Lamp module and desk lamp using the same
    91.
    发明授权
    Lamp module and desk lamp using the same 失效
    灯模块和台灯使用相同

    公开(公告)号:US08690387B2

    公开(公告)日:2014-04-08

    申请号:US13182949

    申请日:2011-07-14

    IPC分类号: F21V21/00

    摘要: A lamp module is provided. The lamp module includes a main body and a plurality of light emitting diodes. The light emitting diodes are disposed on the main body. Each light emitting diode emits a light to a illuminated region and form a corresponding light region. The light regions formed on the illuminated region by the light emitted by adjacent light emitting diodes are at least partially overlapped.

    摘要翻译: 提供灯模块。 灯模块包括主体和多个发光二极管。 发光二极管配置在主体上。 每个发光二极管向照明区域发射光并形成对应的光区域。 通过相邻发光二极管发射的光在照明区域上形成的光区域至少部分重叠。

    Illumination device and lens thereof
    92.
    发明授权
    Illumination device and lens thereof 有权
    照明装置及其透镜

    公开(公告)号:US08684585B2

    公开(公告)日:2014-04-01

    申请号:US13221932

    申请日:2011-08-31

    IPC分类号: F21V8/00 F21V5/04 F21V7/00

    摘要: An illumination device and a lens thereof are provided. The lens includes a surrounding sidewall, a light-incident surface, a light-incident structure, and a light-emitting surface. The surrounding sidewall includes two planar portions opposite to each other and two arc-surface portions opposite to each other to surround a reference axis. The light-incident surface is located at a side of the surrounding sidewall to receive a light emitted from a point light source. The light-incident structure located on the light-incident surface includes a plurality of bar-shaped protrusions. Each bar-shaped protrusion includes a plurality of first light-diffusing surfaces not parallel to the light-incident surface. The light-emitting surface is located at the other side of the surrounding sidewall and is opposite to the light-incident surface. The light-emitting surface is substantially circular. A cross-section area of the lens gradually increases from the light-incident surface to the light-emitting surface.

    摘要翻译: 提供一种照明装置及其透镜。 透镜包括周围的侧壁,光入射表面,光入射结构和发光表面。 周围的侧壁包括彼此相对的两个平面部分和彼此相对的两个弧形表面部分,以围绕参考轴线。 光入射表面位于周围侧壁的一侧以接收从点光源发射的光。 位于光入射表面上的光入射结构包括多个条形突起。 每个条形突起包括不与光入射表面平行的多个第一光扩散表面。 发光表面位于周围侧壁的另一侧并与光入射表面相对。 发光面基本上是圆形的。 透镜的截面积从光入射面逐渐增加到发光面。

    KEYBOARD COVER FABRICATION METHOD
    93.
    发明申请
    KEYBOARD COVER FABRICATION METHOD 有权
    键盘盖制造方法

    公开(公告)号:US20140076019A1

    公开(公告)日:2014-03-20

    申请号:US14026059

    申请日:2013-09-13

    申请人: CHI-JUI HUANG

    发明人: CHI-JUI HUANG

    IPC分类号: H01H9/02

    摘要: A keyboard cover fabrication method for making a keyboard cover by processing a metal sheet material into a shaped metal component having protrusions and then cutting off a top part of each protrusion of the shaped metal component.

    摘要翻译: 一种用于通过将金属片材处理成具有凸起的成形金属部件,然后切割成形金属部件的每个突起的顶部来制造键盘盖的键盘盖制造方法。

    Innovative Multi-Purpose Dipping Plate
    94.
    发明申请
    Innovative Multi-Purpose Dipping Plate 有权
    创新型多功能浸渍板

    公开(公告)号:US20140048586A1

    公开(公告)日:2014-02-20

    申请号:US13586132

    申请日:2012-08-15

    IPC分类号: B23K1/20 B23K3/08

    摘要: The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates.

    摘要翻译: 本公开涉及一种用于将焊剂应用于半导体工件的装置。 在一些实施例中,该装置包括具有适于容纳不同深度的助焊剂材料的储存器的浸渍板。 在一些实施例中,储存器包括具有形成第一和第二浸渍区域的侧壁的至少两个着陆区域。 所公开的装置可以允许将半导体工件浸入不同深度的焊剂中,而不需要改变浸渍板。

    Sigma-delta modulator having a feed-forward path and a hybrid portion
    96.
    发明授权
    Sigma-delta modulator having a feed-forward path and a hybrid portion 有权
    具有前馈路径和混合部分的Σ-Δ调制器

    公开(公告)号:US08552894B2

    公开(公告)日:2013-10-08

    申请号:US13450866

    申请日:2012-04-19

    IPC分类号: H03M3/00

    摘要: A sigma-delta modulator includes a front portion and a hybrid portion to form a loop filter. The front portion includes integrator(s) and feed-forward path(s), and is arranged to provide a front signal by combining signals of the integrator(s) and feed-forward path(s). The hybrid portion is coupled to the front portion, and arranged to provide a filtered signal by combining an integration of the front signal and a weighting of the front signal. The filtered signal is quantized, converted from digital to analog, and fed back to the loop filter.

    摘要翻译: Σ-Δ调制器包括前部和混合部分以形成环路滤波器。 前部包括积分器和前馈路径,并且被布置成通过组合积分器和前馈路径的信号来提供前信号。 混合部分耦合到前部,并且被布置成通过组合前信号的积分和前信号的加权来提供滤波信号。 经滤波的信号被量化,从数字转换为模拟,并反馈到环路滤波器。

    Lateral Diffused Metal-Oxide-Semiconductor Device
    98.
    发明申请
    Lateral Diffused Metal-Oxide-Semiconductor Device 有权
    侧向扩散金属氧化物半导体器件

    公开(公告)号:US20130168767A1

    公开(公告)日:2013-07-04

    申请号:US13342189

    申请日:2012-01-02

    IPC分类号: H01L27/06 H01L29/78

    摘要: The present invention provides a lateral diffused metal-oxide-semiconductor device including a first doped region, a second doped region, a third doped region, a gate structure, and a contact metal. The first doped region and the third doped region have a first conductive type, and the second doped region has a second conductive type. The second doped region, which has a racetrack-shaped layout, is disposed in the first doped region, and has a long axis. The third doped region is disposed in the second doped region. The gate structure is disposed on the first doped region and the second doped region at a side of the third doped region. The contact metal is disposed on the first doped region at a side of the second doped region extending out along the long axis, and is in contact with the first doped region.

    摘要翻译: 本发明提供了包括第一掺杂区,第二掺杂区,第三掺杂区,栅极结构和接触金属的横向扩散金属氧化物半导体器件。 第一掺杂区域和第三掺杂区域具有第一导电类型,并且第二掺杂区域具有第二导电类型。 具有跑道形状布局的第二掺杂区域设置在第一掺杂区域中并且具有长轴。 第三掺杂区域设置在第二掺杂区域中。 栅极结构设置在第一掺杂区域和第二掺杂区域的第三掺杂区域的一侧。 接触金属设置在沿着长轴延伸出的第二掺杂区域的一侧上的第一掺杂区域上,并与第一掺杂区域接触。

    HIGH VOLTAGE SEMICONDUCTOR DEVICE
    99.
    发明申请
    HIGH VOLTAGE SEMICONDUCTOR DEVICE 有权
    高电压半导体器件

    公开(公告)号:US20130126968A1

    公开(公告)日:2013-05-23

    申请号:US13299446

    申请日:2011-11-18

    IPC分类号: H01L29/78

    摘要: A high voltage semiconductor device is provided. A first-polarity buried layer is formed in the substrate. A first high voltage second-polarity well region is located over the first-polarity buried layer. A second-polarity base region is disposed within the first high voltage second-polarity well region. A source region is disposed within the second-polarity base region. A high voltage deep first-polarity well region is located over the first-polarity buried layer and closely around the first high voltage second-polarity well region. A first-polarity drift region is disposed within the high voltage deep first-polarity well region. A gate structure is disposed over the substrate. A second high voltage second-polarity well region is located over the first-polarity buried layer and closely around the high voltage deep first-polarity well region. A deep first-polarity well region is located over the first-polarity buried layer and closely around the second high voltage second-polarity well region.

    摘要翻译: 提供高压半导体器件。 在衬底中形成第一极性掩埋层。 第一高电压第二极性阱区位于第一极性掩埋层的上方。 第二极性基极区域设置在第一高电压第二极性阱区域内。 源极区域设置在第二极性基极区域内。 高电压深的第一极性极区位于第一极性埋层之上,紧邻第一高电压第二极性阱区。 第一极性漂移区域设置在高电压深第一极性阱区域内。 栅极结构设置在衬底上。 第二高电压第二极性阱区域位于第一极性掩埋层上方并且紧邻高电压深第一极性阱区域。 深第一极性阱区域位于第一极性掩埋层上并且紧邻第二高电压第二极性阱区域。

    CONNECTOR ASSEMBLY
    100.
    发明申请
    CONNECTOR ASSEMBLY 有权
    连接器总成

    公开(公告)号:US20130065423A1

    公开(公告)日:2013-03-14

    申请号:US13232947

    申请日:2011-09-14

    IPC分类号: H01R4/24

    摘要: The connector assembly for a printed circuit board includes a set of differential signal wires, a set of alternating current (AC) power wires, a ground wire, and a connector. The set of differential signal wires includes a plurality of signal wires, and each of the signal wires has an insulator and a conductor. The set of AC power wires includes a plurality of power wires, and each of the power wires has an insulator and a conductor. The connector includes an insulated shell and a plurality of conductive pins received therein, and each of the conductive pins has a nipper. An end of each of the set of differential signal wires and the set of AC power wires is electrically connected to the printed circuit board, and the other end thereof is electrically connected to the nipper.

    摘要翻译: 用于印刷电路板的连接器组件包括一组差分信号线,一组交流(AC)电力线,地线和连接器。 该组差分信号线包括多条信号线,并且每条信号线都具有绝缘体和导体。 该组交流电力线包括多条电源线,并且每条电力线具有绝缘体和导体。 连接器包括绝缘外壳和容纳在其中的多个导电针,并且每个导电针具有钳口。 所述差分信号线组和所述一组AC电源线的端部电连接到所述印刷电路板,并且其另一端电连接到所述钳口。