND block includes an array of NAND strings, including B columns and S rows, and L levels of memory cells. W word lines are coupled to (B*S) memory cells in respective levels in the L levels. A source line is coupled to the (B*S) NAND strings in the block. String select line drivers supply voltages to connect NAND strings on multiple string select lines to corresponding bit lines simultaneously. Word line drivers are coupled to apply word line voltages to a word line or word lines in a selected level. A plurality of bit line drivers apply input data to the B bit lines simultaneously. A current sensing circuit is coupled to the source line.
Abstract:
A memory device and a control method thereof are provided. The memory device includes I memory blocks, I global power lines and I first local driver modules. Each memory block includes M gate control lines and a plurality of transistor units arranged in M rows. Gates of the transistor units in the m-th row are electrically connected to the m-th gate control line. The I global power lines are electrically connected to I pre-driver circuits and the I memory blocks, respectively. Each first local driver module is electrically connected to one global power line and one memory block. Each first local driver module includes M first local driver circuits. The m-th first local driver circuit is electrically connected to the m-th gate control line.
Abstract:
A device includes a memory array storing data and error correcting codes ECCs corresponding to the data, and a multi-level buffer structure between the memory array and an input/output data path. The memory array includes a plurality of data lines for page mode operations. The buffer structure includes a first buffer having storage cells connected to respective data lines in the plurality of data lines for a page of data, a second buffer coupled to the storage cells in the first buffer for storing at least one page of data, and a third buffer coupled to the second buffer and to the input/output data path. The device includes logic coupled to the multi-level buffer to perform a logical process over pages of data during movement between the memory array and the input/output path through the multi-level buffer for at least one of page read and page write operations.
Abstract:
A memory device includes: a memory array including a plurality of memory cells and a plurality of bit lines; and a current converting circuit, coupled to the memory array. In executing a calculation operation, the memory cells of the memory array generate a source current corresponding to a calculation operation result. The source current is converted by the current converting circuit into an output value for being an input signal provided to a next calculation operation.
Abstract:
A driving method of a nonvolatile memory device including multiple memory planes includes following operations: precharging at least one word line and at least one bit line of a first memory plane; if the at least one word line and the at least one bit line of the first memory plane have been precharged for a first time length or to respective voltage thresholds, precharging at least one word line and at least one bit line of a second memory plane; conducting a first data operation to at least one memory cell of the first memory plane disposed at intersections of the at least one word line and the at least one bit line thereof; conducting a second data operation to at least one memory cell of the second memory plane disposed at intersections of the at least one word line and the at least one bit line thereof.