公开(公告)号：US3484534A

公开(公告)日：1969-12-16

申请号：US3484534D

申请日：1966-07-29

Applicant: TEXAS INSTRUMENTS INC

Inventor： KILBY JACK S ,  TOOMBS HAROLD D ,  TASSEL JAMES H VAN

IPC: H01L23/31 ,  H01L23/498 ,  H05K5/06

CPC classification number: H01L23/3121 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/15173 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/00

公开(公告)号：US3688396A

公开(公告)日：1972-09-05

申请号：US3688396D

申请日：1969-10-13

Applicant: TEXAS INSTRUMENTS INC

Inventor： KILBY JACK S ,  TASSEL JAMES H VAN

IPC: H05K3/06 ,  H05K3/10 ,  H05K3/20 ,  H05K3/28

CPC classification number: H05K3/103 ,  H01L2224/48095 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K3/06 ,  H05K3/20 ,  H05K2201/10287 ,  H05K2201/10977 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49167 ,  Y10T29/4981 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Disclosed is a method of forming a single-sided or a doublesided circuit board with mounted semiconductor devices. The metal conductors on the circuit board are interconnected by wires embedded in the board itself, thereby dispensing with the need for a multilayered circuit board.

Abstract translation: 公开了一种形成具有安装的半导体器件的单面或双面电路板的方法。 电路板上的金属导体通过嵌入电路板本身中的电线相互连接，从而不需要多层电路板。

公开(公告)号：US3419765A

公开(公告)日：1968-12-31

申请号：US64297567

申请日：1967-06-01

Applicant: TEXAS INSTRUMENTS INC

Inventor： CLARK JACK H ,  TASSEL JAMES H VAN ,  LARRABEE GRAYDON B ,  HAEFLING JAMES F

IPC: H01L21/00 ,  H01L23/485 ,  H01L23/522

CPC classification number: H01L23/485 ,  H01L21/00 ,  H01L23/522 ,  H01L24/05 ,  H01L2224/04042 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2924/01322 ,  H01L2924/12036 ,  H01L2924/14 ,  Y10T29/49126 ,  H01L2924/00

公开(公告)号：US3696411A

公开(公告)日：1972-10-03

申请号：US3696411D

申请日：1970-11-12

Applicant: TEXAS INSTRUMENTS INC

Inventor： KILBY JACK S ,  TASSEL JAMES H VAN

IPC: G06F3/02 ,  H01H13/702 ,  H01H13/785

CPC classification number: H01H13/785 ,  G06F3/0202 ,  H01H13/702 ,  H01H2201/026 ,  H01H2205/002 ,  H01H2221/024 ,  H01H2221/062 ,  H01H2231/002 ,  H01H2239/026

Abstract: Disclosed is a keyboard encoder capable of directly encoding decimal input information into electrical binary code. The electrical encoding of the information appears at the output terminals of the encoder when the key representing the information to be encoded is depressed. The depressed key causes the selective shorting together of certain ones of a group of encoding conductors which are connected to the output terminals.

Abstract translation: 公开了一种能够将十进制输入信息直接编码成电二进制代码的键盘编码器。 当代表要编码的信息的键被按下时，信息的电编码出现在编码器的输出端。 按下的键使得连接到输出端的一组编码导体中的某些编码导体的选择性短路。

公开(公告)号：US3617375A

公开(公告)日：1971-11-02

申请号：US3617375D

申请日：1969-08-11

Applicant: TEXAS INSTRUMENTS INC

Inventor： MAREK DANIEL A ,  KREISELMAIER KURT W ,  TASSEL JAMES H VAN

IPC: H01L21/00 ,  H01L21/316 ,  H01L23/522 ,  B41M3/08

CPC classification number: H01L21/00 ,  H01L21/02164 ,  H01L21/02266 ,  H01L21/31612 ,  H01L23/522 ,  H01L2924/0002 ,  Y10T29/43 ,  H01L2924/00

Abstract: Disclosed is a method of forming multilevel electrically conductive interconnections for microminiature devices by electron beam evaporation of a layer of quartz over the first level of interconnections. A second level of interconnections are formed on the quartz layer and make ohmic contact to the first level of interconnections through openings in the quartz layer.

公开(公告)号：US3453722A

公开(公告)日：1969-07-08

申请号：US3453722D

申请日：1965-12-28

Applicant: TEXAS INSTRUMENTS INC

Inventor： RAMSEY THOMAS H JR ,  TASSEL JAMES H VAN ,  ABRAHAM RICHARD P

IPC: H01L21/762 ,  H01L27/06 ,  H01L1/16

CPC classification number: H01L21/76297 ,  H01L27/0652