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    IC socket, a test method using the same and an IC socket mounting mechanism
    1.
    发明授权
    IC socket, a test method using the same and an IC socket mounting mechanism 有权
    IC插座，使用其的测试方法和IC插座安装机构

    公开(公告)号：US06535002B2

    公开(公告)日：2003-03-18

    申请号：US09809204

    申请日：2001-03-16

    申请人： Makoto Haseyama ,  Shigeyuki Maruyama ,  Masataka Mizukoshi ,  Futoshi Fukaya

    发明人： Makoto Haseyama ,  Shigeyuki Maruyama ,  Masataka Mizukoshi ,  Futoshi Fukaya

    IPC分类号： G01R3102

    CPC分类号： G01R1/0466 ,  G01R1/0483 ,  G01R1/06738 ,  G01R31/2863 ,  G01R31/2886 ,  H01L2924/00013 ,  H01L2224/29099

    摘要： An IC to be tested having solder bumps is mounted on an IC socket mounted on a test board. The IC socket is provided with a contact unit including a plurality of straight contact pins each having an lower end connected to the test board and an upper end connected to the solder bumps and also including an elastic member for supporting the plurality of contact pins. A diameter of the plurality of contact pins is configured to be sufficiently small for the plurality of contact pins to pierce the respective solder bumps so that an electrical connection is established by the upper end of each of the plurality of solder bumps piercing an associated one of the solder bumps.

    摘要翻译： 将被测试的具有焊锡凸块的IC安装在安装在测试板上的IC插座上。 IC插座设置有接触单元，该接触单元包括多个直接接触针，每个具有连接到测试板的下端和连接到焊料凸块的上端，并且还包括用于支撑多个接触针的弹性构件。 多个接触针的直径被构造成足够小以使多个接触针刺穿相应的焊料凸块，使得通过多个焊料凸块中的每一个的上端穿过相关联的一个焊接凸块来建立电连接 焊锡凸块。

    Test board and a test method using the same providing improved electrical connection
    3.
    发明授权
    Test board and a test method using the same providing improved electrical connection 失效
    测试板和使用该测试方法的测试方法提供改进的电气连接

    公开(公告)号：US6046598A

    公开(公告)日：2000-04-04

    申请号：US852159

    申请日：1997-05-06

    申请人： Naomi Miyaji ,  Susumu Moriya ,  Shigeyuki Maruyama ,  Makoto Haseyama ,  Futoshi Fukaya

    发明人： Naomi Miyaji ,  Susumu Moriya ,  Shigeyuki Maruyama ,  Makoto Haseyama ,  Futoshi Fukaya

    IPC分类号： G01R1/04 ,  H05K3/32 ,  G01R1/06 ,  G01R31/26

    CPC分类号： H05K3/326 ,  G01R1/0408

    摘要： A test board includes an insulating part provided to face a semiconductor device when the semiconductor device is mounted on the test board, a sloped connection hole formed in the insulating part for accepting a projection electrode when the semiconductor device is mounted on the test board, and a conductive part formed in the insulating part so as to be in contact with and electrically connected to the projection electrode. When the semiconductor device is mounted on the test board, the semiconductor device or the projection electrode is supported by the insulating part.

    摘要翻译： 测试板包括当半导体器件安装在测试板上时面向半导体器件的绝缘部分，当半导体器件安装在测试板上时用于接受投影电极的绝缘部分中形成的倾斜连接孔，以及 导电部分形成在绝缘部分中以与突起电极接触并电连接。 当半导体器件安装在测试板上时，半导体器件或突起电极由绝缘部分支撑。

    Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactor
    4.
    发明授权
    Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactor 有权
    用于半导体器件的接触器，使用这种接触器的测试装置，使用这种接触器的测试方法以及清洁这种接触器的方法

    公开(公告)号：US06466046B1

    公开(公告)日：2002-10-15

    申请号：US09362111

    申请日：1999-07-28

    申请人： Shigeyuki Maruyama ,  Futoshi Fukaya ,  Makoto Haseyama

    发明人： Shigeyuki Maruyama ,  Futoshi Fukaya ,  Makoto Haseyama

    IPC分类号： G01R3102

    CPC分类号： H01L21/6838 ,  G01R1/07314 ,  G01R31/2831 ,  G01R31/2886 ,  H01L21/67126 ,  H01L21/68735 ,  H01L21/68785

    摘要： A contactor for semiconductor devices includes a base unit for holding a semiconductor device provided with a plurality of terminals and a wiring substrate provided with contact electrodes at positions corresponding to at least some of the terminals. The contact electrodes and the terminals are electrically connected when the wiring substrate is held on the base unit. The contactor further includes a position maintaining force applying mechanism for applying a position maintaining force between the base unit and the wiring substrate and a contact pressure applying mechanism for applying a contact pressure between the semiconductor device and the wiring substrate. The position maintaining force applying mechanism and the contact pressure applying mechanism are operable in an independent manner.

    摘要翻译： 半导体器件的接触器包括用于保持设置有多个端子的半导体器件的基座单元和在与至少一些端子对应的位置处设置有接触电极的布线基板。 当布线基板被保持在基座单元上时，接触电极和端子电连接。 接触器还包括用于在基座单元和布线基板之间施加位置保持力的位置保持力施加机构和用于在半导体器件和布线基板之间施加接触压力的接触压力施加机构。 位置保持力施加机构和接触压力施加机构以独立的方式操作。

    Semiconductor testing device
    5.
    发明申请
    Semiconductor testing device 有权
    半导体测试装置

    公开(公告)号：US20050162180A1

    公开(公告)日：2005-07-28

    申请号：US11046883

    申请日：2005-02-01

    申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Futoshi Fukaya

    发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Futoshi Fukaya

    IPC分类号： G01R31/302 ,  G01R31/308 ,  H05K3/32 ,  G01R31/02

    CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

    摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

    摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。

    Semiconductor testing device
    6.
    发明授权
    Semiconductor testing device 有权
    半导体测试装置

    公开(公告)号：US06661247B2

    公开(公告)日：2003-12-09

    申请号：US09828221

    申请日：2001-04-09

    申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Futoshi Fukaya

    发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Futoshi Fukaya

    IPC分类号： G01R3126

    CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

    摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

    摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。

    Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactor
    8.
    发明授权
    Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactor 有权
    用于半导体器件的接触器，使用这种接触器的测试装置，使用这种接触器的测试方法以及清洁这种接触器的方法

    公开(公告)号：US06781395B2

    公开(公告)日：2004-08-24

    申请号：US10443829

    申请日：2003-05-23

    申请人： Shigeyuki Maruyama ,  Futoshi Fukaya ,  Makoto Haseyama

    发明人： Shigeyuki Maruyama ,  Futoshi Fukaya ,  Makoto Haseyama

    IPC分类号： G01R3102

    CPC分类号： H01L21/6838 ,  G01R1/07314 ,  G01R31/2831 ,  G01R31/2886 ,  H01L21/67126 ,  H01L21/68735 ,  H01L21/68785

    摘要： A contactor for semiconductor devices includes a base unit for holding a semiconductor device provided with a plurality of terminals and a wiring substrate provided with contact electrodes at positions corresponding to at least some of the terminals. The contact electrodes and the terminals are electrically connected when the wiring substrate is held on the base unit. The contactor further includes a position maintaining force applying mechanism for applying a position maintaining force between the base unit and the wiring substrate and a contact pressure applying mechanism for applying a contact pressure between the semiconductor device and the wiring substrate. The position maintaining force applying mechanism and the contact pressure applying mechanism are operable in an independent manner.

    摘要翻译： 半导体器件的接触器包括用于保持设置有多个端子的半导体器件的基座单元和在与至少一些端子对应的位置处设置有接触电极的布线基板。 当布线基板被保持在基座单元上时，接触电极和端子电连接。 接触器还包括用于在基座单元和布线基板之间施加位置保持力的位置保持力施加机构和用于在半导体器件和布线基板之间施加接触压力的接触压力施加机构。 位置保持力施加机构和接触压力施加机构以独立的方式操作。