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33 条记录 (耗时 0.02 秒)

    Connector
    1.
    发明授权
    Connector 失效
    连接器

    公开(公告)号：US5336540A

    公开(公告)日：1994-08-09

    申请号：US997318

    申请日：1992-12-28

    申请人： Tetsuo Kato ,  Masahiro Kanda ,  Tatsuo Tsumiyama ,  Satoru Nakamoto

    发明人： Tetsuo Kato ,  Masahiro Kanda ,  Tatsuo Tsumiyama ,  Satoru Nakamoto

    IPC分类号： C08L23/26 ,  C08L51/06 ,  C08L77/00 ,  C08L77/06 ,  H01R13/46 ,  H01R13/533 ,  C09L77/10

    CPC分类号： H01R13/46 ,  C08L51/06 ,  C08L77/00 ,  C08L77/06 ,  Y10T428/1397

    摘要： A connector comprising a housing comprising a resin composition comprising:(A) from 50 to 95 parts by weight of a semi-aromatic polyamide comprising (A1) an adipate of hexamethylenediamine and (A2) a terephthalate of hexamethylenediamine, where the weight ratio of the adipate of hexamethylenediamine (A1) to the terephthalate of hexamethylenediamine (A2) is from 80/20 to 50/50; and(B) from 5 to 50 parts by weight of a modified polyolefin comprising (B1) a polyolefin copolymer comprising (B11) propylene and (B12) ethylene where the molar ratio of propylene (B11) to ethylene (B12) is from 90/10 to 99/1, the polyolefin copolymer (B1) being graft-modified with (B2) from 0.05 to 5 parts by weight of an .alpha.,.beta.-unsaturated carboxylic acid, an anhydride thereof, or a derivative thereof per 100 parts by weight of the polyolefin copolymer (B1).

    摘要翻译： 一种连接器，包括包含树脂组合物的壳体，所述树脂组合物包含：（A）50至95重量份的半芳族聚酰胺，其包含（A1）己二胺的己二酸酯和（A2）六亚甲基二胺的对苯二甲酸酯，其中重量比 六亚甲基二胺（A1）的己二酸酯与己二胺（A2）的对苯二甲酸酯的摩尔比为80/20〜50/50; 和（B）5至50重量份的改性聚烯烃，其包含（B1）包含（B11）丙烯和（B12）乙烯的聚烯烃共聚物，其中丙烯（B11）与乙烯（B12）的摩尔比为90 / 10〜99/1，聚烯烃共聚物（B1）用（B2）接枝改性为0.05〜5重量份的α，β-不饱和羧酸，其酸酐或其衍生物，每100重量份 的聚烯烃共聚物（B1）。

    Connector molding composition comprising an impact modified and stabilized polyester
    2.
    发明授权
    Connector molding composition comprising an impact modified and stabilized polyester 失效
    连接器成型组合物包含冲击改性和稳定的聚酯

    公开(公告)号：US5442000A

    公开(公告)日：1995-08-15

    申请号：US155695

    申请日：1993-11-23

    申请人： Tetsuo Kato ,  Masahiro Kanda

    发明人： Tetsuo Kato ,  Masahiro Kanda

    IPC分类号： C08K5/13 ,  C08K5/37 ,  C08L25/12 ,  C08L51/00 ,  C08L67/00 ,  C08L67/02 ,  H01B3/42 ,  H01R13/46 ,  C08L51/06 ,  C08L55/00

    CPC分类号： H01B3/422 ,  C08L67/02 ,  C08L25/12 ,  C08L51/003 ,  H01R13/46

    摘要： A connector comprising a housing comprising a polybutylene terephthalate resin composition comprising:(A) 100 parts by weight of a polybutylene terephthalate resin having an intrinsic viscosity of from 1.10 to 1.30 dl/g as measured in o-chlorophenol at 25.degree. C.;(B) from 40 to 60 parts by weight of a copolymer of acrylonitrile and styrene;(C) from 10 to 20 parts by weight of a graft copolymer comprising:(C1) from 65 to 75% by weight of copolymer comprising from 75 to 85% by weight of ethylene and from 25 to 15% by weight of glycidyl methacrylate, and(C2) from 25 to 35% by weight of a copolymer of acrylonitrile and styrene;(D) from 0.05 to 0.5 part by weight of a hindered phenol compound represented by formula (I): ##STR1## (E) from 0.05 to 0.5 part by weight of a thioether compound represented by the following formula (II):(R.sub.3 SR.sub.4 COOCH.sub.2).sub.m C(CH.sub.2 OH).sub.4-m (II)wherein the variables are defined in the specification.

    摘要翻译： 一种连接器，包括包含聚对苯二甲酸丁二醇酯树脂组合物的壳体，其包含：（A）在邻氯代苯酚中在25℃下测量的100重量份的特性粘度为1.10至1.30dl / g的聚对苯二甲酸丁二醇酯树脂。 （B）40〜60重量份的丙烯腈和苯乙烯的共聚物; （C）10至20重量份的接枝共聚物，其包含：（C1）65至75重量％的共聚物，其包含75至85重量％的乙烯和25至15重量％的甲基丙烯酸缩水甘油酯， 和（C2）25至35重量％的丙烯腈和苯乙烯的共聚物; （D）0.05至0.5重量份由式（I）表示的受阻酚化合物：（I）（E）0.05至0.5重量份由下式（II）表示的硫醚化合物 ：（R3SR4​​COOCH2）mC（CH2OH）4-m（II）其中变量在说明书中定义。

    Thermoplastic resin composition and use thereof
    5.
    发明授权
    Thermoplastic resin composition and use thereof 失效
    热塑性树脂组合物及其用途

    公开(公告)号：US5424104A

    公开(公告)日：1995-06-13

    申请号：US178616

    申请日：1994-01-07

    申请人： Yoshikatsu Amimoto ,  Fumitoshi Ikejiri ,  Sanehiro Yamamoto ,  Akinori Toyota ,  Katunari Nishimura ,  Masahiro Kanda ,  Tetsuo Kato

    发明人： Yoshikatsu Amimoto ,  Fumitoshi Ikejiri ,  Sanehiro Yamamoto ,  Akinori Toyota ,  Katunari Nishimura ,  Masahiro Kanda ,  Tetsuo Kato

    IPC分类号： C08L51/06 ,  C08K5/49 ,  C08K5/524 ,  C08L77/00 ,  C08L77/06 ,  H01R13/46 ,  B29D22/00 ,  B29D23/00

    CPC分类号： C08L77/00

    摘要： Disclosed is a thermoplastic resin composition comprising(A) an aromatic polyamide comprisingdicarboxylic acid units comprising 50-100 mol % of units derived from terephthalic acid, and 0-50 mol % of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic-dicarboxylic acid having 4-20 carbon atoms, anddiamine units derived from an aliphatic diamine and/or an alicyclic diamine,said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30.degree. C. and a melting point of higher than 300.degree. C.,(B) a graft modified .alpha.-olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and(C) an aliphatic polyamide,wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified .alpha.-olefin polymer, and/or the graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof (B) and 5-80 parts by weight of the aliphatic polyamide (C), based on 100 parts by weight of the aromatic polyamide (A).

    摘要翻译： 公开了一种热塑性树脂组合物，其包含（A）包含二羧酸单元的芳族聚酰胺，所述二羧酸单元包含50-100摩尔％的由对苯二甲酸衍生的单元，以及0-50摩尔％的衍生自除对苯二甲酸之外的芳族二羧酸的单元和/ 或具有4-20个碳原子的脂族二羧酸，以及衍生自脂族二胺和/或脂环族二胺的二胺单元，所述芳族聚酰胺的特性粘度为浓度为0.5-3.0dl / g。 硫酸在30℃，熔点高于300℃，（B）接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物和（ C）脂肪族聚酰胺，其中所述热塑性树脂组合物包含10-80重量份的接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物（B）和5- 基于100重量份的芳族聚酰胺（A），80重量份的脂肪族聚酰胺（C）。

    Waterproof connector and method of inserting terminals in waterproof connector
    7.
    发明授权
    Waterproof connector and method of inserting terminals in waterproof connector 有权
    防水连接器和插入端子在防水连接器中的方法

    公开(公告)号：US06739908B2

    公开(公告)日：2004-05-25

    申请号：US10093396

    申请日：2002-03-11

    申请人： Tsuyoshi Hamai ,  Toshiharu Kudo ,  Masahiro Kanda

    发明人： Tsuyoshi Hamai ,  Toshiharu Kudo ,  Masahiro Kanda

    IPC分类号： H01R1340

    CPC分类号： H01R13/5208 ,  H01R13/62938 ,  H01R43/005

    摘要： Housing-side intimate contact ribs are formed on a rear end surface of a male connector housing, and a holder-side intimate-contact ribs are formed on a mat seal holder which holds a mat seal on the male connector housing. These intimate-contact ribs are inserted respectively in inlet portions of intimate-contact cavity portions formed in the mat seal, thereby provisionally retaining the mat seal. In this condition, metal terminals can be easily and positively passed respectively through wire insertion holes in the mat seal.

    摘要翻译： 外壳侧紧密接触肋形成在阳连接器壳体的后端表面上，并且保持器侧紧密接触肋形成在垫密封保持器上，该垫密封保持器在阳连接器壳体上保持垫密封。 这些紧密接触肋分别插入形成在垫密封件中的紧密接触腔部分的入口部分中，从而临时保持垫密封。 在这种情况下，金属端子可以容易地和积极地通过垫密封件中的电线插入孔。

    Semiconductor laser module
    9.
    发明授权
    Semiconductor laser module 失效
    半导体激光模块

    公开(公告)号：US5974065A

    公开(公告)日：1999-10-26

    申请号：US819009

    申请日：1997-03-17

    申请人： Masahiro Kanda

    发明人： Masahiro Kanda

    IPC分类号： G02B6/32 ,  G02B6/42 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S3/18 ,  G02B6/36 ,  H01S3/04

    CPC分类号： H01S5/02284 ,  G02B6/4245 ,  G02B6/4271 ,  G02B6/4204 ,  G02B6/4237 ,  H01S5/02415

    摘要： A semiconductor laser module includes a flat board, a semiconductor laser, a lens, an optical fiber, a lens holder, an electronic cooling element, and support rods. The semiconductor laser is mounted on the board, and the laser emit a laser beam. The lens focuses the laser beam from the semiconductor laser. The optical fiber is optically coupled to the lens to receive the laser beam emitted from the semiconductor laser and focused by the lens. The lens holder holds the lens on the optical axis of the semiconductor laser. The electronic cooling element adjusts the temperature of the semiconductor laser, and the board is fixed to the upper surface of the electronic cooling element. The support rods support the lens holder at a position opposing a light-exit end face of the board.

    摘要翻译： 半导体激光器模块包括平板，半导体激光器，透镜，光纤，透镜架，电子冷却元件和支撑杆。 半导体激光器安装在板上，激光器发射激光束。 透镜对来自半导体激光器的激光束进行聚焦。 光纤光学耦合到透镜以接收从半导体激光器发射并由透镜聚焦的激光束。 透镜架将透镜保持在半导体激光器的光轴上。 电子冷却元件调节半导体激光器的温度，并且板固定到电子冷却元件的上表面。 支撑杆将透镜架支撑在与板的光出射端面相对的位置。

    Sealing part for connector waterproofing
    10.
    发明授权
    Sealing part for connector waterproofing 失效
    密封件用于连接器防水

    公开(公告)号：US5677066A

    公开(公告)日：1997-10-14

    申请号：US504677

    申请日：1995-07-20

    申请人： Kiyotaka Okazaki ,  Masahiro Kanda

    发明人： Kiyotaka Okazaki ,  Masahiro Kanda

    IPC分类号： C08L83/04 ,  C09K3/10 ,  H01R13/52 ,  C08K3/04

    CPC分类号： H01R13/5219 ,  C08L83/04 ,  C09K3/1018 ,  H01R13/5216 ,  C08G77/12 ,  C08G77/20 ,  C08G77/24 ,  C08G77/26 ,  C08G77/70 ,  C09K2200/0247 ,  Y10T428/31638 ,  Y10T428/31641 ,  Y10T428/31649

    摘要： A sealing part for connector waterproofing is disclosed, which comprises a vulcanized molding obtained from a composition comprising 100 parts by weight of a polyorganosiloxane (1), from 5 to 100 parts by weight of a reinforcing silica powder filler (2), from 0.01 to 10 parts by weight of a hydrogensiloxane polymer (3) having two or more Si-H bonds per molecule, and from 0.01 to 5 parts by weight of t-butyl peroxy-3,5,5-trimethylhexanoate (4). The sealing part for connector waterproofing of the present invention is satisfactory in heat resistance, low-temperature resistance, and oil resistance and can be produced at low cost in a reduced molding time.

    摘要翻译： 公开了一种用于连接器防水的密封部件，其包括由包含100重量份聚有机硅氧烷（1），5至100重量份增强二氧化硅粉末填料（2），0.01至 10重量份每分子具有两个或更多个Si-H键的氢硅氧烷聚合物（3）和0.01至5重量份过氧-3,5,5-三甲基己酸叔丁酯（4）。 本发明的连接器防水用密封件在耐热性，耐低温性和耐油性方面是令人满意的，并且可以在缩短的成型时间内以低成本生产。