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1.发明公开公开(公告)号：US20230280227A1
公开(公告)日：2023-09-07
申请号：US18171184
申请日：2023-02-17
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Enri DUQI , Filippo DANIELE , Lorenzo BALDO , Giulio CAPELLI , Salvatore ALONGI
CPC classification number: G01L19/04 , G01L9/0041 , G01L19/0092
Abstract: A pressure sensor device is provided with: a pressure detection structure made in a first die of semiconductor material; a package, configured to internally accommodate the pressure detection structure in an impermeable manner, the package having a base structure and a body structure, arranged on the base structure, with an access opening in contact with an external environment and internally defining a housing cavity, in which the first die is arranged covered with a coating material. The pressure sensor device is also provided with a heating structure, accommodated in the housing cavity and for allowing heating of the pressure detection structure from the inside of the package.
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公开(公告)号：US20210147222A1
公开(公告)日：2021-05-20
申请号：US17161367
申请日：2021-01-28
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Lorenzo BALDO , Domenico GIUSTI
Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.
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公开(公告)号：US20170247249A1
公开(公告)日：2017-08-31
申请号：US15276613
申请日：2016-09-26
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Sebastiano CONTI , Lorenzo BALDO , Flavio Francesco VILLA
CPC classification number: B81B7/0038 , B81B3/0086 , B81B7/0019 , B81B7/0061 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81C1/00269
Abstract: A micro-electro-mechanical pressure sensor device, formed by a cap region and by a sensor region of semiconductor material. An air gap extends between the sensor region and the cap region; a buried cavity extends underneath the air gap, in the sensor region, and delimits a membrane at the bottom. A through trench extends within the sensor region and laterally delimits a sensitive portion housing the membrane, a supporting portion, and a spring portion, the spring portion connecting the sensitive portion to the supporting portion. A channel extends within the spring portion and connects the buried cavity to a face of the second region. The first air gap is fluidically connected to the outside of the device, and the buried cavity is isolated from the outside via a sealing region arranged between the sensor region and the cap region.
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4.发明公开公开(公告)号：US20230356999A1
公开(公告)日：2023-11-09
申请号：US18308562
申请日：2023-04-27
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Filippo DANIELE , Lorenzo BALDO , Davide MAERNA , Enri DUQI
IPC: B81B7/00
CPC classification number: B81B7/0048 , B81B7/008
Abstract: A microelectromechanical device includes a support structure, a microelectromechanical system die, incorporating a microstructure and a connection structure between the microelectromechanical system die and the support structure. The connection structure includes a spacer structure, joined to the support structure, and a film applied to one face of the spacer structure opposite to the support structure. The spacer structure laterally delimits at least in part a cavity and the film extends on the cavity, at a distance from the support structure. The microelectromechanical system die is joined to the film on the cavity.
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公开(公告)号：US20220185661A1
公开(公告)日：2022-06-16
申请号：US17684317
申请日：2022-03-01
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Marco DEL SARTO , Lorenzo BALDO
Abstract: A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus.
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Patent Agency Ranking
公开(公告)号：US20190242772A1
公开(公告)日：2019-08-08
申请号：US16260723
申请日：2019-01-29
Applicant: STMicroelectronics S.r.l.
Inventor： Enri DUQI , Lorenzo BALDO
CPC classification number: G01L19/141 , B81B7/0051 , B81B7/007 , B81C1/00182 , G01L9/0052 , G01L9/0054 , G01L19/0007 , G01L19/0084 , G01L19/12 , G01L19/145
Abstract: A MEMS pressure sensor includes a monolithic body of semiconductor material having a first face and a second face and housing a first buried cavity and a second buried cavity, arranged under the first buried cavity and projecting laterally therefrom. A first sensitive region is formed between the first buried cavity and the first face at a first depth, and a second sensitive region is formed between the second buried cavity and the first face at a second depth greater than the first depth. The monolithic body also houses a first piezoresistive sensing element and a second piezoresistive sensing element, integrated in the first and second sensitive regions, respectively.
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7.发明申请公开(公告)号：US20190210868A1
公开(公告)日：2019-07-11
申请号：US15866380
申请日：2018-01-09
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Lorenzo BALDO , Marco DEL SARTO , Mikel AZPEITIA URQUIA
Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.
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8.发明申请公开(公告)号：US20180299337A1
公开(公告)日：2018-10-18
申请号：US15958461
申请日：2018-04-20
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Lorenzo BALDO , Sarah ZERBINI , Enri DUQI
CPC classification number: G01L9/0052 , B81B3/0021 , B81B7/0006 , B81B2201/0264 , B81C1/00158 , B81C1/00182 , B81C2201/0116 , G01L9/0072
Abstract: A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate made of polysilicon, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.
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公开(公告)号：US20180282152A1
公开(公告)日：2018-10-04
申请号：US15870429
申请日：2018-01-12
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Lorenzo BALDO , Roberto CARMINATI
IPC: B81C1/00
CPC classification number: B81C1/00222 , B81B3/0021 , B81B7/02 , B81B2201/0242 , B81B2201/0264 , B81B2207/097 , B81C1/00261 , B81C1/00349 , B81C2201/01
Abstract: MEMS device, in which a body made of semiconductor material contains a chamber, and a first column inside the chamber. A cap of semiconductor material is attached to the body and forms a first membrane, a first cavity and a first channel. The chamber is closed on the side of the cap. The first membrane, the first cavity, the first channel and the first column form a capacitive pressure sensor structure. The first membrane is arranged between the first cavity and the second face, the first channel extends between the first cavity and the first face or between the first cavity and the second face and the first column extends towards the first membrane and forms, along with the first membrane, plates of a first capacitor element.
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公开(公告)号：US20220169498A1
公开(公告)日：2022-06-02
申请号：US17534286
申请日：2021-11-23
Inventor： Enri DUQI , Lorenzo BALDO , Paolo FERRARI , Benedetto Vigna , Flavio Francesco VILLA , Laura Maria CASTOLDI , Ilaria GELMI
IPC: B81B7/00
Abstract: A semiconductor device includes: a substrate; a transduction microstructure integrated in the substrate; a cap joined to the substrate and having a first face adjacent to the substrate and a second, outer, face; and a channel extending through the cap from the second face to the first face and communicating with the transduction microstructure. A protective membrane made of porous polycrystalline silicon permeable to aeriform substances is set across the channel.
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