公开(公告)号：US20180226514A1

公开(公告)日：2018-08-09

申请号：US15746342

申请日：2016-07-22

Applicant: ams AG

Inventor： Harald ETSCHMAIER ,  Gregor TOSCHKOFF ,  Thomas BODNER ,  Franz SCHRANK

IPC: H01L31/0203 ,  H01L31/02 ,  H01L23/00

CPC classification number: H01L31/0203 ,  G01J1/0204 ,  G01J1/0271 ,  G01J5/045 ,  H01L24/13 ,  H01L31/02005 ,  H01L31/02327 ,  H01L31/153 ,  H01L31/173 ,  H01L2224/13025

Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure.

公开(公告)号：US20180323320A1

公开(公告)日：2018-11-08

申请号：US15773539

申请日：2016-11-04

Applicant: ams AG

Inventor： David MEHRL ,  Thomas BODNER ,  Gregor TOSCHKOFF ,  Harald ETSCHMAIER ,  Franz SCHRANK

IPC: H01L31/0232 ,  G02B3/04 ,  G02B19/00 ,  H01L33/62 ,  H01L33/58 ,  H01L33/60 ,  H01L33/56 ,  H01L31/02 ,  H01L31/0203 ,  H01L33/00 ,  H01L31/18

CPC classification number: H01L31/02327 ,  G02B3/04 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0076 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/1876 ,  H01L33/0095 ,  H01L33/46 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: An optical package is proposed comprising a carrier, an optoelectronic component, an aspheric lens, and a reflective layer. The carrier comprises electrical interconnections and the optoelectric component is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component is mounted on the carrier or integrated into the carrier and electrically connected to the electric interconnections. The aspheric lens has an upper surface, a lateral surface, and a bottom surface and the bottom surface is arranged on or near the optoelectric component. The aspheric lens comprises a material which is at least transparent in the specified wavelength range. The reflective layer comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface of the aspheric lens, and wherein the reflective material is at least partly reflective in the specified wavelength range.

公开(公告)号：US20200313031A1

公开(公告)日：2020-10-01

申请号：US16756025

申请日：2018-10-15

Applicant: ams AG

Inventor： Gregor TOSCHKOFF ,  Thomas BODNER ,  Franz SCHRANK ,  Miklos LABODI ,  Joerg SIEGERT ,  Martin SCHREMS

IPC: H01L31/18 ,  G01J1/04 ,  G01J1/02 ,  H01L31/0216 ,  H01L31/02 ,  H01L31/0203

Abstract: A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench. Each optical sensor comprises an optical sensor element, and the light entrance surface is free of electrical contacts and at least partially free of the opaque material above the optical sensor elements. Furthermore, an optical sensor is provided.