摘要:
A lamp module is provided. The lamp module includes a main body and a plurality of light emitting diodes. The light emitting diodes are disposed on the main body. Each light emitting diode emits a light to a illuminated region and form a corresponding light region. The light regions formed on the illuminated region by the light emitted by adjacent light emitting diodes are at least partially overlapped.
摘要:
An illumination device and a lens thereof are provided. The lens includes a surrounding sidewall, a light-incident surface, a light-incident structure, and a light-emitting surface. The surrounding sidewall includes two planar portions opposite to each other and two arc-surface portions opposite to each other to surround a reference axis. The light-incident surface is located at a side of the surrounding sidewall to receive a light emitted from a point light source. The light-incident structure located on the light-incident surface includes a plurality of bar-shaped protrusions. Each bar-shaped protrusion includes a plurality of first light-diffusing surfaces not parallel to the light-incident surface. The light-emitting surface is located at the other side of the surrounding sidewall and is opposite to the light-incident surface. The light-emitting surface is substantially circular. A cross-section area of the lens gradually increases from the light-incident surface to the light-emitting surface.
摘要:
A keyboard cover fabrication method for making a keyboard cover by processing a metal sheet material into a shaped metal component having protrusions and then cutting off a top part of each protrusion of the shaped metal component.
摘要:
The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates.
摘要:
A method for driving a liquid crystal display device provides sufficient charge time for a pixel unit by adjusting a main-charge time and a precharge time of the pixel unit according to the polarities of data driving signals applied during a main-charge period and a precharge period. Meanwhile, the method controls a write period during which a data driving signal is written into a pixel unit, so that each pixel unit can be equally charged.
摘要:
A sigma-delta modulator includes a front portion and a hybrid portion to form a loop filter. The front portion includes integrator(s) and feed-forward path(s), and is arranged to provide a front signal by combining signals of the integrator(s) and feed-forward path(s). The hybrid portion is coupled to the front portion, and arranged to provide a filtered signal by combining an integration of the front signal and a weighting of the front signal. The filtered signal is quantized, converted from digital to analog, and fed back to the loop filter.
摘要:
An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring. The bond head is configured to pick up dies and place the dies during the loops.
摘要:
The present invention provides a lateral diffused metal-oxide-semiconductor device including a first doped region, a second doped region, a third doped region, a gate structure, and a contact metal. The first doped region and the third doped region have a first conductive type, and the second doped region has a second conductive type. The second doped region, which has a racetrack-shaped layout, is disposed in the first doped region, and has a long axis. The third doped region is disposed in the second doped region. The gate structure is disposed on the first doped region and the second doped region at a side of the third doped region. The contact metal is disposed on the first doped region at a side of the second doped region extending out along the long axis, and is in contact with the first doped region.
摘要:
A high voltage semiconductor device is provided. A first-polarity buried layer is formed in the substrate. A first high voltage second-polarity well region is located over the first-polarity buried layer. A second-polarity base region is disposed within the first high voltage second-polarity well region. A source region is disposed within the second-polarity base region. A high voltage deep first-polarity well region is located over the first-polarity buried layer and closely around the first high voltage second-polarity well region. A first-polarity drift region is disposed within the high voltage deep first-polarity well region. A gate structure is disposed over the substrate. A second high voltage second-polarity well region is located over the first-polarity buried layer and closely around the high voltage deep first-polarity well region. A deep first-polarity well region is located over the first-polarity buried layer and closely around the second high voltage second-polarity well region.
摘要:
The connector assembly for a printed circuit board includes a set of differential signal wires, a set of alternating current (AC) power wires, a ground wire, and a connector. The set of differential signal wires includes a plurality of signal wires, and each of the signal wires has an insulator and a conductor. The set of AC power wires includes a plurality of power wires, and each of the power wires has an insulator and a conductor. The connector includes an insulated shell and a plurality of conductive pins received therein, and each of the conductive pins has a nipper. An end of each of the set of differential signal wires and the set of AC power wires is electrically connected to the printed circuit board, and the other end thereof is electrically connected to the nipper.