公开(公告)号：US20140048586A1

公开(公告)日：2014-02-20

申请号：US13586132

申请日：2012-08-15

申请人： Bor-Ping Jang ,  Lin-Wei Wang ,  Ying-Jui Huang ,  Yi-Li Hsiao ,  Chien Ling Hwang ,  Chung-Shi Liu

发明人： Bor-Ping Jang ,  Lin-Wei Wang ,  Ying-Jui Huang ,  Yi-Li Hsiao ,  Chien Ling Hwang ,  Chung-Shi Liu

IPC分类号： B23K1/20 ,  B23K3/08

CPC分类号： B23K1/0016 ,  B23K1/203 ,  B23K3/082 ,  B23K2101/40 ,  H05K3/3489

摘要： The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates.

摘要翻译： 本公开涉及一种用于将焊剂应用于半导体工件的装置。 在一些实施例中，该装置包括具有适于容纳不同深度的助焊剂材料的储存器的浸渍板。 在一些实施例中，储存器包括具有形成第一和第二浸渍区域的侧壁的至少两个着陆区域。 所公开的装置可以允许将半导体工件浸入不同深度的焊剂中，而不需要改变浸渍板。

公开(公告)号：US09700950B2

公开(公告)日：2017-07-11

申请号：US13586132

申请日：2012-08-15

申请人： Bor-Ping Jang ,  Lin-Wei Wang ,  Ying-Jui Huang ,  Yi-Li Hsiao ,  Chien Ling Hwang ,  Chung-Shi Liu

发明人： Bor-Ping Jang ,  Lin-Wei Wang ,  Ying-Jui Huang ,  Yi-Li Hsiao ,  Chien Ling Hwang ,  Chung-Shi Liu

IPC分类号： B23K1/20 ,  B23K3/08 ,  H05K3/38 ,  B23K1/00 ,  H05K3/34 ,  B23K101/40

CPC分类号： B23K1/0016 ,  B23K1/203 ,  B23K3/082 ,  B23K2101/40 ,  H05K3/3489

摘要： The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates.

公开(公告)号：US20130048027A1

公开(公告)日：2013-02-28

申请号：US13221673

申请日：2011-08-30

申请人： Yi-Li Hsiao ,  Bor-Ping Jang ,  Kuei-Wei Huang ,  Lin-Wei Wang ,  Chien Ling Hwang ,  Chung-Shi Liu

发明人： Yi-Li Hsiao ,  Bor-Ping Jang ,  Kuei-Wei Huang ,  Lin-Wei Wang ,  Chien Ling Hwang ,  Chung-Shi Liu

IPC分类号： B08B3/12

CPC分类号： B08B3/12 ,  B08B3/08 ,  H01L21/67028 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/8191 ,  H01L2924/014

摘要： A method includes generating a solvent-containing vapor that contains a solvent. The solvent-containing vapor is conducted to a package assembly to clean the package assembly. The solvent-containing vapor condenses to form a liquid on a surface of the package assembly, and flows off from the surface of the package assembly.

摘要翻译： 一种方法包括产生含有溶剂的含溶剂的蒸气。 将含溶剂的蒸气传导到包装组件以清洁包装组件。 含溶剂的蒸汽在包装组件的表面上冷凝形成液体，并从包装组件的表面流出。

公开(公告)号：US20130273717A1

公开(公告)日：2013-10-17

申请号：US13448648

申请日：2012-04-17

申请人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Bor-Ping Jang ,  Hsin-Hung Liao ,  Lin-Wei Wang ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Bor-Ping Jang ,  Hsin-Hung Liao ,  Lin-Wei Wang ,  Chung-Shi Liu

IPC分类号： H01L21/78 ,  B24B7/10 ,  B23K26/38 ,  B26D7/01

CPC分类号： B28D5/00 ,  B23K26/02 ,  B23K26/083 ,  B28D5/029 ,  H01L21/67092 ,  Y10T83/748

摘要： The present disclosure is directed to an apparatus for the singulation of a semiconductor substrate or wafer. In some embodiments the singulation apparatus comprises a plurality of cutting devices. The cutting devices are configured to form multiple concurrent cutting lines in parallel on a surface of the semiconductor wafer. In some embodiments, the singulation apparatus comprises at least two dicing saws or laser modules. The disclosed singulation apparatus can dice the semiconductor wafer into individual chips by dicing in a direction across a complete circumferential edge of the wafer, thereby decreasing process time and increasing throughput.

摘要翻译： 本公开涉及一种用于单个半导体衬底或晶片的装置。 在一些实施例中，分割装置包括多个切割装置。 切割装置被配置为在半导体晶片的表面上并行地形成多个并行切割线。 在一些实施例中，分割装置包括至少两个切割锯或激光模块。 所公开的分割装置可以通过在晶片的整个圆周边缘上的切割方式将半导体晶片切割成单独的芯片，从而减少处理时间并增加产量。

公开(公告)号：US08702871B2

公开(公告)日：2014-04-22

申请号：US13221673

申请日：2011-08-30

申请人： Yi-Li Hsiao ,  Bor-Ping Jang ,  Kuei-Wei Huang ,  Lin-Wei Wang ,  Chien Ling Hwang ,  Chung-Shi Liu

发明人： Yi-Li Hsiao ,  Bor-Ping Jang ,  Kuei-Wei Huang ,  Lin-Wei Wang ,  Chien Ling Hwang ,  Chung-Shi Liu

IPC分类号： B08B3/00 ,  B08B5/00

CPC分类号： B08B3/12 ,  B08B3/08 ,  H01L21/67028 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/8191 ,  H01L2924/014

摘要： A method includes generating a solvent-containing vapor that contains a solvent. The solvent-containing vapor is conducted to a package assembly to clean the package assembly. The solvent-containing vapor condenses to form a liquid on a surface of the package assembly, and flows off from the surface of the package assembly.

摘要翻译： 一种方法包括产生含有溶剂的含溶剂的蒸气。 将含溶剂的蒸气传导到包装组件以清洁包装组件。 含溶剂的蒸汽在包装组件的表面上冷凝形成液体，并从包装组件的表面流出。

公开(公告)号：US20120227886A1

公开(公告)日：2012-09-13

申请号：US13045365

申请日：2011-03-10

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang ,  Ying-Jui Huang

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang ,  Ying-Jui Huang

IPC分类号： B32B37/00 ,  B23B31/28 ,  H01L21/673 ,  B23K31/02

CPC分类号： H01L21/6833 ,  H01L21/67346 ,  Y10T29/49998 ,  Y10T156/10 ,  Y10T279/23

摘要： A portable electrostatic chuck carrier includes a holder having a dielectric top surface, and bipolar electrodes under the dielectric top surface. The bipolar electrodes includes positive electrodes and negative electrodes electrically insulated from the positive electrodes. The positive electrodes and the negative electrodes are allocated in an alternating pattern in a plane substantially parallel to the dielectric top surface.

摘要翻译： 便携式静电卡盘托架包括具有电介质顶表面的保持器和在电介质顶表面下方的双极电极。 双极电极包括与正极电绝缘的正极和负极。 正电极和负电极在基本上平行于电介质顶表面的平面中以交替图案分配。

公开(公告)号：US20130115752A1

公开(公告)日：2013-05-09

申请号：US13290855

申请日：2011-11-07

申请人： Chien Ling Hwang ,  Ying-Jui Huang ,  Yi-Li Hsiao

发明人： Chien Ling Hwang ,  Ying-Jui Huang ,  Yi-Li Hsiao

IPC分类号： H01L21/762 ,  B23K3/08 ,  B23K37/04

CPC分类号： H01L24/75 ,  H01L21/67144 ,  H01L2224/7501 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75754 ,  H01L2224/7598 ,  H01L2224/81815 ,  H01L2924/15311 ,  H01L2924/00014

摘要： An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring. The bond head is configured to pick up dies and place the dies during the loops

摘要翻译： 一种装置包括导向环和安装在引导环上的接合头。 结合头被构造成沿着导向环移动成环。 结合头被配置为拾取模具并且在回路期间放置模具

公开(公告)号：US08546802B2

公开(公告)日：2013-10-01

申请号：US13290855

申请日：2011-11-07

申请人： Chien Ling Hwang ,  Ying-Jui Huang ,  Yi-Li Hsiao

发明人： Chien Ling Hwang ,  Ying-Jui Huang ,  Yi-Li Hsiao

IPC分类号： H01L23/58 ,  H01L21/66

CPC分类号： H01L24/75 ,  H01L21/67144 ,  H01L2224/7501 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75754 ,  H01L2224/7598 ,  H01L2224/81815 ,  H01L2924/15311 ,  H01L2924/00014

摘要： An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring. The bond head is configured to pick up dies and place the dies during the loops.

公开(公告)号：US08679591B2

公开(公告)日：2014-03-25

申请号：US12891487

申请日：2010-09-27

申请人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu

IPC分类号： B05D1/18

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

摘要： An embodiment is a method for forming a semiconductor assembly including cleaning a connector including copper formed on a substrate, applying cold tin to the connector, applying hot tin to the connector, and spin rinsing and drying the connector.

摘要翻译： 一个实施例是一种用于形成半导体组件的方法，包括清洁在基板上形成的铜的连接器，向连接器施加冷锡，向连接器施加热锡，并旋转冲洗和干燥连接器。

公开(公告)号：US08668131B2

公开(公告)日：2014-03-11

申请号：US13031040

申请日：2011-02-18

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang

IPC分类号： B23K3/08 ,  B23K1/20

CPC分类号： B23K1/203 ,  B23K3/082

摘要： A flux dipping apparatus includes a flux plate having a top surface; and a dipping cavity in the flux plate and recessed from the top surface. A flux leveler is disposed over the flux plate and configured to move parallel to the top surface. A piezoelectric actuator is configured to adjust a distance between the flux leveler and the top surface in response to a controlling voltage applied to electrodes of the first piezoelectric actuator.

摘要翻译： 焊剂浸渍装置包括具有顶表面的焊剂板; 以及在焊剂板中的浸入腔并且从顶表面凹陷。 助熔剂矫正器设置在焊剂板上方并且被配置成平行于顶表面移动。 压电致动器被配置为响应于施加到第一压电致动器的电极的控制电压来调节通量调节器和顶表面之间的距离。