Innovative Multi-Purpose Dipping Plate
    1.
    发明申请
    Innovative Multi-Purpose Dipping Plate 有权
    创新型多功能浸渍板

    公开(公告)号:US20140048586A1

    公开(公告)日:2014-02-20

    申请号:US13586132

    申请日:2012-08-15

    IPC分类号: B23K1/20 B23K3/08

    摘要: The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates.

    摘要翻译: 本公开涉及一种用于将焊剂应用于半导体工件的装置。 在一些实施例中,该装置包括具有适于容纳不同深度的助焊剂材料的储存器的浸渍板。 在一些实施例中,储存器包括具有形成第一和第二浸渍区域的侧壁的至少两个着陆区域。 所公开的装置可以允许将半导体工件浸入不同深度的焊剂中,而不需要改变浸渍板。

    Apparatus and Method for the Singulation of a Semiconductor Wafer
    4.
    发明申请
    Apparatus and Method for the Singulation of a Semiconductor Wafer 审中-公开
    用于单晶半导体晶片的装置和方法

    公开(公告)号:US20130273717A1

    公开(公告)日:2013-10-17

    申请号:US13448648

    申请日:2012-04-17

    摘要: The present disclosure is directed to an apparatus for the singulation of a semiconductor substrate or wafer. In some embodiments the singulation apparatus comprises a plurality of cutting devices. The cutting devices are configured to form multiple concurrent cutting lines in parallel on a surface of the semiconductor wafer. In some embodiments, the singulation apparatus comprises at least two dicing saws or laser modules. The disclosed singulation apparatus can dice the semiconductor wafer into individual chips by dicing in a direction across a complete circumferential edge of the wafer, thereby decreasing process time and increasing throughput.

    摘要翻译: 本公开涉及一种用于单个半导体衬底或晶片的装置。 在一些实施例中,分割装置包括多个切割装置。 切割装置被配置为在半导体晶片的表面上并行地形成多个并行切割线。 在一些实施例中,分割装置包括至少两个切割锯或激光模块。 所公开的分割装置可以通过在晶片的整个圆周边缘上的切割方式将半导体晶片切割成单独的芯片,从而减少处理时间并增加产量。

    In-situ accuracy control in flux dipping
    10.
    发明授权
    In-situ accuracy control in flux dipping 有权
    焊剂浸渍中的原位精度控制

    公开(公告)号:US08668131B2

    公开(公告)日:2014-03-11

    申请号:US13031040

    申请日:2011-02-18

    IPC分类号: B23K3/08 B23K1/20

    CPC分类号: B23K1/203 B23K3/082

    摘要: A flux dipping apparatus includes a flux plate having a top surface; and a dipping cavity in the flux plate and recessed from the top surface. A flux leveler is disposed over the flux plate and configured to move parallel to the top surface. A piezoelectric actuator is configured to adjust a distance between the flux leveler and the top surface in response to a controlling voltage applied to electrodes of the first piezoelectric actuator.

    摘要翻译: 焊剂浸渍装置包括具有顶表面的焊剂板; 以及在焊剂板中的浸入腔并且从顶表面凹陷。 助熔剂矫正器设置在焊剂板上方并且被配置成平行于顶表面移动。 压电致动器被配置为响应于施加到第一压电致动器的电极的控制电压来调节通量调节器和顶表面之间的距离。