MEMORY DEVICE
    3.
    发明公开
    MEMORY DEVICE 审中-公开

    公开(公告)号:US20230214124A1

    公开(公告)日:2023-07-06

    申请号:US17934691

    申请日:2022-09-23

    IPC分类号: G06F3/06

    摘要: A memory device includes a memory bank including a plurality of banks that comprise memory cells, and a PIM (processing in memory) circuit including a plurality of PIM blocks, each of the PIM blocks including an arithmetic logic unit (ALU) configured to perform an arithmetic operation using internal data acquired from at least one of the plurality of banks or an address generating unit. The plurality of PIM blocks include a first PIM block allocated to at least one first bank and a second PIM block allocated to at least one second bank. The address generating unit of the first PIM block is configured to generate a first internal row address for the at least one first bank, and the address generating unit of the second PIM block is configured to generate a second internal row address for the at least one second bank.

    BACKWARD COMPATIBLE PROCESSING-IN-MEMORY (PIM) PROTOCOL

    公开(公告)号:US20230128183A1

    公开(公告)日:2023-04-27

    申请号:US17938789

    申请日:2022-10-07

    IPC分类号: G06F3/06

    摘要: A memory device supporting a processing-in-memory (PIM) protocol includes a mode register set (MRS) configured to store a first parameter code and a second parameter code regarding the PIM protocol in a first register and a second register, respectively. The first parameter code includes a PIM protocol change code indicating whether a PIM protocol change related to an old version PIM protocol is supported, and the second parameter code includes a PIM protocol code for setting a current operation PIM protocol from among a plurality of PIM protocols. The memory device further includes a PIM circuit configured to perform an internal processing operation based on the current operation PIM protocol.

    Memory device including processing circuit, and electronic device including system on chip and memory device

    公开(公告)号:US11301399B2

    公开(公告)日:2022-04-12

    申请号:US16934497

    申请日:2020-07-21

    摘要: A memory device includes a buffer die configured to receive a first broadcast command and a second broadcast command from an external device; and a plurality of core dies stacked on the buffer die. The plurality of core dies include: a first core die including a first processing circuit, a first memory cell array, a first command decoder configured to decode the first broadcast command, and a first data input/output circuit configured to output data of the first memory cell array to a common data input/output bus under control of the first command decoder; and a second core die including a second processing circuit, a second memory cell array, a second command decoder configured to decode the second broadcast command, and a second data input/output circuit configured to receive the data of the first memory cell array through the common data input/output bus under control of the second command decoder.

    MEMORY CONTROLLERS AND MEMORY SYSTEMS
    7.
    发明公开

    公开(公告)号:US20240281323A1

    公开(公告)日:2024-08-22

    申请号:US18469894

    申请日:2023-09-19

    IPC分类号: G06F11/10

    CPC分类号: G06F11/1044

    摘要: A memory controller including a processor and configured to control a memory module including a plurality of data chips and at least one parity chip includes an error correction code (ECC) engine, the ECC engine including an ECC decoder to correct Q symbols errors in a codeword set read from the memory module, Q is a maximum natural number equal to or less than P and P is a natural number equal to or greater than four. The ECC decoder is configured to generate a syndrome including first through P-th syndrome symbols based on the read codeword set by using a parity check matrix and to perform a first ECC decoding to correct a single symbol error in the read codeword set based on the first syndrome symbol and a selected syndrome symbol corresponding to one of the second through P-th syndrome symbols.