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91.发明授权Interconnectable ultrasound transducer probes and related methods and apparatus 有权可互连的超声换能器探头及相关方法和装置公开(公告)号：US09592030B2
公开(公告)日：2017-03-14
申请号：US14337813
申请日：2014-07-22
发明人： Jonathan M. Rothberg , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Gregory L. Charvat , Gregory Corteville
IPC分类号： A61B8/14 , A61B8/00 , A61B8/13 , A61B8/08 , G03B27/42 , G03B27/52 , B06B1/02 , G01S7/00 , A61N7/02 , G01S7/52 , G01S15/89 , A61N7/00
CPC分类号： A61B8/4444 , A61B8/13 , A61B8/14 , A61B8/4411 , A61B8/4477 , A61B8/4483 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/54 , A61B8/56 , A61N7/02 , A61N2007/0078 , B06B1/0292 , G01S7/003 , G01S7/5208 , G01S7/52084 , G01S15/8915 , G03B27/423 , G03B27/52 , Y10T29/49005
摘要： Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.
摘要翻译： 描述了超声装置和方法，包括具有超声换能器和相应电路的可重复的超声换能器探头。 可重复的超声换能器探针可以单独使用或与可重复的超声换能器探头的其它实例相结合以产生所需的超声波装置。 超声设备可以可选地连接到各种类型的外部设备以提供额外的处理和图像呈现功能。
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公开(公告)号：US20170056926A1
公开(公告)日：2017-03-02
申请号：US15349223
申请日：2016-11-11
发明人： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
CPC分类号： B06B1/0292 , B06B1/02 , B81B3/0021 , B81B2203/0127 , B81B2203/0315 , B81B2207/015 , B81C1/00158 , B81C2201/013 , B81C2203/0118 , B81C2203/0735 , B81C2203/0771 , G10K9/12 , G10K11/18
摘要： CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
摘要翻译： 描述了CMOS超声波传感器及其制造方法。 所述方法可以包括在第一晶片上形成空腔并将第一晶片接合到第二晶片。 可以处理第二晶片以形成用于空腔的膜。 可以提供对腔的电接入。
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公开(公告)号：US20160331353A1
公开(公告)日：2016-11-17
申请号：US14714150
申请日：2015-05-15
摘要： An ultrasound apparatus comprising a plurality of ultrasonic transducers, a non-acoustic sensor, a memory circuitry to store control data for operating the ultrasound apparatus to perform an acquisition task, and a controller. The controller is configured to receive an indication to perform the acquisition task, receive non-acoustic data obtained by the non-acoustic sensor, and control, based on the control data and the non-acoustic data, the plurality of ultrasonic transducers to obtain acoustic data for the acquisition task.
摘要翻译： 一种超声波装置，包括多个超声换能器，非声学传感器，存储用于操作所述超声波装置以执行获取任务的控制数据的存储器电路以及控制器。 控制器被配置为接收执行采集任务的指示，接收由非声学传感器获得的非声学数据，并且基于控制数据和非声学数据控制多个超声波换能器以获得声学 采集任务的数据。
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公开(公告)号：US09473136B1
公开(公告)日：2016-10-18
申请号：US14957398
申请日：2015-12-02
发明人： Kailiang Chen , Tyler S. Ralston
IPC分类号： A61N7/02 , H03K17/687 , H03K19/0185
CPC分类号： H03K17/6871 , A61N7/02 , A61N2007/0078 , B06B1/0207 , B06B2201/76 , H03K19/018507
摘要： Apparatus and methods are provided directed to a device, including at least one ultrasonic transducer, a level shifter coupled to the at least one ultrasonic transducer, the level shifter including an input terminal configured to receive an input voltage, an output terminal configured to provide an output voltage level-shifted from the input voltage, a capacitor coupled between the input terminal and the output terminal, and a diode coupled in reverse-biased configuration between an input to an active high voltage element and a first voltage of a high voltage power supply.
摘要翻译： 提供了一种设备和方法，其包括至少一个超声换能器，耦合到所述至少一个超声换能器的电平移位器，所述电平移位器包括被配置为接收输入电压的输入端子，所述输出端子被配置为提供 从输入电压移位的输出电压电平，耦合在输入端子和输出端子之间的电容器，以及以反向偏置配置耦合的二极管，在输入到有源高电压元件和高压电源的第一电压之间 。
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公开(公告)号：US20160290970A1
公开(公告)日：2016-10-06
申请号：US15178025
申请日：2016-06-09
CPC分类号： G01N29/2406 , A61B8/4483 , B06B1/0292 , B81B7/007 , B81B2201/0271 , B81C1/00238 , B81C1/00301 , B81C2201/019 , B81C2203/036 , B81C2203/0792 , H01L2224/4813 , H01L2924/0002 , H01L2924/146 , H01L2924/1461
摘要： Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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96.发明申请公开(公告)号：US20160280538A1
公开(公告)日：2016-09-29
申请号：US15177977
申请日：2016-06-09
CPC分类号： G01N29/2406 , A61B8/4483 , B06B1/0292 , B81B7/007 , B81B2201/0271 , B81C1/00238 , B81C1/00301 , B81C2201/019 , B81C2203/036 , B81C2203/0792 , H01L2224/4813 , H01L2924/0002 , H01L2924/146 , H01L2924/1461
摘要： Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
摘要翻译： 与互补金属氧化物半导体（CMOS）基板集成的微加工超声换能器以及制造这种装置的方法进行了描述。 制造可能涉及两个单独的晶片结合步骤。 可以使用晶片结合来制造衬底中的密封空腔。 晶片接合也可以用于将衬底粘合到另一衬底，例如CMOS晶片。 至少第二晶片接合可以在低温下进行。
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97.发明授权公开(公告)号：US09290375B2
公开(公告)日：2016-03-22
申请号：US14711145
申请日：2015-05-13
发明人： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
CPC分类号： B81C1/00301 , B06B1/02 , B06B1/0292 , B81B7/007 , B81C1/00134 , B81C1/00158 , B81C1/00246 , B81C2201/0195 , B81C2203/0735 , B81C2203/0771 , G01N29/2406 , H01L29/84 , H04R19/005
摘要： Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
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公开(公告)号：US09268014B2
公开(公告)日：2016-02-23
申请号：US14191523
申请日：2014-02-27
IPC分类号： A61B8/00 , A61B8/14 , G01S7/52 , A61B8/08 , A61N7/00 , A61B17/32 , A61N7/02 , A61B5/01 , A61B8/13 , A61B19/00
CPC分类号： G01S7/52017 , A61B5/015 , A61B8/08 , A61B8/13 , A61B8/4209 , A61B8/4245 , A61B8/4254 , A61B8/4263 , A61B8/4477 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/56 , A61B8/565 , A61B17/320068 , A61B2090/378 , A61B2562/164 , A61N7/00 , A61N7/02 , A61N2007/0078 , G01S7/52019 , G01S7/52023
摘要： Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
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公开(公告)号：US09247924B2
公开(公告)日：2016-02-02
申请号：US14191558
申请日：2014-02-27
CPC分类号： G01S7/52017 , A61B5/015 , A61B8/08 , A61B8/13 , A61B8/4209 , A61B8/4245 , A61B8/4254 , A61B8/4263 , A61B8/4477 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/56 , A61B8/565 , A61B17/320068 , A61B2090/378 , A61B2562/164 , A61N7/00 , A61N7/02 , A61N2007/0078 , G01S7/52019 , G01S7/52023
摘要： Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
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100.发明授权公开(公告)号：US09242275B2
公开(公告)日：2016-01-26
申请号：US14208351
申请日：2014-03-13
发明人： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
CPC分类号： B81C1/00301 , B06B1/02 , B06B1/0292 , B81B7/007 , B81C1/00134 , B81C1/00158 , B81C1/00246 , B81C2201/0195 , B81C2203/0735 , B81C2203/0771 , G01N29/2406 , H01L29/84 , H04R19/005
摘要： Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
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