公开(公告)号：US6046598A

公开(公告)日：2000-04-04

申请号：US852159

申请日：1997-05-06

申请人： Naomi Miyaji ,  Susumu Moriya ,  Shigeyuki Maruyama ,  Makoto Haseyama ,  Futoshi Fukaya

发明人： Naomi Miyaji ,  Susumu Moriya ,  Shigeyuki Maruyama ,  Makoto Haseyama ,  Futoshi Fukaya

IPC分类号： G01R1/04 ,  H05K3/32 ,  G01R1/06 ,  G01R31/26

CPC分类号： H05K3/326 ,  G01R1/0408

摘要： A test board includes an insulating part provided to face a semiconductor device when the semiconductor device is mounted on the test board, a sloped connection hole formed in the insulating part for accepting a projection electrode when the semiconductor device is mounted on the test board, and a conductive part formed in the insulating part so as to be in contact with and electrically connected to the projection electrode. When the semiconductor device is mounted on the test board, the semiconductor device or the projection electrode is supported by the insulating part.

摘要翻译： 测试板包括当半导体器件安装在测试板上时面向半导体器件的绝缘部分，当半导体器件安装在测试板上时用于接受投影电极的绝缘部分中形成的倾斜连接孔，以及 导电部分形成在绝缘部分中以与突起电极接触并电连接。 当半导体器件安装在测试板上时，半导体器件或突起电极由绝缘部分支撑。

公开(公告)号：US07174629B2

公开(公告)日：2007-02-13

申请号：US10369711

申请日：2003-02-21

申请人： Shigeyuki Maruyama ,  Makoto Haseyama ,  Futoshi Fukaya ,  Susumu Moriya ,  Naomi Miyaji

发明人： Shigeyuki Maruyama ,  Makoto Haseyama ,  Futoshi Fukaya ,  Susumu Moriya ,  Naomi Miyaji

IPC分类号： H01R9/00 ,  H05K3/00 ,  B23K31/00 ,  B23K31/02

CPC分类号： H01L24/11 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/06761 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/4853 ,  H01L24/13 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/1184 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/13173 ,  H01L2224/45144 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/749 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/81345 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15173 ,  H01R4/26 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49162 ,  H01L2224/48 ,  H01L2924/00

摘要： An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at positions corresponding to positions of terminals on an integrated circuit. A plurality of contacts of a second conductive material are bonded to the plurality of pads, respectively, the terminals of the integrated circuit being electrically connected to the contacts only when a pressure is exerted onto the contacts by the terminals of the integrated circuit, each contact having a projecting edge with a roughness produced by pulling a wire of the second conductive material apart from a corresponding one of the plurality of pads after the wire is bonded to the corresponding pad.

摘要翻译： 集成电路接触器包括绝缘材料的基部，该基部可弹性变形。 第一导电材料的多个焊盘在与集成电路上的端子的位置对应的位置处接合到基座。 第二导电材料的多个触点分别结合到多个焊盘，只有当集成电路的端子对触点施加压力时，集成电路的端子才电连接到触点，每个触点 具有突出边缘，其具有通过在将导线接合到相应的焊盘之后将第二导电材料的导线与多个焊盘中的相应的一个焊盘相分离而产生的粗糙度。

公开(公告)号：US06555764B1

公开(公告)日：2003-04-29

申请号：US09267928

申请日：1999-03-10

申请人： Shigeyuki Maruyama ,  Makoto Haseyama ,  Futoshi Fukaya ,  Susumu Moriya ,  Naomi Miyaji

发明人： Shigeyuki Maruyama ,  Makoto Haseyama ,  Futoshi Fukaya ,  Susumu Moriya ,  Naomi Miyaji

IPC分类号： H01R1204

CPC分类号： H01L24/11 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/06761 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/4853 ,  H01L24/13 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/1184 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/13173 ,  H01L2224/45144 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/749 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/81345 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15173 ,  H01R4/26 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49162 ,  H01L2224/48 ,  H01L2924/00

摘要： An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at positions corresponding to positions of terminals on an integrated circuit. A plurality of contacts of a second conductive material are bonded to the plurality of pads, respectively, the terminals of the integrated circuit being electrically connected to the contacts only when a pressure is exerted onto the contacts by the terminals of the integrated circuit, each contact having a projecting edge with a roughness produced by pulling a wire of the second conductive material apart from a corresponding one of the plurality of pads after the wire is bonded to the corresponding pad.

摘要翻译： 集成电路接触器包括绝缘材料的基部，该基部可弹性变形。 第一导电材料的多个焊盘在与集成电路上的端子的位置对应的位置处接合到基座。 第二导电材料的多个触点分别结合到多个焊盘，只有当集成电路的端子对触点施加压力时，集成电路的端子才电连接到触点，每个触点 具有突出边缘，其具有通过在将导线接合到相应的焊盘之后将第二导电材料的导线与多个焊盘中的相应的一个焊盘相分离而产生的粗糙度。

公开(公告)号：US06191604B1

公开(公告)日：2001-02-20

申请号：US09238172

申请日：1999-01-28

申请人： Makoto Haseyama ,  Shigeyuki Maruyama ,  Naomi Miyaji ,  Susumu Moriya

发明人： Makoto Haseyama ,  Shigeyuki Maruyama ,  Naomi Miyaji ,  Susumu Moriya

IPC分类号： G01R3102

CPC分类号： G01R31/2886 ,  G01R1/07357

摘要： An integrated circuit testing device includes a flexible base of an insulating material, the base having a first surface and a second surface opposite to each other, an integrated circuit to be tested being bonded to the first surface. A conductive wiring layer is provided on the first or second surface of the base, the wiring layer including a plurality of projecting contacts over the first surface at positions which electrodes of the integrated circuit are connected to. An elastic member is provided beneath the second surface of the base opposite to the first surface, the elastic member having a first level of hardness. A flexible film member is provided between the second surface of the base and the elastic member, the film member having a second level of hardness higher than the first level of hardness of the elastic member.

摘要翻译： 集成电路测试装置包括绝缘材料的柔性基座，该基座具有彼此相对的第一表面和第二表面，待测试的集成电路与第一表面接合。 在基座的第一或第二表面上设置有导电布线层，布线层包括在集成电路的电极连接的位置上的第一表面上的多个突出接点。 弹性构件设置在基座的与第一表面相对的第二表面下方，弹性构件具有第一水平的硬度。 柔性膜构件设置在基座的第二表面和弹性构件之间，膜构件具有比弹性构件的第一硬度高的第二硬度水平。

公开(公告)号：US08411197B2

公开(公告)日：2013-04-02

申请号：US10968111

申请日：2004-10-20

申请人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

发明人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

IPC分类号： H04N5/68 ,  H04N5/225 ,  H01L21/00 ,  H01L23/02

CPC分类号： H01L31/0203 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L31/02325 ,  H01L31/02327 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12043 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image pickup device is disclosed that has little deformation caused by thermal expansion of a transparent resin for sealing an image pickup element. The image pickup device includes an image pickup element having a light receiving surface, a micro-lens for condensing incident light to the image pickup element, a first transparent plate disposed on the light receiving surface of the image pickup element with the micro-lens in between, a transparent resin that seals the image pickup element and the first transparent plate, and a second transparent plate disposed on the transparent resin to face the first transparent plate.

摘要翻译： 公开了一种由用于密封图像拾取元件的透明树脂的热膨胀引起的变形小的图像拾取装置。 图像拾取装置包括具有光接收表面的图像拾取元件，用于将入射光聚焦到图像拾取元件的微透镜，设置在图像拾取元件的光接收表面上的第一透明板，微透镜 密封图像拾取元件的透明树脂和第一透明板，以及设置在透明树脂上以面对第一透明板的第二透明板。

公开(公告)号：US08194162B2

公开(公告)日：2012-06-05

申请号：US12720949

申请日：2010-03-10

申请人： Susumu Moriya ,  Izumi Kobayashi ,  Takao Ohno

发明人： Susumu Moriya ,  Izumi Kobayashi ,  Takao Ohno

IPC分类号： H04N3/14 ,  H04N5/335

CPC分类号： H04N5/2253 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2924/00014 ,  H04N5/2257 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An imaging device includes an image sensing device provided on a semiconductor substrate; a transparent member provided on a light-receiving area of the image sensing device; and a circuit element provided on the transparent member, wherein the image sensing device and the circuit element are electrically coupled to each other.

摘要翻译： 一种成像装置包括设置在半导体衬底上的图像感测装置; 透明构件，设置在所述图像感测装置的光接收区域上; 以及设置在所述透明构件上的电路元件，其中所述图像感测装置和所述电路元件彼此电耦合。

公开(公告)号：US07955044B2

公开(公告)日：2011-06-07

申请号：US11900650

申请日：2007-09-12

申请人： Susumu Moriya ,  Yoshiteru Ikehata

发明人： Susumu Moriya ,  Yoshiteru Ikehata

IPC分类号： B65H1/00

CPC分类号： B65G1/02 ,  B65G1/0435 ,  H01L21/67017 ,  H01L21/6734 ,  H01L21/67363 ,  H01L21/67393 ,  H01L21/67769

摘要： A method for processing substrates for a substrate processing facility includes the steps of: performing ventilation of a container with a fan filter unit while a lid of the container is in a closed state, when the container is stored in a storage shelf, and when the container is transferred with a substrate transfer device, and ventilating the container with the fan filter with the lid of the container in an open state, when substrates are transferred in a substrate loading/unloading section with the substrate transfer device.

摘要翻译： 一种用于处理基板处理设备的基板的方法包括以下步骤：当容器的盖子处于关闭状态时，当容器存储在存放架中时，执行具有风扇过滤器单元的容器的通风，并且当 容器用基板输送装置转印，并且当基板在基板装载/卸载部分中被转移到基板传送装置时，通过容器的盖子将风扇过滤器的容器换向打开状态。

公开(公告)号：US07638367B2

公开(公告)日：2009-12-29

申请号：US11483593

申请日：2006-07-11

申请人： Yoshito Akutagawa ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

发明人： Yoshito Akutagawa ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/92247

摘要： A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

摘要翻译： 一种树脂密封电子部件的方法，包括以下步骤：提供一个板，其中一个或多个电子部件安装在上模具中; 熔化容纳在形成下模的一部分的腔中的树脂材料; 并将由上模保持的电子部件浸入熔融树脂中，从而实现树脂密封。 在将树脂材料加压并分散在密封树脂供给装置中之后，树脂材料被容纳在形成下模具的腔的部分中。

公开(公告)号：US07329299B2

公开(公告)日：2008-02-12

申请号：US10885210

申请日：2004-07-06

申请人： Susumu Moriya ,  Shigeto Murayama ,  Yuichi Morimoto ,  Yoshiteru Ikehata ,  Takayoshi Ono

发明人： Susumu Moriya ,  Shigeto Murayama ,  Yuichi Morimoto ,  Yoshiteru Ikehata ,  Takayoshi Ono

IPC分类号： B65G49/07

CPC分类号： B65G51/03 ,  B65G37/005 ,  B65G49/063 ,  B65G49/065 ,  B65G2249/02 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/139

摘要： It is an object of the present invention to provide a plate-shaped work piece transporting apparatus that has a fan, a dust-removal filter disposed above this fan, and a plate-shape porous member disposed above the dust-removal filter. By forming a chamber in which air can accumulate between the porous member and the dust-removal filter, it is possible to suppress air pulsations. Further, by providing support members on the porous member, the plate-shaped work piece can be supported and damage thereto can be avoided when the plate-shaped work piece, which is supported by air from the fan, drops to below a set height.

摘要翻译： 本发明的目的是提供一种板状工件输送装置，其具有设置在风扇上方的风扇，除尘过滤器和设置在除尘过滤器上方的板状多孔体。 通过形成空气可以在多孔构件和除尘过滤器之间积聚的室，可以抑制空气脉动。 此外，通过在多孔构件上设置支撑构件，当由来自风扇的空气支撑的板状工件下降到设定高度以下时，可以支撑板状工件并且可以避免板损坏。

公开(公告)号：US20060023108A1

公开(公告)日：2006-02-02

申请号：US10994634

申请日：2004-11-23

申请人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

发明人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

IPC分类号： G02B13/16

CPC分类号： H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light receiving element, and resin provided to at least the periphery of the plate-like transparent member. The plate-like transparent member includes a first principal plane positioned on the light receiving element side and a second principal plane opposite the first principal plane. The first principal plane is greater in area than the second principal plane.