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公开(公告)号：US20230022275A1
公开(公告)日：2023-01-26
申请号：US17778377
申请日：2020-12-18
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Nicola Spring
Abstract: A method of manufacturing an optical element is disclosed. The method comprises the steps of forming a layer of first material on a substrate, forming a plurality of cavities in the layer of first material by an imprinting process, and forming a layer of second material in the plurality of cavities to form an optical meta-surface. Also disclosed is an optical element manufactured according to the method, and an optical device comprising the optical element, and an optical apparatus such as a cellular telephone, a camera, an image-recording device, or a video recording device.
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公开(公告)号：US11013123B2
公开(公告)日：2021-05-18
申请号：US16597447
申请日：2019-10-09
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bojan Tesanovic , Nicola Spring , Simon Gubser , Robert Lenart , Mario Cesana
Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
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公开(公告)号：US12005658B2
公开(公告)日：2024-06-11
申请号：US17436823
申请日：2020-03-12
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bojan Tesanovic , Hartmut Rudmann , Nicola Spring , Sebastiano Lazzi Gazzini
IPC: B29D11/00 , B29C43/02 , B29C43/38 , B29C64/112 , B29C64/188 , B29C64/30 , B29C64/379 , G02B3/00 , B29L11/00
CPC classification number: B29D11/00307 , B29C43/021 , B29C43/38 , B29C64/112 , B29C64/188 , B29C64/30 , B29C64/379 , B29D11/00298 , B29D11/00365 , B29D11/00413 , G02B3/0075 , B29L2011/0016
Abstract: A method of manufacturing a plurality of optical elements (140) comprising the steps of providing a substrate (120), and a tool (101) comprising a plurality of replication sections (106), each defining a surface structure of one of the optical elements (140), the tool (101) further comprising at least one contact spacer portion (112), aligning the tool (101) and the substrate (120) with respect to each other and bringing the tool (101) and a first side of the substrate (122) together, with replication material (124) between the tool (101) and the substrate (120), the contact spacer portion (112) contacting the first side of the substrate (122), and thereby causing the spacer portion (112) to adhere to the first side of the substrate (122), hardening the replication material (124), wherein the substrate (120) has yard line features (138) around at least a portion of the replication sections (106), the yard line features (138) containing the replication material (124) on a first side of the yard line with respect to the tool (101) and the substrate (120).
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公开(公告)号：US20230266514A1
公开(公告)日：2023-08-24
申请号：US18043308
申请日：2021-08-03
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Simon Gubser , Sonja Gantner , Nicola Spring , Sajedeh Manzeli , Ethouba Aljassin
CPC classification number: G02B5/24 , G02B5/223 , G02B1/10 , G02B2207/123 , G09F9/301
Abstract: A privacy film for a curved display screen. The privacy film has a curved cross section when no force is applied. The privacy film comprises alternating transparent layers and opaque layers, each extending across the privacy film, and each parallel to the other transparent and opaque layers when no force is applied. A method of manufacturing the film is also disclosed.
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公开(公告)号：US10566468B2
公开(公告)日：2020-02-18
申请号：US16086868
申请日：2017-03-23
Applicant: AMS SENSORS SINGAPORE PTE. LTD.
Inventor： Martin Lukas Balimann , Matthias Gloor , Philippe Bouchilloux , Jukka Alasirniö , Hartmut Rudmann , Nicola Spring
IPC: H01L31/02 , H01L31/0203 , H01L27/146 , H01L31/0232 , H05K1/02 , H01L31/024 , H01L33/48 , H01L33/58 , H01L33/62 , H01L33/64 , H01L51/52 , H01S5/022 , H01S5/024 , H01L31/18
Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.
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Patent Agency Ranking
公开(公告)号：US12130454B2
公开(公告)日：2024-10-29
申请号：US17318345
申请日：2021-05-12
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Nicola Spring , Hartmut Rudmann , Markus Rossi
IPC: B29D11/00 , F21V7/00 , G02B3/00 , G02B5/04 , G02B6/12 , G02B6/122 , G02B6/13 , G02B6/34 , G02B13/00 , G02B17/08 , G02B6/43
CPC classification number: G02B5/045 , B29D11/00692 , B29D11/00721 , F21V7/0091 , G02B3/0062 , G02B5/04 , G02B6/12004 , G02B6/122 , G02B6/13 , G02B6/34 , G02B13/0065 , G02B17/0856 , G02B2006/12114 , G02B2006/12166 , G02B6/43
Abstract: The method for manufacturing optical light guide elements comprises providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; and fixing the plurality of initial bars with respect to each other in the position to obtain a bar arrangement.
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公开(公告)号：US20220137269A1
公开(公告)日：2022-05-05
申请号：US17431241
申请日：2020-03-11
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Nicola Spring , QiChuan Yu
Abstract: A method of manufacturing a plurality of optical elements (140), the method comprising providing a first wafer (120) having hardened replication material forming optical elements (140) on a first side of the first wafer (120), providing a second wafer (121) having hardened replication material forming optical elements (140) on a first side of the second wafer (121), depositing liquid droplets (180) on the first side of the first wafer (120) between the optical elements (140) aligning the first side of the first wafer (120) with the first side of the second wafer (121), and bringing the two wafers (120, 121) together such that the liquid droplets (180) on the first side of the first wafer (120) adhere to the first side of the second wafer (121).
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公开(公告)号：US20200045828A1
公开(公告)日：2020-02-06
申请号：US16597447
申请日：2019-10-09
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bojan Tesanovic , Nicola Spring , Simon Gubser , Robert Lenart , Mario Cesana
IPC: H05K3/00 , H01L27/146 , H01L33/48 , H05K1/02
Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
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公开(公告)号：US20230335671A1
公开(公告)日：2023-10-19
申请号：US18042653
申请日：2021-07-06
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Francesco Paolo D'Aleo , Peter Roentgen , Nicola Spring , Kotaro Ishizaki
CPC classification number: H01L33/10 , H01L33/44 , H01L25/167 , H01L33/26 , H01L33/0008
Abstract: A substantially planar light replication or re-transmission component having an incident light receiving surface and an opposed light emitting surface. The component comprises a substantially transparent planar substrate, one or more bipolar junction transistors provided on said substrate, the or each transistor comprising a collector region adjacent to said light receiving surface, an emitter region adjacent to said light emitting surface, and a base region between said collector region and said emitter region, and circuitry for biasing the bipolar transistors in use. The or each transistor is configured and biased in use so that said collector and base regions of the transistor operate as a photodiode whilst said base and emitter regions operate as a light emitting diode.
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公开(公告)号：US20220227080A1
公开(公告)日：2022-07-21
申请号：US17608652
申请日：2020-06-12
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Uros Markovic , Nicola Spring
Abstract: Techniques for controlling the flow of replication material (e.g., epoxy) during the formation of replicated optical elements include providing a transparent substrate (220) onto which the optical elements are to be replicated. The substrate (220) includes a structured UV curable shield (202) adhering to its surface. The UV curable shield (202), in turn, has openings (203) that expose portions of the surface of the transparent substrate (220) for replication of the optical elements. During the replication process, excess replication material (124A) may flow onto the UV curable shield (202), which subsequently can be cured so as to facilitate the release and removal of the shield (202) along with the excess replication material (124A).
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