公开(公告)号：US11811185B2

公开(公告)日：2023-11-07

申请号：US17367802

申请日：2021-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-chul Kwon ,  Dong-woo Kang ,  Man-hee Han

IPC: H01S3/00 ,  G02B27/28 ,  G02B5/30 ,  G02B27/09

CPC classification number: H01S3/0085 ,  G02B5/3083 ,  G02B27/0927 ,  G02B27/286

Abstract: A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.

公开(公告)号：US20200381267A1

公开(公告)日：2020-12-03

申请号：US16999481

申请日：2020-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-in Won ,  Jong-kak Jang ,  Dong-woo Kang ,  Do-yeon Kim

IPC: H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10

Abstract: A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.

公开(公告)号：US20190139771A1

公开(公告)日：2019-05-09

申请号：US16037652

申请日：2018-07-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong-woo Kang ,  Ji-ho Yoo ,  Dong-hoon Khang ,  Seon-bae Kim ,  Moon-han Park

IPC: H01L21/266 ,  H01L21/8234 ,  H01L21/265 ,  H01L21/762 ,  H01L21/8238 ,  H01L27/11

Abstract: To manufacture an integrated circuit device, a diffusion buffer layer and a carbon-containing layer are sequentially formed on a plurality of fin-type active regions formed in a substrate. A carbon-containing mask pattern is formed to have an opening exposing a portion of the diffusion buffer layer by etching the carbon-containing layer using an etching gas including an oxygen atom while the diffusion buffer layer is blocking oxygen from diffusing into the fin-type active regions. Impurity ions are implanted into some fin-type active regions through the opening and the diffusion buffer layer using the carbon-containing mask pattern as an ion-implantation mask, the some fin-type active regions being selected from among the plurality of fin-type active regions.

公开(公告)号：US11075496B2

公开(公告)日：2021-07-27

申请号：US16354686

申请日：2019-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-chul Kwon ,  Dong-woo Kang ,  Man-hee Han

IPC: H01S3/00 ,  G02B27/09 ,  G02B5/30 ,  G02B27/28

Abstract: A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.

公开(公告)号：US20190088505A1

公开(公告)日：2019-03-21

申请号：US16135114

申请日：2018-09-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-in Won ,  Jong-kak Jang ,  Dong-woo Kang ,  Do-yeon Kim

IPC: H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498

Abstract: A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.

公开(公告)号：US20160086828A1

公开(公告)日：2016-03-24

申请号：US14691917

申请日：2015-04-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yi-sung Hwang ,  Jun-young Ko ,  Dong-woo Kang ,  Se-yeoul Park

IPC: H01L21/673

CPC classification number: H01L21/6732

Abstract: A magazine includes a main body unit having a front side and a rear side, at least one of which is open, a plurality of slots formed inside two sidewalls of the main body unit, and at least one support member extending to the two sidewalls of the main body unit in a first direction.

Abstract translation: 弹匣包括具有前侧和后侧的主体单元，其中至少一个是敞开的，形成在主体单元的两个侧壁内的多个槽，以及至少一个支撑构件，其延伸到主体单元的两个侧壁 主体单元在第一方向上。

公开(公告)号：US11929262B2

公开(公告)日：2024-03-12

申请号：US18132650

申请日：2023-04-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-in Won ,  Jong-kak Jang ,  Dong-woo Kang ,  Do-yeon Kim

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L21/563 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/45 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45678 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/1533 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/45144 ,  H01L2924/01004 ,  H01L2224/45144 ,  H01L2924/01046 ,  H01L2224/45144 ,  H01L2924/01022 ,  H01L2224/45144 ,  H01L2924/01077 ,  H01L2224/45144 ,  H01L2924/01074 ,  H01L2224/45144 ,  H01L2924/01078 ,  H01L2224/45144 ,  H01L2924/01039 ,  H01L2224/45144 ,  H01L2924/01058 ,  H01L2224/45144 ,  H01L2924/0102 ,  H01L2224/45144 ,  H01L2924/01057 ,  H01L2224/45144 ,  H01L2924/01024 ,  H01L2224/45144 ,  H01L2924/01025 ,  H01L2224/45144 ,  H01L2924/01027 ,  H01L2224/45139 ,  H01L2924/01004 ,  H01L2224/45139 ,  H01L2924/01046 ,  H01L2224/45139 ,  H01L2924/01022 ,  H01L2224/45139 ,  H01L2924/01077 ,  H01L2224/45139 ,  H01L2924/01074 ,  H01L2224/45139 ,  H01L2924/01078 ,  H01L2224/45139 ,  H01L2924/01039 ,  H01L2224/45139 ,  H01L2924/01058 ,  H01L2224/45139 ,  H01L2924/0102 ,  H01L2224/45139 ,  H01L2924/01057 ,  H01L2224/45139 ,  H01L2924/01024 ,  H01L2224/45139 ,  H01L2924/01025 ,  H01L2224/45139 ,  H01L2924/01027 ,  H01L2224/45147 ,  H01L2924/01004 ,  H01L2224/45147 ,  H01L2924/01046 ,  H01L2224/45147 ,  H01L2924/01022 ,  H01L2224/45147 ,  H01L2924/01077 ,  H01L2224/45147 ,  H01L2924/01074 ,  H01L2224/45147 ,  H01L2924/01078 ,  H01L2224/45147 ,  H01L2924/01039 ,  H01L2224/45147 ,  H01L2924/01058 ,  H01L2224/45147 ,  H01L2924/0102 ,  H01L2224/45147 ,  H01L2924/01057 ,  H01L2224/45147 ,  H01L2924/01024 ,  H01L2224/45147 ,  H01L2924/01025 ,  H01L2224/45147 ,  H01L2924/01027

Abstract: A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.

公开(公告)号：US10770311B2

公开(公告)日：2020-09-08

申请号：US16135114

申请日：2018-09-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-in Won ,  Jong-kak Jang ,  Dong-woo Kang ,  Do-yeon Kim

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10

Abstract: A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.

公开(公告)号：US20200006909A1

公开(公告)日：2020-01-02

申请号：US16354686

申请日：2019-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-chul Kwon ,  Dong-woo Kang ,  Man-hee Han

IPC: H01S3/00 ,  G02B27/09 ,  G02B5/30 ,  G02B27/28

Abstract: A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.

公开(公告)号：US20230245902A1

公开(公告)日：2023-08-03

申请号：US18132650

申请日：2023-04-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-in Won ,  Jong-kak Jang ,  Dong-woo Kang ,  Do-yeon Kim

IPC: H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L21/563 ,  H01L25/0657 ,  H01L25/50 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/45 ,  H01L25/105 ,  H01L2225/06517 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L23/49811 ,  H01L2224/131 ,  H01L2924/1436 ,  H01L2224/16227 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L25/0655 ,  H01L2224/45671 ,  H01L2924/1533 ,  H01L2224/45664 ,  H01L2224/13111 ,  H01L2224/48091 ,  H01L2224/4568 ,  H01L2224/45139 ,  H01L2224/45678 ,  H01L2224/32225 ,  H01L2224/92125 ,  H01L24/13 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2924/15321 ,  H01L24/73 ,  H01L2924/1438 ,  H01L2224/73204 ,  H01L24/32 ,  H01L2224/45147 ,  H01L2224/45684 ,  H01L2924/1434 ,  H01L2924/1432 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L24/48 ,  H01L24/92 ,  H01L2224/45144 ,  H01L2225/1058

Abstract: A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.