公开(公告)号：US20240248418A1

公开(公告)日：2024-07-25

申请号：US18434948

申请日：2024-02-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seok HEO ,  Cha Won KOH ,  Sang Joon HONG ,  Hyun Woo KIM ,  Kyung-Won KANG ,  Dong-Wook KIM ,  Kyung Won SEO ,  Young Il JANG ,  Yong Suk CHOI

IPC: G03F7/00 ,  G03F7/16 ,  H01L21/677 ,  H01L21/687

CPC classification number: G03F7/70875 ,  G03F7/168 ,  G03F7/70033 ,  H01L21/67703 ,  H01L21/68707

Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.

公开(公告)号：US20250021025A1

公开(公告)日：2025-01-16

申请号：US18659932

申请日：2024-05-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho HWANG ,  Sanghyun LIM ,  Youngkyun IM ,  Jaehong LIM ,  Chulmin CHO ,  Seok HEO

IPC: G03F7/00 ,  G03F7/16 ,  G03F7/32

Abstract: A substrate processing method includes: performing a first post-exposure baking process on a photoresist layer that was previously exposed to for extreme ultraviolet (EUV) exposed to EUV; developing the photoresist layer using a first developing solution having a first temperature; performing a second post-exposure baking process on the photoresist layer; developing the photoresist layer using a second developing solution having a second temperature, higher than the first temperature; and forming a photoresist pattern by performing a hard baking process on the photoresist layer.

公开(公告)号：US20230033040A1

公开(公告)日：2023-02-02

申请号：US17678233

申请日：2022-02-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunwoong HWANG ,  Chawon KOH ,  Seok HEO ,  Hyunwoo KIM

IPC: H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus includes a substrate support configured to support and rotate a substrate, at least one first lower cleaning nozzle configured to spray a first cleaning liquid on a lower surface of the substrate, at least one second lower cleaning nozzle configured to spray a second cleaning liquid on the lower surface of the substrate, a bowl assembly disposed around the substrate support, the bowl assembly including a cup body providing an annular shaped accommodating space and inner and outer collection portions sequentially arranged in a radial direction in a lower portion of the cup body, an annular shaped discharge guide plate disposed in the receiving space of the bowl assembly under the substrate and extending outwardly from a circumference of the substrate, and a discharge separation plate provided within the receiving space of the bowl assembly to be movable upward and downward.

公开(公告)号：US20210028034A1

公开(公告)日：2021-01-28

申请号：US16751882

申请日：2020-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho HWANG ,  Sungyong PARK ,  Eunseok SEO ,  Hyeongseok JO ,  Seok HEO

IPC: H01L21/67 ,  G05B19/418 ,  G05D23/19 ,  G05D16/20 ,  H05B1/02

Abstract: A wafer processing apparatus is provided. The apparatus includes: a heating plate through which vacuum ports are formed; a plurality of temperature sensors; a heating device configured to heat the heating plate; first and second power supplies; temperature controllers to generate first and second feedback temperature control signals for controlling power output power supplies based on measurement values generated by the temperature sensors; an electronic pressure regulator configured to provide vacuum pressure for fixing a wafer to the plurality of vacuum ports; and a wafer chucking controller configured to control the electronic pressure regulator, and generate a feedback pressure control signal for controlling the electronic pressure regulator based on the first and second feedback temperature control signals.

公开(公告)号：US20240377760A1

公开(公告)日：2024-11-14

申请号：US18505041

申请日：2023-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunwoong HWANG ,  Yongsuk CHOI ,  Yonghoon HWANG ,  Kyung-Won KANG ,  Dong-Wook KIM ,  Seok HEO

IPC: G03F7/00

Abstract: A photolithography apparatus according to an embodiment includes an exposure portion performing an exposure process, a plurality of track portions each performing a coating process and a developing process, and an interface portion connecting the exposure portion and the plurality of track portions to transfer a substrate on which a photolithography process is performed between the exposure portion and the plurality of track portions.

公开(公告)号：US20230333467A1

公开(公告)日：2023-10-19

申请号：US17964376

申请日：2022-10-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghwan KIM ,  Kyungwon KANG ,  Dongwook KIM ,  Seungjoon SONG ,  Seok HEO ,  Younseon WANG ,  Dasom LEE

IPC: G03F7/00 ,  G03F7/30

CPC classification number: G03F7/0025 ,  G03F7/3021

Abstract: A spin coater may include a spin chuck, a nozzle, a first temperature controller and a second temperature controller. The spin chuck may be configured make contact with a central portion of a lower surface of a substrate and may be configured to rotate the substrate when photoresist is on the substrate. The nozzle may be arranged over a central portion of the spin chuck and configured to provide a central portion of an upper surface of the substrate with photoresist. The first temperature controller may be configured to control a temperature in a first region of the spin chuck. The second temperature controller may be configured to control a temperature in a second region of the spin chuck.

公开(公告)号：US20250031281A1

公开(公告)日：2025-01-23

申请号：US18389721

申请日：2023-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanghyun LIM ,  Youngho HWANG ,  Juno PARK ,  Kyoungwhan OH ,  Youngkyun IM ,  Jaehong LIM ,  Chulmin CHO ,  Seok HEO

IPC: H05B3/26 ,  G03F7/00

Abstract: A substrate supporting member and a substrate processing apparatus including the same are provided. The substrate supporting member includes a plate having at least one heating zone. A heating member is on a first surface of the plate and located in the at least one heating zone. The heating member extends along a circumferential direction of the plate and is configured to heat a substrate supported by the plate. A first electrode is on the first surface of the plate and is connected to an inner side surface of the heating member. A second electrode is on the first surface of the plate and is connected to an outer side surface of the heating member. The heating member has a stair-step configuration such that a thickness of the heating member increases from the second electrode toward the first electrode.

公开(公告)号：US20230170232A1

公开(公告)日：2023-06-01

申请号：US18101709

申请日：2023-01-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Whan OH ,  Kyung-Won KANG ,  Hyeon Jun KANG ,  Ju Bong LEE ,  Sung Hun JANG ,  Seok HEO ,  Hyun Woong HWANG

IPC: H01L21/67 ,  B05B12/12 ,  H01L21/68

CPC classification number: H01L21/67259 ,  B05B12/124 ,  H01L21/681 ,  H01L21/6715 ,  B25J11/0075

Abstract: A manufacturing apparatus for a semiconductor device, the manufacturing apparatus including a spin chuck configured to fix and rotate a wafer; a nozzle configured to spray a chemical toward the wafer; a lateral displacement sensor configured to measure a displacement variation to a lateral surface of the wafer while the spin chuck is rotating; and a controller configured to control a position of the nozzle by using the displacement variation while the spin chuck is rotating.

公开(公告)号：US20190176291A1

公开(公告)日：2019-06-13

申请号：US16022166

申请日：2018-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jieun YANG ,  Dong-il YOON ,  Taemin EARMME ,  Gui Hyun CHO ,  Seok HEO ,  Jong Hwi SEO ,  Yong Won CHOI

IPC: B24B37/34 ,  B24B37/005 ,  H01L21/687

Abstract: Provided is a load cup including a cup having an internal space, a pedestal provided in the internal space, able to be lifted up and down, and loading a wafer onto or unloading a wafer from a polishing head, and a plurality of arrangement parts having a plurality of fastening portions disposed around the pedestal, and moved horizontally in a direction of a center of the pedestal, and arrangement part bodies coupled to the plurality of fastening portions, respectively, and rotated or reciprocated so as to contact a lateral surface of the polishing head, adjusting a center of the wafer to be aligned with a center of the polishing head. A polishing process may then be performed on a layer formed on the wafer.

公开(公告)号：US20150360373A1

公开(公告)日：2015-12-17

申请号：US14661688

申请日：2015-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun-Ho KIM ,  Ki-Hoon NAM ,  Tae-Min EARMME ,  Seok HEO ,  Jae-Chul HWANG

IPC: B25J18/02 ,  B25J9/04

CPC classification number: B25J9/042 ,  B25J9/1065 ,  B25J9/107 ,  H01L21/67742 ,  Y10S901/15 ,  Y10T74/20305

Abstract: A link structure includes a first link, a second link having an end that is connected to an end of the first link, a third link having an end that is connected to the end of the first link, and provided on a portion of the second link, a first rotary shaft partially provided in the first link, a first actuator configured to rotate the first link about the first rotary shaft; a second rotary shaft partially provided in the second link, the second rotary shaft being different from the first rotary shaft, and a second actuator configured to rotate the second link about the second rotary shaft, the first and second actuators being provided in the first link.

Abstract translation: 连杆结构包括第一连杆，具有连接到第一连杆的端部的端部的第二连杆，具有连接到第一连杆的端部的端部的第三连杆，并且设置在第二连杆的一部分上 所述第一旋转轴部分地设置在所述第一连杆中，所述第一致动器被构造成围绕所述第一旋转轴旋转所述第一连杆; 第二旋转轴部分地设置在第二连杆中，第二旋转轴不同于第一旋转轴，第二致动器被构造成使第二连杆围绕第二旋转轴旋转，第一和第二致动器设置在第一连杆 。