METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20220037153A1

    公开(公告)日:2022-02-03

    申请号:US17500149

    申请日:2021-10-13

    Abstract: A highly reliable semiconductor device which includes a thin film transistor having stable electric characteristics, and a manufacturing method thereof. In the manufacturing method of the semiconductor device which includes a thin film transistor where a semiconductor layer including a channel formation region is an oxide semiconductor layer, heat treatment which reduces impurities such as moisture to improve the purity of the oxide semiconductor layer and oxidize the oxide semiconductor layer (heat treatment for dehydration or dehydrogenation) is performed. Not only impurities such as moisture in the oxide semiconductor layer but also those existing in a gate insulating layer are reduced, and impurities such as moisture existing in interfaces between the oxide semiconductor layer and films provided over and under and in contact with the oxide semiconductor layer are reduced.

    SEMICONDUCTOR DEVICE
    4.
    发明申请

    公开(公告)号:US20170278976A1

    公开(公告)日:2017-09-28

    申请号:US15619670

    申请日:2017-06-12

    CPC classification number: H01L29/7869 H01L29/41733

    Abstract: A semiconductor device including the following components and a manufacturing method of the semiconductor device are provided. The semiconductor device includes a substrate; an oxide semiconductor layer over the substrate; a source electrode and a drain electrode whose end portion has a taper angle and whose upper end portion has a curved surface, the source electrode and the drain electrode being electrically connected to the oxide semiconductor layer; a gate insulating layer being in contact with a part of the oxide semiconductor layer and covering the oxide semiconductor layer, the source electrode, and the drain electrode; and a gate electrode overlapping with the oxide semiconductor layer and being over the gate insulating layer.

    POWER STORAGE DEVICE AND ELECTRONIC DEVICE
    6.
    发明申请
    POWER STORAGE DEVICE AND ELECTRONIC DEVICE 审中-公开
    电力存储设备和电子设备

    公开(公告)号:US20160372717A1

    公开(公告)日:2016-12-22

    申请号:US15176350

    申请日:2016-06-08

    Inventor: Kosei NODA

    Abstract: A power storage device with high capacity per unit volume, a flexible power storage device with a novel structure, a repeatedly bendable power storage device, a highly reliable power storage device, or a long-life power storage device is provided. The power storage device includes an inner structure and an exterior body surrounding the inner structure. The inner structure includes a positive electrode and a negative electrode. The exterior body includes a first film containing titanium and one or more elements selected from niobium, tantalum, vanadium, zirconium, and hafnium. It is preferable that the first film further contain one or more elements selected from molybdenum, chromium, and aluminum.

    Abstract translation: 提供具有高容量的单位体积的蓄电装置,具有新颖结构的柔性蓄电装置,可重复弯曲的蓄电装置,高可靠性蓄电装置或长寿命蓄电装置。 蓄电装置包括内部结构和围绕内部结构的外部主体。 内部结构包括正极和负极。 外壳包括含有钛和选自铌,钽,钒,锆和铪中的一种或多种元素的第一膜。 优选第一膜还含有一种或多种选自钼,铬和铝的元素。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20160064505A1

    公开(公告)日:2016-03-03

    申请号:US14935553

    申请日:2015-11-09

    Abstract: To manufacture a transistor whose threshold voltage is controlled without using a backgate electrode, a circuit for controlling the threshold voltage, and an impurity introduction method. To manufacture a semiconductor device having favorable electrical characteristics, high reliability, and low power consumption using the transistor. A gate electrode including a tungsten oxide film whose composition is controlled is used. The composition or the like is adjusted by a film formation method of the tungsten oxide film, whereby the work function can be controlled. By using the tungsten oxide film whose work function is controlled as part of the gate electrode, the threshold of the transistor can be controlled. Using the transistor whose threshold voltage is controlled, a semiconductor device having favorable electrical characteristics, high reliability, and low power consumption can be manufactured.

    Abstract translation: 制造在不使用背栅电极的情况下控制阈值电压的晶体管,用于控制阈值电压的电路和杂质导入方法。 使用晶体管制造具有良好的电特性,高可靠性和低功耗的半导体器件。 使用包含其组成被控制的氧化钨膜的栅电极。 通过氧化钨膜的成膜方法调整组合物等,由此可以控制功函数。 通过使用功函数被控制为栅电极的一部分的氧化钨膜,可以控制晶体管的阈值。 通过使用阈值电压被控制的晶体管,可以制造具有良好的电特性,高可靠性和低功耗的半导体器件。

    SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
    9.
    发明申请
    SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE 有权
    半导体器件,制造半导体器件的方法和电子器件

    公开(公告)号:US20150349130A1

    公开(公告)日:2015-12-03

    申请号:US14723624

    申请日:2015-05-28

    Abstract: Threshold voltage adjustment method of a semiconductor device is provided. In a semiconductor device in which at least one of transistors included in an inverter includes a semiconductor, a source electrode or a drain electrode electrically connected to the semiconductor, a gate electrode, and a charge trap layer provided between the gate electrode and the semiconductor, the potential of the gate electrode of the transistor that is higher than those of the source electrode and the drain electrode is held for a short time of 5 s or shorter, whereby electrons are trapped in the charge trap layer and the threshold voltage is increased. At this time, when the potential differences between the gate electrode and the source electrode, and the gate electrode and the drain electrode are different from each other, the threshold voltage of the transistor of the semiconductor device becomes appropriate.

    Abstract translation: 提供半导体器件的阈值电压调整方法。 在其中包括在反相器中的至少一个晶体管包括半导体,与半导体电连接的源电极或漏电极,设置在栅电极和半导体之间的栅电极和电荷陷阱层的半导体器件中, 晶体管的栅电极的电位比源电极和漏电极的电位保持5秒以下的短时间,由此电子被捕获在电荷陷阱层中,并且阈值电压增加。 此时,当栅电极和源电极以及栅电极和漏电极之间的电位差彼此不同时,半导体器件的晶体管的阈值电压变得适当。

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