Abstract:
A voltage glitch detector includes a ring oscillator, a plurality of counters, a combined result circuit, and a result evaluation circuit. The ring oscillator includes a plurality of series-connected stages. An output of a last stage of the ring oscillator is coupled to an input of a first stage of the ring oscillator. Each counter of the plurality of counters has an input coupled to a node located between two stages of the plurality of series-connected stages. The combined result circuit is coupled to each of the plurality of counters. The combined result circuit combines the count values received from each counter of the plurality of counters to provide a combined result. The result evaluation circuit is coupled to compare the combined result with a reference value to determine when a voltage glitch is detected.
Abstract:
A resonator has a main resonator body and a secondary resonator structure. The resonator body has a desired mode of vibration of the resonator alone, and a parasitic mode of vibration, wherein the parasitic mode comprises vibration of the resonator body and the secondary resonator structure as a composite body. In this way, unwanted vibrational modes are quenched by the second suspended body.
Abstract:
Disclosed is a semiconductor device comprising a group 13 nitride heterojunction comprising a first layer having a first bandgap and a second layer having a second bandgap, wherein the first layer is located between a substrate and the second layer; and a Schottky electrode and a first further electrode each conductively coupled to a different area of the heterojunction, said Schottky electrode comprising a central region and an edge region, wherein the element comprises a conductive barrier portion located underneath said edge region only of the Schottky electrode for locally increasing the Schottky barrier of the Schottky electrode. A method of manufacturing such a semiconductor device is also disclosed.
Abstract:
Disclosed is a semiconductor device comprising a group 13 nitride heterojunction comprising a first layer having a first bandgap and a second layer having a second bandgap, wherein the first layer is located between a substrate and the second layer; and a Schottky electrode and a first further electrode each conductively coupled to a different area of the heterojunction, said Schottky electrode comprising a central region and an edge region, wherein the element comprises a conductive barrier portion located underneath said edge region only of the Schottky electrode for locally increasing the Schottky barrier of the Schottky electrode. A method of manufacturing such a semiconductor device is also disclosed.
Abstract:
Disclosed is a semiconductor device comprising a group 13 nitride heterojunction comprising a first layer having a first bandgap and a second layer having a second bandgap, wherein the first layer is located between a substrate and the second layer; and a Schottky electrode and a first further electrode each conductively coupled to a different area of the heterojunction, said Schottky electrode comprising a central region and an edge region, wherein the element comprises a conductive barrier portion located underneath said edge region only of the Schottky electrode for locally increasing the Schottky barrier of the Schottky electrode. A method of manufacturing such a semiconductor device is also disclosed.
Abstract:
A resonator has a main resonator body and a secondary resonator structure. The resonator body has a desired mode of vibration of the resonator alone, and a parasitic mode of vibration, wherein the parasitic mode comprises vibration of the resonator body and the secondary resonator structure as a composite body. In this way, unwanted vibrational modes are quenched by the second suspended body.
Abstract:
An integrated circuit for hardware security comprises a voltage glitch detection processing system comprising an oscillator circuit that generates and outputs a local oscillator clock which is a function of a supply voltage; a counter clocked by the oscillator circuit to generate at least one count value; and a capture section that synchronizes the at least one count value into a system clock domain for detecting a voltage glitch in the supply voltage.
Abstract:
Embodiments of devices and method for detecting semiconductor substrate thickness are disclosed. In an embodiment, an IC device includes a semiconductor substrate, a charge emitter embedded in the semiconductor substrate and configured to produce an electrical charge in the semiconductor substrate and a charge sensor embedded in the semiconductor substrate and configured to generate a response signal in response to the electrical charge produced in the semiconductor substrate. The magnitude of the response signal depends on the thickness of the semiconductor substrate.
Abstract:
Embodiments of devices and method for detecting semiconductor substrate thickness are disclosed. In an embodiment, an IC device includes a semiconductor substrate, a charge emitter embedded in the semiconductor substrate and configured to produce an electrical charge in the semiconductor substrate and a charge sensor embedded in the semiconductor substrate and configured to generate a response signal in response to the electrical charge produced in the semiconductor substrate. The magnitude of the response signal depends on the thickness of the semiconductor substrate.
Abstract:
An integrated circuit for hardware security comprises a voltage glitch detection processing system comprising an oscillator circuit that generates and outputs a local oscillator clock which is a function of a supply voltage; a counter clocked by the oscillator circuit to generate at least one count value; and a capture section that synchronizes the at least one count value into a system clock domain for detecting a voltage glitch in the supply voltage.