摘要:
A superconducting article includes a substrate having an untextured metal surface; an untextured barrier layer of La2Zr2O7 or Gd2Zr2O7 supported by and in contact with the surface of the substrate; a biaxially textured buffer layer supported by the untextured barrier layer; and a biaxially textured superconducting layer supported by the biaxially textured buffer layer. Moreover, a method of forming a buffer layer on a metal substrate includes the steps of: providing a substrate having an untextured metal surface; coating the surface of the substrate with a barrier layer precursor; converting the precursor to an untextured barrier layer; and depositing a biaxially textured buffer layer above and supported by the untextured barrier layer.
摘要翻译:超导制品包括具有未结合的金属表面的基材; 不饱和的La 2 O 2 2 N 2 O 3或Gd 2 Zr 2 N的不均匀的阻挡层 由底物表面支撑并与衬底的表面相接触; 由所述非纹理化阻挡层支撑的双轴纹理缓冲层; 以及由双轴纹理缓冲层支撑的双轴织构化超导层。 此外,在金属基板上形成缓冲层的方法包括以下步骤:提供具有非纹理金属表面的基板; 用阻挡层前体涂覆基材的表面; 将前体转化为无纹理的阻挡层; 并且在非纹理化阻挡层上方并且支撑着双轴织构化的缓冲层。
摘要:
A superconducting article includes a biaxially-textured Ni substrate, and epitaxial buffer layers of Pd (optional), CeO.sub.2 and YSZ, and a top layer of in-plane aligned, c-axis oriented YBCO having a critical current density (J.sub.c) in the range of at least 100,000 A/cm.sup.2 at 77 K.
摘要:
Buffer layer architectures are epitaxially deposited on biaxially-textured rolled-Ni and/or Cu substrates for high current conductors, and more particularly buffer layer architectures such as MgO/Ag/Pt/Ni, MgO/Ag/Pd/Ni, MgO/Ag/Ni, MgO/Ag/Pd/Cu, MgO/Ag/Pt/Cu, and MgO/Ag/Cu. Techniques used to deposit these buffer layers include electron beam evaporation, thermal evaporation, rf magnetron sputtering, pulsed laser deposition, metal-organic chemical vapor deposition (MOCVD), combustion CVD, and spray pyrolysis.
摘要翻译:缓冲层结构外延沉积在用于高电流导体的双轴纹理轧制的Ni和/或Cu衬底上,更具体地,缓冲层结构如MgO / Ag / Pt / Ni,MgO / Ag / Pd / Ni,MgO / Ag / Ni,MgO / Ag / Pd / Cu,MgO / Ag / Pt / Cu和MgO / Ag / Cu。 用于沉积这些缓冲层的技术包括电子束蒸发,热蒸发,rf磁控溅射,脉冲激光沉积,金属有机化学气相沉积(MOCVD),燃烧CVD和喷雾热解。
摘要:
A laminate article consists of a substrate and a biaxially textured protective layer over the substrate. The substrate can be biaxially textured and also have reduced magnetism over the magnetism of Ni. The substrate can be selected from the group consisting of nickel, copper, iron, aluminum, silver and alloys containing any of the foregoing. The protective layer can be selected from the group consisting of gold, silver, platinum, palladium, and nickel and alloys containing any of the foregoing. The protective layer is also non-oxidizable under conditions employed to deposit a desired, subsequent oxide buffer layer. Layers of YBCO, CeO2, YSZ, LaAlO3, SrTiO3, Y2O3, RE2O3, SrRuO3, LaNiO3 and La2ZrO3 can be deposited over the protective layer. A method of forming the laminate article is also disclosed.
摘要:
Specific alloys, in particular Ni-based alloys, that can be biaxially textured, with a well-developed, single component texture are disclosed. These alloys have a significantly reduced Curie point, which is very desirable from the point of view of superconductivity applications. The biaxially textured alloy substrates also possess greatly enhanced mechanical properties (yield strength, ultimate tensile strength) which are essential for most applications, in particular, superconductors. A method is disclosed for producing complex multicomponent alloys which have the ideal physical properties for specific applications, such as lattice parameter, degree of magnetism and mechanical strength, and which cannot be fabricated in textured form. In addition, a method for making ultra thin biaxially textured substrates with complex compositions is disclosed.
摘要:
A laminated conductor includes a metallic substrate having a surface, a biaxially textured buffer layer supported by the surface of the metallic substrate, the biaxially textured buffer layer comprising Y2O3 and a dopant for blocking cation diffusion through the Y2O3, and a biaxially textured conductor layer supported by the biaxially textured buffer layer.
摘要翻译:层压导体包括具有表面的金属基底,由金属基底的表面支撑的双轴织构缓冲层,包含Y 2 O 3 3的双轴织构缓冲层和 用于阻止通过Y 2 O 3 3阳离子扩散的掺杂剂和由双轴织构缓冲层支撑的双轴织构化导体层。
摘要:
Buffer layer architectures are epitaxially deposited on biaxially-textured rolled-Ni and/or Cu substrates for high current conductors, and more particularly buffer layer architectures such as MgO/Ag/Pt/Ni, MgO/Ag/Pd/Ni, MgO/Ag/Ni, MgO/Ag/Pd/Cu, MgO/Ag/Pt/Cu, and MgO/Ag/Cu. Techniques used to deposit these buffer layers include electron beam evaporation, thermal evaporation, rf magnetron sputtering, pulsed laser deposition, metal-organic chemical vapor deposition (MOCVD), combustion CVD, and spray pyrolysis.
摘要翻译:缓冲层结构外延沉积在用于高电流导体的双轴纹理轧制的Ni和/或Cu衬底上,更具体地,缓冲层结构如MgO / Ag / Pt / Ni,MgO / Ag / Pd / Ni,MgO / Ag / Ni,MgO / Ag / Pd / Cu,MgO / Ag / Pt / Cu和MgO / Ag / Cu。 用于沉积这些缓冲层的技术包括电子束蒸发,热蒸发,rf磁控溅射,脉冲激光沉积,金属有机化学气相沉积(MOCVD),燃烧CVD和喷雾热解。