-
公开(公告)号：US12031708B2
公开(公告)日：2024-07-09
申请号：US18376702
申请日：2023-10-04
Inventor： Tomohiro Fukao , Tomoaki Sawada , Kyosuke Michigami , Keiko Kashihara , Chihiro Horii
IPC: F21V3/06 , B29C59/02 , B29L31/00 , B32B5/02 , B32B15/14 , B32B15/20 , B32B27/12 , B32B27/26 , B32B27/38 , F21Y115/10
CPC classification number: F21V3/0625 , B32B5/02 , B32B15/14 , B32B15/20 , B32B27/12 , B32B27/26 , B32B27/38 , B29C59/02 , B29L2031/747 , B32B2255/10 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2307/202 , B32B2307/51 , B32B2307/538 , B32B2307/54 , B32B2457/00 , F21Y2115/10
Abstract: An elastic resin sheet that is a resin sheet formed using a resin composition containing a thermosetting resin and a curing agent, in which when a maximum height of a surface roughness on a first surface of the resin sheet is Rz1 (μm), a maximum height of a surface roughness on a second surface facing the first surface is Rz2 (μm), and a thickness is t (μm), the Rz1, the Rz2, and the thickness t (μm) satisfy relation of the following Formula (1): (Rz1+Rz2)/t≤0.5 (1), the elastic resin sheet includes a light-diffusing portion having irregularities with an arithmetic mean roughness Ra of 0.3 μm or more and 5.0 μm or less on at least one of the first surface and the second surface, and the elastic resin sheet has an initial tensile modulus of 0.5 MPa or more and 500 MPa or less.
-
2.发明公开公开(公告)号：US20240027053A1
公开(公告)日：2024-01-25
申请号：US18376702
申请日：2023-10-04
Inventor： Tomohiro FUKAO , Tomoaki Sawada , Kyosuke Michigami , Keiko Kashihara , Chihiro Horii
CPC classification number: F21V3/0625 , B32B15/14 , B32B15/20 , B32B5/02 , B32B27/12 , B32B27/38 , B32B27/26 , B32B2255/10 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2307/538 , B32B2457/00 , B32B2307/51 , B32B2307/202 , B32B2307/54 , B29C59/02
Abstract: An elastic resin sheet that is a resin sheet formed using a resin composition containing a thermosetting resin and a curing agent, in which when a maximum height of a surface roughness on a first surface of the resin sheet is Rz1 (μm), a maximum height of a surface roughness on a second surface facing the first surface is Rz2 (μm), and a thickness is t (μm), the Rz1, the Rz2, and the thickness t (μm) satisfy relation of the following Formula (1): (Rz1+Rz2)/t≤0.5 (1), the elastic resin sheet includes a light-diffusing portion having irregularities with an arithmetic mean roughness Ra of 0.3 μm or more and 5.0 μm or less on at least one of the first surface and the second surface, and the elastic resin sheet has an initial tensile modulus of 0.5 MPa or more and 500 MPa or less.
-
Patent Agency Ranking
3.发明授权公开(公告)号：US11234329B2
公开(公告)日：2022-01-25
申请号：US16954020
申请日：2018-12-04
Inventor： Rihoko Watanabe , Keiko Kashihara , Hiroharu Inoue
Abstract: A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9≤X2/X1≤1.0 (I), where X1 is a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and X2 is a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate.
-
公开(公告)号：US11407869B2
公开(公告)日：2022-08-09
申请号：US16466979
申请日：2017-12-07
Inventor： Keiko Kashihara , Rihoko Watanabe , Hiroharu Inoue
Abstract: Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.
-
公开(公告)号：US11059260B2
公开(公告)日：2021-07-13
申请号：US16316579
申请日：2017-07-19
Inventor： Keiko Kashihara , Takashi Hoshi , Hiroharu Inoue
IPC: B32B5/02 , B32B15/14 , C08J5/24 , H05K1/03 , B32B15/08 , B32B15/092 , C08L63/00 , C08K3/36 , C08K5/5399 , C08K9/06
Abstract: A prepreg including: a woven cloth substrate; and a semi-cured product of a resin composition. The resin composition contains: at least one of an (A1) component and an (A2) component, a (B) component; a (C1) component; and a (C2) component. The (A1) component is an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (A2) component is a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (B) component is a high molecular weight polymer. The (C1) component is a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by formula (c1). The (C2) component is a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by formula (c2).
-
公开(公告)号：US09894761B2
公开(公告)日：2018-02-13
申请号：US15173697
申请日：2016-06-05
Inventor： Takashi Hoshi , Takeshi Kitamura , Keiko Kashihara , Hiroharu Inoue
CPC classification number: H05K1/0366 , B32B15/14 , B32B2260/046 , C08G59/62 , C08J5/24 , C08J2363/00 , C08J2433/02 , C08J2433/06 , C08J2433/08 , C08L63/00 , H05K1/0271 , H05K1/0373 , H05K2201/0133 , H05K2201/0209 , H05K2201/0224 , H05K2201/029
Abstract: A prepreg includes a resin composition including: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton; (B) a polymer having at least the structures of formulae (2) and (3) among formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and (C) an inorganic filler: wherein x:y:z (molar fraction)=0:0.95:0.05 to 0.2:0.6:0.2 (where x+y+z≦1, 0≦x≦0.2, 0.6≦y≦0.95, 0.05≦z≦0.2); R1 represents a hydrogen atom or a methyl group and R2 includes at least one of a glycidyl group and an epoxidized alkyl group among a hydrogen atom, an alkyl group, a glycidyl group and an epoxidized alkyl group in formula (2); and R3 represents a hydrogen atom or a methyl group and R4 represents Ph (phenyl group), —COOCH2Ph or —COO(CH2)2Ph in formula (3).
-
公开(公告)号：US10371612B2
公开(公告)日：2019-08-06
申请号：US15757002
申请日：2016-09-09
Inventor： Keiko Kashihara , Hiroharu Inoue , Shingo Yoshioka , Takashi Hoshi
IPC: B32B5/28 , C08J5/24 , G01N3/18 , H05K1/02 , H05K1/03 , H05K3/06 , B32B15/08 , B32B37/10 , B32B38/00
Abstract: A prepreg includes a resin layer constituted by a half-cured product of a thermosetting resin composition, and a fibrous substrate provided in the resin layer. A prepreg test piece that is a cured product obtained by heat curing the thermosetting resin composition has a maximum value of 400 kPa or less for thermal shrinkage stress measured by a predetermined thermal stress test.
-
-
-
-
-
-
Search Results
7
records
(took 0.018 seconds)
