公开(公告)号：US12127347B2

公开(公告)日：2024-10-22

申请号：US18041042

申请日：2022-08-30

申请人： HONOR DEVICE CO., LTD.

发明人： Zhijie Xu

IPC分类号： H05K1/18 ,  H05K3/32

CPC分类号： H05K1/183 ,  H05K3/328 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10037

摘要： Embodiments of this application are applied to the field of terminal technologies, and provide a PCB assembly and an electronic device, where the PCB assembly includes a PCB, a first conductor, a first battery, and a second battery. The PCB includes a groove area. The first battery and the second battery are disposed on different sides of the groove area. The first conductor is disposed in the groove area, and the first conductor is configured to connect the first battery and the second battery. That is, in the embodiments of this application, the first battery and the second battery are connected by using the first conductor in the groove area, which prevents a power cable connecting the first battery and the second battery from occupying an area on the PCB, thereby increasing an area in which other components can be installed on the PCB.

公开(公告)号：US20240341036A1

公开(公告)日：2024-10-10

申请号：US18372062

申请日：2023-09-23

申请人： DARWIN PRECISIONS CORPORATION

发明人： Yi Feng Chen ,  Chia Tsun Huang ,  Keng-Kuei Liang

IPC分类号： H05K1/18 ,  H05K1/03 ,  H05K3/32

CPC分类号： H05K1/181 ,  H05K1/0393 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/10818

摘要： An electronic device includes a substrate, conductive circuit lines, an anisotropic conductive block, and a plastic layer. The substrate has an arrangement surface having a mounting area and a coverage area, and the coverage area surrounds the mounting area. The conductive circuit lines are arranged in the coverage area. Each of the conductive circuit lines partially passes through the mounting area. The anisotropic conductive block includes an anisotropic conductive layer. The anisotropic conductive layer has a first conductive surface, a second conductive surface, and a side surface. The first conductive surface is opposite to the second conductive surface. The side surface is connected between the first conductive surface and the second conductive surface and surrounds the first conductive surface and the second conductive surface. The anisotropic conductive block covers the mounting area through the first conductive surface. The plastic layer surrounds the side surface and covers the coverage area.

公开(公告)号：US12114427B2

公开(公告)日：2024-10-08

申请号：US17831301

申请日：2022-06-02

申请人： Siliconware Precision Industries Co., Ltd.

发明人： Lung-Yuan Wang ,  Wen-Liang Lien

IPC分类号： H05K3/32 ,  H01L23/31 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/46 ,  H05K1/02

CPC分类号： H05K1/144 ,  H01L23/3157 ,  H05K1/111 ,  H05K1/181 ,  H05K3/32 ,  H05K3/4682 ,  H05K1/0203 ,  H05K2201/042

摘要： A method for fabricating an assemble substrate is provided, including stacking a circuit portion on a plurality of circuit members. The circuit members are spaced apart from one another in a current packaging process to increase a layer area. The assemble substrate thus fabricated meets the requirements for a packaging substrate of a large size, and has a high yield and low fabrication cost.

公开(公告)号：US12113310B2

公开(公告)日：2024-10-08

申请号：US17108567

申请日：2020-12-01

申请人： Seagate Technology LLC

发明人： Brett R. Herdendorf ,  Riyan Alex Mendonsa ,  Wolfgang Rosner ,  Krishnan Subramanian

IPC分类号： H01R12/85 ,  H01R4/01 ,  H05K3/32

CPC分类号： H01R12/856 ,  H01R4/01 ,  H05K3/325

摘要： Connector devices or connectors for use in interconnection to a circuit board may be configured in an open or closed configuration. The connectors devices may utilize a shape memory alloy (SMA) actuator to move clamping portions with respect to each other into one or both of the open or closed positions.

公开(公告)号：US20240314938A1

公开(公告)日：2024-09-19

申请号：US18185041

申请日：2023-03-16

申请人： UNEO INC.

发明人： Chih-Sheng HOU ,  Chia-Hung CHOU ,  Hsin-Lin YU ,  Si-Wei CHEN ,  Chueh CHIANG

IPC分类号： H05K3/32 ,  H05K1/03

CPC分类号： H05K3/32 ,  H05K1/038 ,  H05K2201/0145 ,  H05K2201/029 ,  H05K2201/10287

摘要： The present invention relates to an extension structure of flexible substrates with conductive wires thereon. In a first embodiment, three flexible substrates are prepared, each having multiple conductive wires configured on their front surfaces. The third flexible substrate is flipped over, with its conductive wires facing downwards, and bonded across a boundary formed by the first and second flexible substrates. As a result, the corresponding conductive wires between the first and second flexible substrates are electrically coupled with each other through being physically pressed by corresponding conductive wires in the third flexible substrate.

公开(公告)号：US12089338B2

公开(公告)日：2024-09-10

申请号：US17150696

申请日：2021-01-15

申请人： LOOMIA Technologies, Inc.

发明人： Madison Thea Maxey ,  Janett Martinez ,  Ezgi Uçar

IPC分类号： H05K1/18 ,  G06F3/044 ,  H05K1/02 ,  H05K3/00 ,  H05K3/04 ,  H05K3/32

CPC分类号： H05K1/189 ,  G06F3/044 ,  H05K1/0213 ,  H05K3/0011 ,  H05K3/043 ,  H05K3/32 ,  G06F2203/04112

摘要： A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.

公开(公告)号：US12085753B2

公开(公告)日：2024-09-10

申请号：US17481798

申请日：2021-09-22

申请人： Hisense Broadband Multimedia Technologies Co., Ltd.

发明人： Long Zheng ,  Sigeng Yang

IPC分类号： H05K3/32 ,  G02B6/13 ,  H05K1/11 ,  H05K1/18

CPC分类号： G02B6/13 ,  H05K1/181 ,  H05K1/182 ,  H05K2201/10121 ,  H05K2201/10287

摘要： An optical module includes a circuit board and a silicon optical chip. The circuit board includes a plurality of circuit board bonding pads. The silicon optical chip includes a plurality of chip bonding pads corresponding to the plurality of circuit board bonding pads. The plurality of chip bonding pads are electrically connected to the corresponding circuit board bonding pads, so that the silicon optical chip is electrically connected to the circuit board. A chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires, or a circuit board bonding pad is electrically connected to at least one corresponding chip bonding pad through a plurality of bonding wires. A connecting line of two or more of bonding positions of the plurality of bonding wires on the circuit board bonding pads is inclined with respect to a connecting line of centers of the circuit board bonding pads.

公开(公告)号：US12069808B2

公开(公告)日：2024-08-20

申请号：US17634019

申请日：2020-08-18

申请人： Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO

发明人： Margaretha Maria De Kok ,  Gerardus Titus Van Heck ,  Jeroen Franciscus Marinus Schram

IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K1/03 ,  H05K3/32

CPC分类号： H05K1/189 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/0393 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2201/0323 ,  H05K2203/0278

摘要： An electronic component (1) is connected to a conductive track (2) on a flexible substrate (3). A connection layer (4) of a composition comprising a thermoplastic material (TPM1) is provided on the conductive track (2). The connection layer (4) has at least one cutout (5) aligned to overlap the conductive track (2). A thermosetting material (TSM1) in liquid state is used to fill the cutout (5). The electronic component (1) is provided on top of the connection layer (4). By applying heat, a temperature of the connection layer (4) is raised to above a softening temperature of the thermoplastic material (TPM1). Pressure is applied to form a mechanical connection. By the application of heat (H) a temperature of the thermosetting material (TSM1) is raised above its thermosetting temperature for solidifying the thermosetting material (TSM1) and forming an electrical connection (E).

公开(公告)号：US12053302B2

公开(公告)日：2024-08-06

申请号：US18297966

申请日：2023-04-10

申请人： Peerbridge Health, Inc.

发明人： Angelo Joseph Acquista ,  Keith Sproat ,  Steven Geyster ,  Arthur Bertolero ,  Leung-Hang Ma ,  John Shambroom ,  Benjamin Mughal ,  Robert Joseph Bouthillier ,  Michael Peter Fusaro ,  Elisabeth Goodrich

IPC分类号： A61B5/00 ,  A61B5/25 ,  A61B5/305 ,  H01R31/00 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32

CPC分类号： A61B5/6833 ,  A61B5/0015 ,  A61B5/25 ,  A61B5/305 ,  H01R31/00 ,  H05K1/189 ,  A61B5/6805 ,  A61B2503/10 ,  H05K3/284 ,  H05K3/326 ,  H05K2201/10098 ,  H05K2201/10151

摘要： A system for wirelessly obtaining physiological data from a subject includes a sensor patch and a separate electronics package. The sensor patch is disposed on and adheres to the subject, and includes a first part of a releasable electrical connector. An electronics package includes a second part of the first releasable electrical connector, which is used to physically and electrically connect the electronics package to the sensor patch. The electronics package includes a flexible substrate, with shells set on this substrate. The shells enclose the electronics. The shells are connected by a flexible circuit board. Analog front end circuitry is placed in one shell, while the wireless transceiver is placed in the other shell.

公开(公告)号：US12015175B2

公开(公告)日：2024-06-18

申请号：US18322388

申请日：2023-05-23

申请人： Samsung SDI Co., Ltd.

发明人： Michael Erhart

IPC分类号： H01M50/519 ,  H01M10/42 ,  H01M50/204 ,  H01M50/516 ,  H01M50/528 ,  H05K3/32 ,  H05K3/36

CPC分类号： H01M50/519 ,  H01M10/4257 ,  H01M50/204 ,  H01M50/516 ,  H01M50/528 ,  H05K3/328 ,  H05K3/361 ,  H01M2010/4271 ,  H05K2203/107 ,  H05K2203/1545

摘要： A method for connecting a flexible printed circuit (FPC) to a battery module and a cell supervision circuit board (CSCB) is provided. The method includes: providing a coil of a continuous, strip-shaped FPC; unwinding a first section of the FPC from the coil, positioning the first section of the FPC over a first contact portion of the battery module, and welding a conductive structure of the FPC in the first section to the first contact portion of the battery module; unwinding a second section of the FPC from the coil, positioning the second section of the FPC over a contact pad of the CSCB, and welding the conductive structure of the FPC in the second section to the contact pad of the CSCB; and separating the first section and second section of the FPC from the coil of the FPC.