公开(公告)号：US20140293561A1

公开(公告)日：2014-10-02

申请号：US14302946

申请日：2014-06-12

Applicant: TDK CORPORATION

Inventor： Hiroyuki UEMATSU ,  Kenichi KAWABATA

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/115 ,  H01L2224/04105 ,  H05K1/185 ,  H05K1/188 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/427 ,  H05K2201/0187 ,  H05K2201/09563 ,  H05K2203/095 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating on the inner wall of the via formation hole.

Abstract translation: 布线基板或电子部件嵌入基板包括：基板，其具有含有多个填料的树脂; 以及通孔，其电连接到提供给基板的至少一个互连件，其中所述通孔包括混合区域，在所述混合区域中，在相对于所述基板的内径向侧的所述填料之间设置有金属。 制造布线板或电子部件嵌入式基板的方法包括制备包括含有多种填料的树脂的基板; 在所述基板中形成通孔形成孔; 在通孔形成孔的至少内壁上进行灰化处理; 并且在通孔形成孔的内壁上进行无电镀。

公开(公告)号：US20200352061A1

公开(公告)日：2020-11-05

申请号：US16932046

申请日：2020-07-17

Applicant: TDK CORPORATION

Inventor： Takashi YAMADA ,  Miyuki YANAGIDA ,  Atsushi SATO ,  Kenichi KAWABATA

IPC: H05K9/00

Abstract: A method of forming a metal magnetic film includes forming the metal magnetic film by a plating process, wherein the metal magnetic film comprises a permalloy and carbon atoms and a content of the carbon atoms is 0.3 to 3.0 at % based on a total amount of the carbon atoms and metal elements.

公开(公告)号：US20180204805A1

公开(公告)日：2018-07-19

申请号：US15919991

申请日：2018-03-13

Applicant: TDK Corporation

Inventor： Kenichi KAWABATA

IPC: H01L23/552 ,  H01F1/147 ,  H01L21/56 ,  H01L25/00 ,  H01L23/29 ,  H01L25/16

CPC classification number: H01L23/552 ,  H01F1/14708 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3121 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00012

Abstract: Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blend ratio of 50 vol. % or more and 85 vol. % or less. The filler includes a first magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni, the first magnetic filler having a first grain size distribution, and a second magnetic filler having a second grain size distribution different from the first grain size distribution.

公开(公告)号：US20160121434A1

公开(公告)日：2016-05-05

申请号：US14923853

申请日：2015-10-27

Applicant: TDK CORPORATION

Inventor： Tsutomu YASUI ,  Kenichi KAWABATA

IPC: B23K35/26 ,  B23K35/02 ,  C22C13/02 ,  C22C19/03 ,  H05K1/11 ,  H05K1/18

CPC classification number: B23K35/262 ,  B22F2998/10 ,  B23K35/0244 ,  C22C1/0433 ,  C22C1/0483 ,  C22C13/02 ,  C22C19/03 ,  H05K1/11 ,  H05K1/181 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2203/0415 ,  B22F1/0003 ,  B22F9/082 ,  B22F2201/01

Abstract: A Pb-free solder includes a first metal including at least Sn and Bi, and a second metal including at least an Ni—Fe alloy. In the first metal, the sum of Sn and Bi is 90 mass % or more, and a ratio of Bi is 5 to 15 mass %. A ratio of the second metal to the sum of mass of the first metal and mass of the second metal is 5 to 30 mass %

Abstract translation: 无铅焊料包括至少包含Sn和Bi的第一金属和至少包含Ni-Fe合金的第二金属。 在第一金属中，Sn和Bi的总和为90质量％以上，Bi的比例为5〜15质量％。 第二金属与第一金属的质量和第二金属的质量之和的比例为5〜30质量％

公开(公告)号：US20130256848A1

公开(公告)日：2013-10-03

申请号：US13852218

申请日：2013-03-28

Applicant: TDK CORPORATION

Inventor： Kenichi KAWABATA ,  Seiko KOMATSU

IPC: H01L23/60

CPC classification number: H01L23/60 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electromagnetic component module includes: a molding resin provided so as to cover electronic components mounted on a substrate and a surface of the substrate; and a conductive shield formed so as to further cover the molding resin. The conductive shield includes a first filler and a second filler which are different from each other and the conductive shield is connected to ground wires exposed on lateral surfaces of the substrate. The average particle diameter of the first filler is ½ or less of the thickness of the ground wires and the second filler forms a metallic bond in the temperature range of 250 degrees Celsius or lower.

Abstract translation: 电磁部件模块包括：模塑树脂，其设置成覆盖安装在基板上的电子部件和基板的表面; 以及形成为进一步覆盖模制树脂的导电屏蔽。 导电屏蔽包括彼此不同的第一填料和第二填料，并且导电屏蔽连接到暴露在基板的侧表面上的接地线。 第一填料的平均粒径为接地线的厚度的1/2或更小，第二填料在250摄氏度或更低的温度范围内形成金属键。

公开(公告)号：US20160128196A1

公开(公告)日：2016-05-05

申请号：US14923831

申请日：2015-10-27

Applicant: TDK CORPORATION

Inventor： Tsutomu YASUI ,  Kenichi KAWABATA

IPC: H05K1/18 ,  H05K1/11 ,  C22C19/03 ,  B23K35/30 ,  C22C13/02 ,  H05K1/09 ,  B23K35/26

CPC classification number: C22C19/03 ,  B23K35/262 ,  B23K35/3033 ,  C22C1/0433 ,  C22C1/0483 ,  C22C13/02 ,  H05K3/3463

Abstract: An electronic circuit module component includes: an electronic component; a circuit board including the electronic component mounted thereon; and a bonding metal disposed between a terminal electrode of the electronic component and a terminal electrode of the circuit board, and including Sn alloy phases, an Ni—Sn alloy phase that disperses and forms between the Sn alloy phases and includes at least Fe, and a plurality of holes that is formed inside the Ni—Sn alloy phase and has a diameter of 5 μm or less. A center distance between the holes adjacent to each other is 10 μm or more.

Abstract translation: 电子电路模块组件包括：电子部件; 包括安装在其上的电子部件的电路板; 以及配置在电子部件的端子电极和电路基板的端子电极之间的接合金属，并且包括Sn合金相，在Sn合金相之间分散形成并且至少包含Fe的Ni-Sn合金相，以及 形成在Ni-Sn合金相内部并具有5μm以下的直径的多个孔。 相邻的孔之间的中心距离为10μm以上。

公开(公告)号：US20150052743A1

公开(公告)日：2015-02-26

申请号：US14334965

申请日：2014-07-18

Applicant: TDK Corporation

Inventor： Kenichi KAWABATA ,  Seiko Komatsu

IPC: H05K13/00

CPC classification number: H01L21/67092 ,  Y10T29/49124

Abstract: A manufacturing method of electronic module components according to the present invention includes: forming a plurality of module components on a principal surface of a substrate; forming a groove by dicing between the module components; spraying a conductive paste toward the principal surface of the substrate; and separating the module components. The spraying is performed so that an angle formed between a spray direction and the principal surface is an angle θ. The angle θ is set so as to satisfy the following expression (1), assuming that a depth of the groove is D and a width of the groove is w. the expression (1) is tan−1(D/2w)≦θ≦tan−1(2D/w)

Abstract translation: 根据本发明的电子模块部件的制造方法包括：在基板的主表面上形成多个模块部件; 通过模块部件之间的切割形成凹槽; 向所述基板的主表面喷射导电性浆料; 并分离模块组件。 进行喷雾，使得在喷雾方向和主表面之间形成的角度是角度。 角度和角度 设定为满足下述式（1），假设槽的深度为D，槽的宽度为w。 表达式（1）是tan-1（D / 2w）＆nlE;＆Thetas;＆nlE; tan-1（2D / w）

公开(公告)号：US20230262905A1

公开(公告)日：2023-08-17

申请号：US18024383

申请日：2021-08-19

Applicant: TDK Corporation

Inventor： Ryohei KASAI ,  Masaki OIKAWA ,  Susumu TANIGUCHI ,  Kenichi KAWABATA

IPC: H05K3/34

CPC classification number: H05K3/3463

Abstract: A joint structure, in which an electronic component and a wiring substrate are joined to each other, includes: a base material of the electronic component; a base material of the wiring substrate; and a joint portion that includes at least an electrode of the electronic component and an electrode of the wiring substrate, and that joins the base material of the electronic component and the base material of the wiring substrate. The joint portion includes a material having an absorption coefficient of 2×10{circumflex over ( )}5 cm−1 or more for light of a wavelength of 250 to 1000 nm. The base material of at least one component of the electronic component and the wiring substrate consists of a material having an absorption coefficient of 1.5×10{circumflex over ( )}5 cm−1 or less for the light of a wavelength of 250 to 1000 nm.

公开(公告)号：US20180138131A1

公开(公告)日：2018-05-17

申请号：US15478419

申请日：2017-04-04

Applicant: TDK Corporation

Inventor： Kenichi KAWABATA

IPC: H01L23/552 ,  H01L23/29 ,  H01L25/16 ,  H01L25/00 ,  H01L21/56 ,  H01F1/147

CPC classification number: H01L23/552 ,  H01F1/14708 ,  H01L21/561 ,  H01L21/563 ,  H01L23/295 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00012

Abstract: Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blend ratio of 50 vol. % or more and 85 vol. % or less. The filler includes a first magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni, the first magnetic filler having a first grain size distribution, and a second magnetic filler having a second grain size distribution different from the first grain size distribution.

公开(公告)号：US20170301628A1

公开(公告)日：2017-10-19

申请号：US15465177

申请日：2017-03-21

Applicant: TDK Corporation

Inventor： Kenichi KAWABATA ,  Toshio HAYAKAWA ,  Toshiro OKUBO

IPC: H01L23/552 ,  H01L21/78 ,  H01L23/31 ,  H01L21/3205 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/32051 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81192 ,  H01L2224/97 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/05442 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/014

Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a laminated structure of a magnetic film and a metal film, the laminated structure covering at least an upper surface of the molding resin. The metal film is connected to the power supply pattern, and a resistance value at an interface between the magnetic film and the metal film is equal to or larger than 106Ω.