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公开(公告)号：US20250079197A1
公开(公告)日：2025-03-06
申请号：US18815987
申请日：2024-08-27
Applicant: SEMES CO., LTD.
Inventor： Pil Kyun HEO , Min Woo KIM , Hyung Seok KANG , Anton KORIAKIN , Joon Hee LEE
Abstract: Disclosed are an apparatus for treating a substrate and a method of treating a substrate using a supercritical fluid. The apparatus includes: a chamber for providing a treatment space for treating a substrate; and a treatment fluid supply unit for supplying a treatment fluid to the treatment space, in which treatment fluid supply unit includes: a tank for storing the treatment fluid; a heating unit for heating the treatment fluid in the tank to convert the treatment fluid from a first state to a second state; an inlet line for introducing the treatment fluid in the first state into the tank; a supply line for supplying the treatment fluid of the second state from the tank to the chamber; a circulation line for circulating the treatment fluid in the tank; a first valve installed in the circulation line; and a temperature drop member installed in the circulation line to lower a temperature of the treatment fluid flowing through the circulation line.
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公开(公告)号：US20210166939A1
公开(公告)日：2021-06-03
申请号：US17100382
申请日：2020-11-20
Applicant: SEMES CO., LTD.
Inventor： Hae-Won CHOI , Anton KORIAKIN
IPC: H01L21/027 , H01L21/67
Abstract: Embodiments of the inventive concept provide a substrate treating apparatus. According to an exemplary embodiment, the substrate treating apparatus comprises a first process chamber applying a process fluid containing an organic solvent to a substrate wet with a developer and introduced; and a second process chamber treating the substrate applied with the process fluid and introduced, through a supercritical fluid.
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Patent Agency Ranking
3.发明申请公开(公告)号：US20190080902A1
公开(公告)日：2019-03-14
申请号：US16129089
申请日：2018-09-12
Applicant: SEMES CO., LTD.
Inventor： Hae-Won CHOI , Ki-Moon KANG , Kihoon CHOI , Anton KORIAKIN , Chan Young HEO , Jaeseong LEE , Kwon Taek LIM , Yong Hun KIM , Sang Ho LEE
IPC: H01L21/02 , B08B3/08 , C09K13/08 , C11D7/36 , C11D7/50 , C11D7/34 , C11D11/00 , H01L21/687 , H01L21/67
Abstract: Disclosed are an anhydrous substrate cleaning composition, a substrate treating method, and a substrate treating apparatus. The anhydrous substrate cleaning composition includes an etching composite that provides fluorine, a solvent that dissolves the etching composite, and a binder that is a composite including phosphorous.
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4.发明申请公开(公告)号：US20180093306A1
公开(公告)日：2018-04-05
申请号：US15721188
申请日：2017-09-29
Applicant: SEMES CO., LTD.
Inventor： Ki-Moon KANG , Anton KORIAKIN , In IL JUNG , Hae-Won CHOI
IPC: B08B7/00 , C11D11/00 , H01L21/311 , H01L21/67
CPC classification number: B08B7/0021 , C07C31/02 , C11D7/5022 , C11D11/0047 , H01L21/31133 , H01L21/67051 , H01L21/6708 , H01L21/67109 , H01L21/6719
Abstract: Disclosed are an anhydrous substrate cleaning composition, a substrate treating method, and a substrate treating apparatus. The substrate cleaning composite includes an etching compound that provides a component for treating a substrate, and a solvent that dissolves the etching compound, wherein the substrate cleaning composite is an anhydrous composite that does not include water.
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公开(公告)号：US20220415643A1
公开(公告)日：2022-12-29
申请号：US17660449
申请日：2022-04-25
Applicant: Semes Co., Ltd. , Samsung Electronics Co., Ltd.
Inventor： Hae-Won CHOI , Anton KORIAKIN , Sangjine Park PARK , Keonyoung KIM , Sukhoon KIM , Seohyun KIM , Young-Hoo KIM , Kuntack LEE , Jihoon JEONG
Abstract: In a substrate processing method, a rinse process using a rinse solution is performed on a development-processed photoresist pattern on a substrate. A substitution process including a first substitution step using a mixed solution of a non-polar organic solvent and a surfactant and a second substitution step using the non-polar organic solvent is performed on the substrate. The substitution process is performed a plurality of times until the rinse solution remaining on the substrate is less than a predetermined value. A supercritical fluid drying process is performed on the substrate to dry the non-polar organic solvent remaining on the substrate.
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公开(公告)号：US20220290921A1
公开(公告)日：2022-09-15
申请号：US17692395
申请日：2022-03-11
Applicant: SEMES CO., LTD.
Inventor： Hae-Won CHOI , Anton KORIAKIN , Joon Ho WON , Min Woo KIM , Ki Hoon CHOI , Eung Su KIM , Tae Hee KIM , Pil Kyun HEO , Jang Jin LEE , Jin Yeong SUNG
IPC: F26B5/00
Abstract: The inventive concept provides a method for treating a substrate. The method for treating a substrate comprises: a pressurization step for increasing a pressure of an inner space of a chamber by supplying a treating fluid to the inner space, after taking the substrate into the inner space; a flow step for generating a flow of the treating fluid by combination of supplying and discharging the treating fluid to and from the inner space; and a depressurization step of decreasing the pressure of the inner space by discharging the treating fluid from the inner space, and wherein the pressurization step comprises: a bottom side supply process for increasing the pressure of the inner space by supplying the treating fluid to a backside of the substrate taken into the inner space;
and a top side supply process of increasing the pressure of the inner space by supplying the treating fluid to a top side of the substrate taken into the inner space.-
公开(公告)号：US20210072644A1
公开(公告)日：2021-03-11
申请号：US17017786
申请日：2020-09-11
Inventor： Hae-Won CHOI , Yerim YEON , Anton KORIAKIN , Kihoon CHOI , Youngran KO , Jeong Ho CHO , Hyungseok KANG , Hong Gi MIN
Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a first process chamber to apply an organic solvent to a substrate applied with a developer and introduced, and a second process chamber to treat the substrate applied with the organic solvent and introduced, through a supercritical fluid.
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